Chen; Tang-Yuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Tang-Yuan.The latest application filed is for "wiring structure".

Company Profile

12.10.13

Chen; Tang-Yuan - Kaohsiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring structure Grant 11,227,823 - Chen , et al. January 18, 2	2022-01-18
Semiconductor device package having continously formed tapered protrusions Grant 11,164,756 - Lu , et al. November 2, 2	2021-11-02
Wiring Structure App 20210327796 - CHEN; Tang-Yuan ; et al.	2021-10-21
Semiconductor Device Packages And Methods Of Manufacturing The Same App 20210288024 - CHEN; Tang-Yuan ; et al.	2021-09-16
Semiconductor Device Package And Method Of Manufacturing The Same App 20210280744 - CHEN; Tang-Yuan ; et al.	2021-09-09
Semiconductor device packages and methods of manufacturing the same Grant 11,011,496 - Chen , et al. May 18, 2	2021-05-18
Semiconductor Device Packages And Methods Of Manufacturing The Same App 20210074676 - CHEN; Tang-Yuan ; et al.	2021-03-11
Semiconductor Device Package And Method For Manufacturing The Same App 20200381338 - CHEN; Tang-Yuan ; et al.	2020-12-03
Semiconductor package structure and method for manufacturing the same Grant 10,840,219 - Chen , et al. November 17, 2	2020-11-17
Semiconductor device package Grant 10,770,369 - Hung , et al. Sep	2020-09-08
Semiconductor Device Package App 20200211863 - LU; Ying-Xu ; et al.	2020-07-02
Semiconductor device package Grant 10,586,716 - Lu , et al.	2020-03-10
Semiconductor Device Package App 20200066612 - HUNG; Chih-Pin ; et al.	2020-02-27
Semiconductor Package Structure And Method For Manufacturing The Same App 20190287947 - CHEN; Bo-Syun ; et al.	2019-09-19
Semiconductor package structure and method for manufacturing the same Grant 10,332,862 - Chen , et al.	2019-06-25
Semiconductor Package Structure And Method For Manufacturing The Same App 20190074264 - CHEN; Bo-Syun ; et al.	2019-03-07
Semiconductor device package having an underfill barrier Grant 10,217,649 - Lai , et al. Feb	2019-02-26
Semiconductor Device Package Having An Underfill Barrier App 20180358238 - LAI; Jin-Yuan ; et al.	2018-12-13
Semiconductor Device Package App 20180358237 - LU; Ying-Xu ; et al.	2018-12-13
Semiconductor package structure and method for manufacturing the same Grant 9,589,871 - Chen , et al. March 7, 2	2017-03-07
Interposer substrate, semiconductor structure and fabricating process thereof Grant 9,478,500 - Chen , et al. October 25, 2	2016-10-25
Semiconductor Package Structure And Method For Manufacturing The Same App 20160300782 - CHEN; Tang-Yuan ; et al.	2016-10-13
Interposer Substrate, Semiconductor Structure And Fabricating Process Thereof App 20160240481 - CHEN; Chia-Ching ; et al.	2016-08-18

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