Chen; Pei-Hung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Pei-Hung.The latest application filed is for "decreasing neural network inference times using softmax approximation".

Company Profile

2.14.5

Chen; Pei-Hung - Taichung TW
Chen; Pei-Hung - Los Angeles CA
Chen; Pei-Hung - Hsinchu TW
Chen; Pei-Hung - Hsinchu City TW
Chen; Pei-Hung - Hsin Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Core for food products mold Grant D956,488 - Chen July 5, 2	2022-07-05
Decreasing neural network inference times using softmax approximation Grant 10,671,909 - Li , et al.	2020-06-02
Decreasing Neural Network Inference Times Using Softmax Approximation App 20200104686 - Li; Yang ; et al.	2020-04-02
Aqueous cleaning techniques and compositions for use in semiconductor device manufacture Grant 9,728,533 - Chou , et al. August 8, 2	2017-08-08
Aqueous Cleaning Techniques And Compositions For Use In Semiconductor Device Manufacture App 20150108578 - Chou; Chun-Li ; et al.	2015-04-23
Aqueous cleaning techniques and compositions for use in semiconductor device manufacturing Grant 8,916,429 - Chou , et al. December 23, 2	2014-12-23
Aqueous Cleaning Techniques and Compositions for use in Semiconductor Device Manufacturing App 20130288436 - Chou; Chun-Li ; et al.	2013-10-31
Approach to improve ellipsometer modeling accuracy for solving material optical constants N & K Grant 7,259,850 - Ke , et al. August 21, 2	2007-08-21
Approach to improve ellipsometer modeling accuracy for solving material optical constants N & K App 20050151969 - Ke, Chih-Ming ; et al.	2005-07-14
Method for testing for blind hole formed in wafer layer Grant 6,642,150 - Huang , et al. November 4, 2	2003-11-04
Plasma etch method for forming patterned layer with enhanced critical dimension (CD) control Grant 6,350,390 - Liu , et al. February 26, 2	2002-02-26
Process to season and determine condition of a high density plasma etcher Grant 6,267,121 - Huang , et al. July 31, 2	2001-07-31
Method of metal etching with in-situ plasma cleaning Grant 6,214,739 - Huang , et al. April 10, 2	2001-04-10
Post metal code engineering for a ROM Grant 6,020,241 - You , et al. February 1, 2	2000-02-01
Oxidation method for removing fluorine gas inside polysilicon during semiconductor manufacturing to prevent delamination of subsequent layer induced by fluorine outgassing dielectric Grant 5,811,343 - Wann , et al. September 22, 1	1998-09-22
Method for preventing fluorine outgassing-induced interlevel dielectric delamination on P-channel FETS Grant 5,753,548 - Yu , et al. May 19, 1	1998-05-19
Method for preventing delamination of interlevel dielectric layer over FET P.sup.+ doped polysilicon gate electrodes on semiconductor integrated circuits Grant 5,707,896 - Chiang , et al. January 13, 1	1998-01-13

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