Chen; Nan-Cheng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Nan-Cheng.The latest application filed is for "antenna-in-package with frequency-selective surface structure".
Company Profile
10.28.43
- Chen; Nan-Cheng - Hsin-Chu City TW
- Chen; Nan-Cheng - Hsinchu TW
- Chen; Nan-Cheng - Hsin-Chu TW
- Chen; Nan-Cheng - Hsinchu City TW
- Chen; Nan-Cheng - Taipei TW
Patent Activity
| Patent | Date |
|---|---|
| Antenna-in-package With Frequency-selective Surface Structure App 20220302574 - Chiu; Shih-Chia ; et al. | 2022-09-22 |
| Semiconductor package with layer structures, antenna layer and electronic component Grant 11,373,957 - Hsu , et al. June 28, 2 | 2022-06-28 |
| Antenna-in-package with frequency-selective surface structure Grant 11,322,823 - Chiu , et al. May 3, 2 | 2022-05-03 |
| Semiconductor Package Using Flip-chip Technology App 20210202425 - Chou; Che-Ya ; et al. | 2021-07-01 |
| Semiconductor Device App 20210193540 - Chen; Nan-Cheng ; et al. | 2021-06-24 |
| Semiconductor package using flip-chip technology Grant 10,991,669 - Chou , et al. April 27, 2 | 2021-04-27 |
| Semiconductor Package Having Discrete Antenna Device App 20210036405 - Han; Fu-Yi ; et al. | 2021-02-04 |
| Semiconductor Package App 20200381365 - HSU; Wen-Sung ; et al. | 2020-12-03 |
| Semiconductor package having discrete antenna device Grant 10,847,869 - Han , et al. November 24, 2 | 2020-11-24 |
| Semiconductor package Grant 10,784,206 - Hsu , et al. Sept | 2020-09-22 |
| Over the air wireless test system for testing microelectronic devices integrated with antenna Grant 10,680,727 - Lu , et al. | 2020-06-09 |
| Fan-out package structure having stacked carrier substrates and method for forming the same Grant 10,515,887 - Syu , et al. Dec | 2019-12-24 |
| Electronic Package For High-data Rate Communication Applications App 20190355697 - Lin; Min-Chen ; et al. | 2019-11-21 |
| Antenna-in-package With Frequency-selective Surface Structure App 20190115646 - Chiu; Shih-Chia ; et al. | 2019-04-18 |
| Over The Air Wireless Test System For Testing Microelectronic Devices Integrated With Antenna App 20190068300 - Lu; Yen-Ju ; et al. | 2019-02-28 |
| Semiconductor Package App 20190051609 - HSU; Wen-Sung ; et al. | 2019-02-14 |
| Semiconductor Package Having Discrete Antenna Device App 20180358685 - Han; Fu-Yi ; et al. | 2018-12-13 |
| Fan-out package structure Grant 10,128,192 - Lin , et al. November 13, 2 | 2018-11-13 |
| Semiconductor package incorporating redistribution layer interposer Grant 10,103,128 - Chou , et al. October 16, 2 | 2018-10-16 |
| Semiconductor Device App 20180102298 - Chen; Nan-Cheng ; et al. | 2018-04-12 |
| Fan-out Package Structure Having Stacked Carrier Substrates And Method For Forming The Same App 20180082936 - SYU; Shih-Yi ; et al. | 2018-03-22 |
| Pre-bumped Redistribution Layer Structure And Semiconductor Package Incorporating Such Pre-bumped Redistribution Layer Structure App 20180053665 - Kuo; Che-Hung ; et al. | 2018-02-22 |
| Fan-out Package Structure App 20180025985 - LIN; Min-Chen ; et al. | 2018-01-25 |
| Layout method for printed circuit board Grant 9,846,756 - Pan , et al. December 19, 2 | 2017-12-19 |
| Semiconductor Package Incorporating Redistribution Layer Interposer App 20170243858 - Chou; Che-Ya ; et al. | 2017-08-24 |
| Printed circuit board for mobile platforms Grant 9,674,941 - Chang , et al. June 6, 2 | 2017-06-06 |
| Semiconductor Package Using Flip-chip Technology App 20160358877 - CHOU; Che-Ya ; et al. | 2016-12-08 |
| Semiconductor package assembly with decoupling capacitor Grant 9,331,054 - Chang , et al. May 3, 2 | 2016-05-03 |
| System-in-package App 20160005726 - Chen; Nan-Cheng ; et al. | 2016-01-07 |
| Layout Method For Printed Circuit Board App 20150379184 - PAN; Fu-Kang ; et al. | 2015-12-31 |
| Layout Method For Printed Circuit Board App 20150379180 - PAN; Fu-Kang ; et al. | 2015-12-31 |
