Chen; Sy-Hwa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Sy-Hwa.The latest application filed is for "apparatus for bonding external leads of an integrated circuit".

Company Profile

0.11.0

Chen; Sy-Hwa - Columbia SC
Chen; Sy-Hwa - Salt Lake City UT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus for bonding external leads of an integrated circuit Grant 5,359,170 - Chen , et al. October 25, 1	1994-10-25
Diamond having multiple coatings and methods for their manufacture Grant 5,224,969 - Chen , et al. * July 6, 1	1993-07-06
Cemented and cemented/sintered superabrasive polycrystalline bodies and methods of manufacture thereof Grant 5,151,107 - Cho , et al. September 29, 1	1992-09-29
Diamond having multiple coatings and methods for their manufacture Grant 5,126,207 - Chen , et al. June 30, 1	1992-06-30
Method for low pressure bonding of PCD bodies Grant 5,116,568 - Sung , et al. May 26, 1	1992-05-26
Diamond metal composite cutter and method for making same Grant 5,096,465 - Chen , et al. March 17, 1	1992-03-17
Chemically bonded superabrasive grit Grant 5,062,865 - Chen , et al. November 5, 1	1991-11-05
Low pressure bonding of PCD bodies and method Grant 5,030,276 - Sung , et al. July 9, 1	1991-07-09
Multiple metal coated superabrasive grit and methods for their manufacture Grant 5,024,680 - Chen , et al. June 18, 1	1991-06-18
Cemented and cemented/sintered superabrasive polycrystalline bodies and methods of manufacture thereof Grant 5,011,514 - Cho , et al. April 30, 1	1991-04-30
Low pressure bonding of PCD bodies and method for drill bits and the like Grant 4,943,488 - Sung , et al. July 24, 1	1990-07-24

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