Chen; Shyng-Tsong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Shyng-Tsong.The latest application filed is for "interconnect structures including self aligned vias".

Company Profile

11.60.60

Chen; Shyng-Tsong - Rensselaer NY
Chen; Shyng-Tsong - Armonk NY
Chen; Shyng-Tsong - Patterson NY
Chen; Shyng-Tsong - Albany NY US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Interconnect Structures Including Self Aligned Vias App 20220093453 - Yang; Chih-Chao ; et al.	2022-03-24
Interconnect integration scheme with fully self-aligned vias Grant 11,264,276 - Chen , et al. March 1, 2	2022-03-01
Double patterning interconnect integration scheme with SAV Grant 11,244,860 - Chen , et al. February 8, 2	2022-02-08
Embedded BEOL memory device with top electrode pillar Grant 11,239,421 - Kong , et al. February 1, 2	2022-02-01
Interconnect structures including self aligned vias Grant 11,227,792 - Yang , et al. January 18, 2	2022-01-18
Tight pitch via structures enabled by orthogonal and non-orthogonal merged vias Grant 11,189,566 - Shao , et al. November 30, 2	2021-11-30
Embedded BEOL Memory Device with Top Electrode Pillar App 20210234095 - Kong; Dexin ; et al.	2021-07-29
Resistive memory crossbar array with top electrode inner spacers Grant 11,038,104 - Ando , et al. June 15, 2	2021-06-15
Interconnect Integration Scheme With Fully Self-aligned Vias App 20210118733 - Chen; Shyng-Tsong ; et al.	2021-04-22
Double Patterning Interconnect Integration Scheme With Sav App 20210118732 - Chen; Shyng-Tsong ; et al.	2021-04-22
Interconnect Structures Including Self Aligned Vias App 20210090942 - Yang; Chih-Chao ; et al.	2021-03-25
Via design optimization to improve via resistance Grant 10,915,690 - Shao , et al. February 9, 2	2021-02-09
Surface modified dielectric refill structure Grant 10,886,168 - Yang , et al. January 5, 2	2021-01-05
Surface Modified Dielectric Refill Structure App 20200388524 - Yang; Chih-Chao ; et al.	2020-12-10
Via Design Optimization To Improve Via Resistance App 20200327208 - Shao; Dongbing ; et al.	2020-10-15
Interconnect Structures Containing Patternable Low-k Dielectrics And Anti-reflective Coatings And Method Of Fabricating The Same App 20200219765 - Chen; Shyng-Tsong ; et al.	2020-07-09
Resistive Memory Crossbar Array With Top Electrode Inner Spacers App 20200220078 - Ando; Takashi ; et al.	2020-07-09
Resistive memory crossbar array compatible with Cu metallization Grant 10,672,984 - Ando , et al.	2020-06-02
Resistive memory crossbar array with top electrode inner spacers Grant 10,672,980 - Ando , et al.	2020-06-02
Resistive Memory Crossbar Array Compatible With Cu Metallization App 20200028080 - Ando; Takashi ; et al.	2020-01-23
Resistive Memory Crossbar Array With Top Electrode Inner Spacers App 20200028076 - Ando; Takashi ; et al.	2020-01-23
Tight Pitch Via Structures Enabled By Orthogonal And Non-orthogonal Merged Vias App 20190318989 - Shao; Dongbing ; et al.	2019-10-17
Resistive memory crossbar array compatible with Cu metallization Grant 10,381,563 - Ando , et al. A	2019-08-13
Resistive memory crossbar array with top electrode inner spacers Grant 10,361,367 - Ando , et al.	2019-07-23
Via formation using sidewall image transfer process to define lateral dimension Grant 10,157,789 - Chen , et al. Dec	2018-12-18
Via Formation Using Sidewall Image Tranfer Process To Define Lateral Dimension App 20160358820 - Chen; Shyng-Tsong ; et al.	2016-12-08
Single damascene interconnect structure Grant 9,508,647 - Chen , et al. November 29, 2	2016-11-29
Via Formation Using Sidewall Image Transfer Process To Define Lateral Dimension App 20160336225 - Chen; Shyng-Tsong ; et al.	2016-11-17
Via formation using sidewall image transfer process to define lateral dimension Grant 9,490,168 - Chen , et al. November 8, 2	2016-11-08
Single Damascene Interconnect Structure App 20160071802 - Chen; Shyng-Tsong ; et al.	2016-03-10
Single damascene interconnect structure Grant 9,224,686 - Chen , et al. December 29, 2	2015-12-29
Profile control in interconnect structures Grant 9,105,641 - Chen , et al. August 11, 2	2015-08-11
Hardmask Faceting For Enhancing Metal Fill In Trenches App 20150221547 - Arnold; John C. ; et al.	2015-08-06
Profile Control In Interconnect Structures App 20150035154 - Chen; Shyng-Tsong ; et al.	2015-02-05
