Chen-Shien; Chen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen-Shien; Chen.The latest application filed is for "structure and process for the formation of tsvs".

Company Profile

0.7.6

Chen-Shien; Chen - Zhubei N/A TW
Chen-Shien; Chen - Zhubei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Through-substrate via for semiconductor device Grant 8,703,609 - Kuo , et al. April 22, 2	2014-04-22
Structure and process for the formation of TSVs Grant 8,456,008 - Kuo , et al. June 4, 2	2013-06-04
Structure and Process for the Formation of TSVs App 20120001334 - Kuo; Chen-Cheng ; et al.	2012-01-05
Through-substrate Via For Semiconductor Device App 20110263120 - Kuo; Chen-Cheng ; et al.	2011-10-27
Through-substrate via for semiconductor device Grant 7,973,413 - Kuo , et al. July 5, 2	2011-07-05
Structure and Process for the Formation of TSVs App 20110034027 - Kuo; Chen-Cheng ; et al.	2011-02-10
Structure and process for the formation of TSVs Grant 7,843,064 - Kuo , et al. November 30, 2	2010-11-30
Semiconductor structure with a discontinuous material density for reducing eddy currents Grant 7,557,423 - Ching , et al. July 7, 2	2009-07-07
Structure and process for the formation of TSVs App 20090160058 - Kuo; Chen-Cheng ; et al.	2009-06-25
Semiconductor Structure with a Discontinuous Material Density for Reducing Eddy Currents App 20090057823 - Ching; Kai Ming ; et al.	2009-03-05
Through-substrate Via For Semiconductor Device App 20090051039 - Kuo; Chen-Cheng ; et al.	2009-02-26

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