| Printed Circuit Board For Mobile Platforms App 20150342038 - CHANG; Sheng-Ming ; et al. | 2015-11-26 |
| Fan-out semiconductor package with copper pillar bumps Grant 9,165,877 - Chen , et al. October 20, 2 | 2015-10-20 |
| Layout method for printed circuit board Grant 9,158,880 - Pan , et al. October 13, 2 | 2015-10-13 |
| Printed circuit board for mobile platforms Grant 9,131,602 - Chang , et al. September 8, 2 | 2015-09-08 |
| Fan-out Semiconductor Package With Copper Pillar Bumps App 20150097277 - Chen; Nan-Cheng ; et al. | 2015-04-09 |
| Semiconductor Package Assembly App 20140264812 - CHANG; Sheng-Ming ; et al. | 2014-09-18 |
| Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof Grant 8,749,038 - Huang , et al. June 10, 2 | 2014-06-10 |
| Layout Method For Printed Circuit Board App 20140109035 - PAN; Fu-Kang ; et al. | 2014-04-17 |
| Chip Package App 20130277801 - CHEN; Nan-Cheng ; et al. | 2013-10-24 |
| Leadframe package for high-speed data rate applications Grant 8,525,310 - Chen , et al. September 3, 2 | 2013-09-03 |
| Printed Circuit Board For Mobile Platforms App 20130220690 - CHANG; Sheng-Ming ; et al. | 2013-08-29 |
| Surface Mount Technology Process For Advanced Quad Flat No-lead Package Process And Stencil Used Therewith App 20130133193 - Hsu; Chih-Tai ; et al. | 2013-05-30 |
| Package-on-package with fan-out WLCSP Grant 8,310,051 - Chen , et al. November 13, 2 | 2012-11-13 |
| Quad flat package with exposed common electrode bars Grant 8,283,757 - Chen , et al. October 9, 2 | 2012-10-09 |
| Package-on-package With Fan-out Wlcsp App 20120032314 - Chen; Nan-Cheng ; et al. | 2012-02-09 |
| System-in-package with fan-out WLCSP Grant 8,093,722 - Chen , et al. January 10, 2 | 2012-01-10 |
| QFN semiconductor package Grant 8,044,496 - Hsieh , et al. October 25, 2 | 2011-10-25 |
| QFN semiconductor package Grant 8,039,933 - Hsieh , et al. October 18, 2 | 2011-10-18 |
| Method for fabricating QFN semiconductor package Grant 8,039,319 - Hsieh , et al. October 18, 2 | 2011-10-18 |
| Leadframe Package For High-speed Data Rate Applications App 20110248394 - Chen; Nan-Jang ; et al. | 2011-10-13 |
| Qfn Semiconductor Package And Circuit Board Structure Adapted For The Same App 20110042794 - Hsieh; Tung-Hsien ; et al. | 2011-02-24 |
| System-in-package With Fan-out Wlcsp App 20110031619 - Chen; Nan-Cheng ; et al. | 2011-02-10 |
| Flip-chip package with fan-out WLCSP Grant 7,838,975 - Chen November 23, 2 | 2010-11-23 |
| Qfn Semiconductor Package App 20100283136 - Hsieh; Tung-Hsien ; et al. | 2010-11-11 |
| Method For Fabricating Qfn Semiconductor Package App 20100285638 - Hsieh; Tung-Hsien ; et al. | 2010-11-11 |
| Qfn Semiconductor Package App 20100283137 - Hsieh; Tung-Hsien ; et al. | 2010-11-11 |
| QFN Semiconductor package Grant 7,786,557 - Hsieh , et al. August 31, 2 | 2010-08-31 |
| Wire Bond Chip Package App 20100213588 - Hsieh; Tung-Hsien ; et al. | 2010-08-26 |
| Quad Flat Package With Exposed Common Electrode Bars App 20100207260 - Chen; Nan-Cheng ; et al. | 2010-08-19 |
| Flip-chip Package With Fan-out Wlcsp App 20090294938 - Chen; Nan-Cheng | 2009-12-03 |
| Qfn Semiconductor Package And Fabrication Method Thereof App 20090283882 - Hsieh; Tung-Hsien ; et al. | 2009-11-19 |
| Electronic Devices With Enhanced Heat Spreading App 20090236707 - Chen; Nan-Cheng ; et al. | 2009-09-24 |
| Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof App 20090190706 - Huang; Chung-Er ; et al. | 2009-07-30 |
| Memory controllers and pad sequence control methods thereof Grant 7,561,481 - Chen , et al. July 14, 2 | 2009-07-14 |
| Quad Flat Package With Exposed Common Electrode Bars App 20090020859 - CHEN; Nan-Cheng ; et al. | 2009-01-22 |
| Memory Controllers And Pad Sequence Control Methods Thereof App 20080304352 - Chen; Nan-Cheng ; et al. | 2008-12-11 |
| Electronic Devices With Enhanced Heat Spreading App 20080080142 - Chen; Nan-Cheng ; et al. | 2008-04-03 |
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