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Illumination System And Projection Apparatus
App 20210247677 - Chen; Shang-Wei ; et al. | 2021-08-12 |
Printed circuit board stack structure and method of forming the same
Grant 10,952,325 - Hsieh , et al. March 16, 2 | 2021-03-16 |
Printed Circuit Board Stack Structure And Method Of Forming The Same
App 20200329562 - Hsieh; Ching-Ho ; et al. | 2020-10-15 |
Transfer printing apparatus and manufacturing method of light guiding film
Grant 9,776,360 - Yang , et al. October 3, 2 | 2017-10-03 |
Light guide plate and backlight module using the same
Grant 9,329,328 - Chen , et al. May 3, 2 | 2016-05-03 |
Transfer Printing Apparatus And Manufacturing Method Of Light Guiding Film
App 20140349027 - Yang; Ching-Tang ; et al. | 2014-11-27 |
Light Guide Plate And Backlight Module Using The Same
App 20130286679 - Chen; Shang-Wei ; et al. | 2013-10-31 |
Carrier board structure with embedded semiconductor chip and fabrication method thereof
Grant 8,354,338 - Hu , et al. January 15, 2 | 2013-01-15 |
Circuit board with identifiable information and method for fabricating the same
Grant 8,070,932 - Hsu , et al. December 6, 2 | 2011-12-06 |
Packaging substrate structure with a semiconductor chip embedded therein
Grant 8,035,127 - Chia , et al. October 11, 2 | 2011-10-11 |
Circuit board structure embedded with semiconductor chips
Grant 7,863,729 - Hsu , et al. January 4, 2 | 2011-01-04 |
Circuit board structure with embedded semiconductor chip and method for fabricating the same
Grant 7,719,104 - Hsu , et al. May 18, 2 | 2010-05-18 |
Plate structure having chip embedded therein and the manufacturing method of the same
Grant 7,598,610 - Hsu , et al. October 6, 2 | 2009-10-06 |
Circuit Board Structure Embedded With Semiconductor Chips
App 20090200658 - HSU; Shih Ping ; et al. | 2009-08-13 |
Package on package structure
App 20090102039 - Hsu; Shih-Ping ; et al. | 2009-04-23 |
Packaging substrate structure having semiconductor chip embedded therein and fabricating method thereof
App 20090085192 - Hsu; Shih-Ping ; et al. | 2009-04-02 |
Packaging Substrate Having Chip Embedded Therein And Manufacturing Method Thereof
App 20090032930 - Hsu; Shih-Ping ; et al. | 2009-02-05 |
Structure of semiconductor chip and package structure having semiconductor chip embedded therein
App 20080251915 - HSU; Shih-Ping ; et al. | 2008-10-16 |
Semiconductor Chip Embedding Structure
App 20080237836 - Chia; Kan-Jung ; et al. | 2008-10-02 |
Carrier plate structure havign a chip embedded therein and the manufacturing method of the same
App 20080185704 - Hsu; Shih-Ping ; et al. | 2008-08-07 |
Plate structure having chip embedded therein and the manufacturing method of the same
App 20080164597 - Hsu; Shih-Ping ; et al. | 2008-07-10 |
Circuit board with identifiable information and method for fabricating the same
App 20080166497 - Hsu; Shih-Ping ; et al. | 2008-07-10 |
Circuit Board Structure With Embedded Semiconductor Chip
App 20080142951 - Hsu; Shih-Ping ; et al. | 2008-06-19 |
Method For Fabricating Circuit Board Structure With Embedded Semiconductor Chip
App 20080145975 - Hsu; Shih-Ping ; et al. | 2008-06-19 |
Circuit Board Structure With Embedded Semiconductor Chip And Method For Fabricating The Same
App 20080116565 - HSU; Shih-Ping ; et al. | 2008-05-22 |
Circuit board with identifiable information and method for fabricating the same
Grant 7,365,272 - Hsu , et al. April 29, 2 | 2008-04-29 |
Carrier Board Structure With Embedded Semiconductor Chip And Fabrication Method Thereof
App 20080029895 - HU; Chu-Chin ; et al. | 2008-02-07 |
Plate structure having chip embedded therein and the manufacturing method of the same
App 20080029872 - Hsu; Shih-Ping ; et al. | 2008-02-07 |
Carrier Board Structure With Chip Embedded Therein And Method For Fabricating The Same
App 20070241444 - HSU; Shih-Ping ; et al. | 2007-10-18 |
Circuit board structure embedded with semiconductor chips
App 20070181995 - Hsu; Shih Ping ; et al. | 2007-08-09 |
Silver alloy used in an organic electroluminescent panel
Grant 7,208,870 - Chang , et al. April 24, 2 | 2007-04-24 |
Semiconductor device with electroless plating metal connecting layer and method for fabricating the same
App 20070085205 - Chen; Shang-Wei ; et al. | 2007-04-19 |
Wafer structure with electroless plating metal connecting layer and method for fabricating the same
App 20070087547 - Chen; Shang Wei ; et al. | 2007-04-19 |
Method for reading an IC tag concealing part of data
App 20060125606 - Chen; Shang-Wei ; et al. | 2006-06-15 |
High performance RFID system and operating method thereof
App 20060114102 - Chang; Shao-Chang ; et al. | 2006-06-01 |
Circuit board with identifiable information and method for fabricating the same
App 20050236176 - Hsu, Shih-Ping ; et al. | 2005-10-27 |
Package structure of organic electroluminescence panel
Grant 6,858,874 - Wu , et al. February 22, 2 | 2005-02-22 |
Process of packaging organic electroluminescent panel
Grant 6,846,687 - Wu , et al. January 25, 2 | 2005-01-25 |
[package Structure Of Organic Electroluminescence Panel]
App 20040251045 - WU, CHIN-LONG ; et al. | 2004-12-16 |
Silver alloy used in an organic electroluminescent panel
App 20040140760 - Chang, Yih ; et al. | 2004-07-22 |
Process of packaging organic electroluminescent panel
App 20040123455 - Wu, Chin-Long ; et al. | 2004-07-01 |
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