loadpatents
name:-0.014179944992065
name:-0.015156984329224
name:-0.00053715705871582
Chen; Roawen Patent Filings

Chen; Roawen

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Roawen.The latest application filed is for "package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate".

Company Profile
0.16.10
  • Chen; Roawen - San Jose CA
  • Chen; Roawen - San Diego CA
  • Chen; Roawen - Monte Sereno CA US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
Grant 9,768,144 - Wu , et al. September 19, 2
2017-09-19
Half node scaling for vertical structures
Grant 9,478,541 - Song , et al. October 25, 2
2016-10-25
Recessed semiconductor substrates and associated techniques
Grant 9,391,045 - Wu , et al. July 12, 2
2016-07-12
Package Assembly Including A Semiconductor Substrate In Which A First Portion Of A Surface Of The Semiconductor Substrate Is Recessed Relative To A Second Portion Of The Surface Of The Semiconductor Substrate To Form A Recessed Region In The Semiconductor Substrate
App 20160155732 - Wu; Albert ;   et al.
2016-06-02
Half Node Scaling For Vertical Structures
App 20160071847 - SONG; Stanley Seungchul ;   et al.
2016-03-10
Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate
Grant 9,257,410 - Wu , et al. February 9, 2
2016-02-09
Recessed Semiconductor Substrates And Associated Techniques
App 20150279806 - Wu; Albert ;   et al.
2015-10-01
Recessed semiconductor substrates and associated techniques
Grant 9,034,730 - Wu , et al. May 19, 2
2015-05-19
Solid-state disk with wireless functionality
Grant 8,935,464 - Sutardja , et al. January 13, 2
2015-01-13
Low Cost Interposer Comprising An Oxidation Layer
App 20140306349 - Gu; Shiqun ;   et al.
2014-10-16
Techniques And Configurations For Recessed Semiconductor Substrates
App 20140124961 - WU; Albert ;   et al.
2014-05-08
Solid-state disk with wireless functionality
Grant 8,719,485 - Sutardja , et al. May 6, 2
2014-05-06
Method for fabricating 1T-DRAM on bulk silicon
Grant 8,008,137 - Wu , et al. August 30, 2
2011-08-30
Recessed Semiconductor Substrates
App 20110186998 - Wu; Albert ;   et al.
2011-08-04
Techniques And Configurations For Recessed Semiconductor Substrates
App 20110186960 - Wu; Albert ;   et al.
2011-08-04
Recessed Semiconductor Substrates And Associated Techniques
App 20110186992 - Wu; Albert ;   et al.
2011-08-04
Methods of making and using fuse structures, and integrated circuits including the same
Grant 7,820,493 - Cheng , et al. October 26, 2
2010-10-26
Fuse structures, methods of making and using the same, and integrated circuits including the same
Grant 7,704,805 - Cheng , et al. April 27, 2
2010-04-27
Solid-state Disk With Wireless Functionality
App 20090327588 - Sutardja; Sehat ;   et al.
2009-12-31
Fuse structures, methods of making and using the same, and integrated circuits including the same
Grant 7,589,363 - Cheng , et al. September 15, 2
2009-09-15
Fuse structures, methods of making and using the same, and integrated circuits including the same
Grant 7,344,924 - Cheng , et al. March 18, 2
2008-03-18
Method For Fabricating 1t-dram On Bulk Silicon
App 20070215906 - Wu; Albert ;   et al.
2007-09-20
Fuse structures, methods of making and using the same, and integrated circuits including the same
Grant 6,940,107 - Cheng , et al. September 6, 2
2005-09-06

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