Titanium-Nitride Removal App 20140312265 - Chen; Shyng-Tsong ; et al.	2014-10-23
Titanium-nitride removal Grant 8,835,326 - Fitzsimmons , et al. September 16, 2	2014-09-16
Method of fabricating a profile control in interconnect structures Grant 8,835,305 - Yang , et al. September 16, 2	2014-09-16
Formation of air gap with protection of metal lines Grant 8,754,520 - Nogami , et al. June 17, 2	2014-06-17
Three photomask sidewall image transfer method Grant 8,716,133 - Chen , et al. May 6, 2	2014-05-06
Three Photomask Sidewall Image Transfer Method App 20140057436 - Chen; Shyng-Tsong ; et al.	2014-02-27
Profile Control In Interconnect Structures App 20140035142 - Yang; Chih-Chao ; et al.	2014-02-06
Self-aligned dual damascene BEOL structures with patternable low- K material and methods of forming same Grant 8,519,540 - Chen , et al. August 27, 2	2013-08-27
Titanium Nitride Removal App 20130200040 - Fitzsimmons; John A. ; et al.	2013-08-08
Titanium-Nitride Removal App 20130171829 - Fitzsimmons; John A. ; et al.	2013-07-04
Formation Of Air Gap With Protection Of Metal Lines App 20130134590 - Nogami; Takeshi ; et al.	2013-05-30
Interconnect structures with patternable low-k dielectrics and method of fabricating same Grant 8,450,854 - Lin , et al. May 28, 2	2013-05-28
Self-aligned dual damascene BEOL structures with patternable low-k material and methods of forming same Grant 8,415,248 - Chen , et al. April 9, 2	2013-04-09
Formation of air gap with protection of metal lines Grant 8,399,350 - Nogami , et al. March 19, 2	2013-03-19
Self-aligned Dual Damascene Beol Structures With Patternable Low- K Material And Methods Of Forming Same App 20120231622 - Chen; Shyng-Tsong ; et al.	2012-09-13
Method for fabricating back end of the line structures with liner and seed materials Grant 8,232,195 - Yang , et al. July 31, 2	2012-07-31
Interconnect structures with patternable low-k dielectrics and method of fabricating same Grant 8,084,862 - Lin , et al. December 27, 2	2011-12-27
Formation Of Air Gap With Protection Of Metal Lines App 20110193230 - Nogami; Takeshi ; et al.	2011-08-11
Via gouging methods and related semiconductor structure Grant 7,892,968 - Chen , et al. February 22, 2	2011-02-22
Self-aligned Dual Damascene Beol Structures With Patternable Low- K Material And Methods Of Forming Same App 20100314767 - Chen; Shyng-Tsong ; et al.	2010-12-16
Method of repairing process induced dielectric damage by the use of GCIB surface treatment using gas clusters of organic molecular species Grant 7,838,428 - Chen , et al. November 23, 2	2010-11-23
Interconnect Structures With Patternable Low-k Dielectrics And Method Of Fabricating Same App 20100283157 - Lin; Qinghuang ; et al.	2010-11-11
Surface treatment of inter-layer dielectric Grant 7,816,253 - Chen , et al. October 19, 2	2010-10-19
Interconnect With Recessed Dielectric Adjacent A Noble Metal Cap App 20100176514 - Yang; Chih-Chao ; et al.	2010-07-15
Interconnect with recessed dielectric adjacent a noble metal cap Grant 7,745,324 - Yang , et al. June 29, 2	2010-06-29
Enhanced mechanical strength via contacts Grant 7,671,470 - Yang , et al. March 2, 2	2010-03-02
Enhanced mechanical strength via contacts Grant 7,670,943 - Yang , et al. March 2, 2	2010-03-02
Metal capping process for BEOL interconnect with air gaps Grant 7,666,753 - Bonilla , et al. February 23, 2	2010-02-23
Via Gouging Methods And Related Semiconductor Structure App 20090184400 - Chen; Shyng-Tsong ; et al.	2009-07-23
Selective thin metal cap process Grant 7,514,361 - Bonilla , et al. April 7, 2	2009-04-07
Interconnect Structures With Patternable Low-k Dielectrics And Method Of Fabricating Same App 20090079075 - Lin; Qinghuang ; et al.	2009-03-26
Selective Thin Metal Cap Process App 20090053890 - Bonilla; Griselda ; et al.	2009-02-26
Metal resistor and resistor material Grant 7,479,869 - Yang , et al. January 20, 2	2009-01-20
Providing Gaps In Capping Layer To Reduce Tensile Stress For Beol Fabrication Of Integrated Circuits App 20080315347 - Bonilla; Griselda ; et al.	2008-12-25
Enhanced Mechanical Strength Via Contacts App 20080284030 - Yang; Chih-Chao ; et al.	2008-11-20
Enhanced Mechanical Strength Via Contacts App 20080280434 - YANG; CHIH-CHAO ; et al.	2008-11-13
Enhanced mechanical strength via contacts Grant 7,439,624 - Yang , et al. October 21, 2	2008-10-21
