CHEN; Sz-Fan
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHEN; Sz-Fan.The latest application filed is for "method for reducing charging of semiconductor wafers".
- CHEN; Sz-Fan - Kaohsiung City TW
- Chen; Sz-Fan - Hsinchu TW
- Chen; Sz-Fan - Kaohsiung TW
| Patent | Date |
|---|---|
| Method For Reducing Charging Of Semiconductor Wafers App 20220301849 - CHANG; Wei-Lin ; et al. | 2022-09-22 |
| Improving Surface Topography by Forming Spacer-Like Components App 20220199636 - Wu; Chun-Chang ; et al. | 2022-06-23 |
| Photolithography alignment process for bonded wafers Grant 11,362,038 - Lin , et al. June 14, 2 | 2022-06-14 |
| Surface topography by forming spacer-like components Grant 11,276,699 - Wu , et al. March 15, 2 | 2022-03-15 |
| Photolithography Alignment Process For Bonded Wafers App 20210375781 - Lin; Yeong-Jyh ; et al. | 2021-12-02 |
| Surface Topography by Forming Spacer-Like Components App 20200127000 - Wu; Chun-Chang ; et al. | 2020-04-23 |
| Surface topography by forming spacer-like components Grant 10,522,557 - Wu , et al. Dec | 2019-12-31 |
| Surface Topography By Forming Spacer-like Components App 20190131313 - Wu; Chun-Chang ; et al. | 2019-05-02 |
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