Method For Fabricating Back End Of The Line Structures With Liner And Seed Materials App 20080242082 - Yang; Chih-Chao ; et al.	2008-10-02
Back end of the line structures with liner and noble metal layer Grant 7,402,883 - Yang , et al. July 22, 2	2008-07-22
Metal Capping Process For Beol Interconnect With Air Gaps App 20080169565 - Bonilla; Griselda ; et al.	2008-07-17
Method Of Forming An Interconnect Structure App 20080146029 - Baks; Heidi Lee ; et al.	2008-06-19
Densifying Surface Of Porous Dielectric Layer Using Gas Cluster Ion Beam App 20080090402 - Bonilla; Griselda ; et al.	2008-04-17
Method of forming an interconnect structure Grant 7,358,182 - Baks , et al. April 15, 2	2008-04-15
Metal resistor, resistor material and method Grant 7,314,786 - Yang , et al. January 1, 2	2008-01-01
Metal Resistor, Resistor Material And Method App 20070293000 - Yang; Chih-Chao ; et al.	2007-12-20
Enhanced Mechanical Strength Via Contacts App 20070284736 - Yang; Chih-Chao ; et al.	2007-12-13
Method For Fabricating Back End Of The Line Structures With Liner And Seed Materials App 20070246792 - Yang; Chih-Chao ; et al.	2007-10-25
Method Of Repairing Process Induced Dielectric Damage By The Use Of Gcib Surface Treatment Using Gas Clusters Of Organic Molecular Species App 20070224824 - Chen; Shyng-Tsong ; et al.	2007-09-27
Surface Treatment Of Inter-layer Dielectric App 20070222081 - Chen; Shyng-Tsong ; et al.	2007-09-27
Method of forming an interconnect structure App 20070148966 - Baks; Heidi Lee ; et al.	2007-06-28
Selective capping of copper wiring Grant 7,190,079 - Andricacos , et al. March 13, 2	2007-03-13
Fiber embedded polishing pad Grant 7,186,166 - Chen , et al. March 6, 2	2007-03-06
Line level air gaps App 20060264036 - Chen; Shyng-Tsong ; et al.	2006-11-23
Line level air gaps Grant 7,084,479 - Chen , et al. August 1, 2	2006-08-01
Copper recess process with application to selective capping and electroless plating Grant 7,064,064 - Chen , et al. June 20, 2	2006-06-20
Surface Treatment Of Post-rie-damaged P-osg And Other Damaged Materials App 20060128163 - Chen; Shyng-Tsong ; et al.	2006-06-15
Fiber embedded polishing pad App 20060116059 - Chen; Shyng-Tsong ; et al.	2006-06-01
Selective capping of copper wiring App 20060076685 - Andricacos; Panayotis C. ; et al.	2006-04-13
Selective capping of copper wiring Grant 7,008,871 - Andricacos , et al. March 7, 2	2006-03-07
Polishing pads with polymer filled fibrous web, and methods for fabricating and using same Grant 6,989,117 - Chen , et al. January 24, 2	2006-01-24
Copper recess process with application to selective capping and electroless plating Grant 6,975,032 - Chen , et al. December 13, 2	2005-12-13
Fiber embedded polishing pad Grant 6,964,604 - Chen , et al. November 15, 2	2005-11-15
Copper recess process with application to selective capping and electroless plating App 20050158985 - Chen, Shyng-Tsong ; et al.	2005-07-21
Line level air gaps App 20050127514 - Chen, Shyng-Tsong ; et al.	2005-06-16
Fiber embedded polishing pad App 20050079805 - Chen, Shyng-Tsong ; et al.	2005-04-14
Selective capping of copper wiring App 20050001325 - Andricacos, Panayotis C. ; et al.	2005-01-06
Polishing pads with polymer filled fibrous web, and methods for fabricating and using same App 20040162013 - Chen, Shyng-Tsong ; et al.	2004-08-19
Improved Formation Of Porous Interconnection Layers App 20040130027 - Chen, Shyng-Tsong ; et al.	2004-07-08
Copper recess process with application to selective capping and electroless plating App 20040113279 - Chen, Shyng-Tsong ; et al.	2004-06-17
Fine-pitch device lithography using a sacrificial hardmask Grant 6,734,096 - Dalton , et al. May 11, 2	2004-05-11
Polishing pads with polymer filled fibrous web, and methods for fabricating and using same Grant 6,712,681 - Chen , et al. March 30, 2	2004-03-30
Grooved polishing pads and methods of use Grant 6,685,548 - Chen , et al. February 3, 2	2004-02-03
Grooved polishing pads and methods of use Grant 6,656,019 - Chen , et al. December 2, 2	2003-12-02
Grooved polishing pads and methods of use App 20030199234 - Chen, Shyng-Tsong ; et al.	2003-10-23
Fine-pitch device lithography using a sacrificial hardmask App 20030134505 - Dalton, Timothy J. ; et al.	2003-07-17
Stacked polish pad Grant 6,267,659 - Chen , et al. July 31, 2	2001-07-31