loadpatents
Patent applications and USPTO patent grants for Chen; Ming-Yao.The latest application filed is for "sensing device substrate and display apparatus having the same".
Patent | Date |
---|---|
Display device for in-screen fingerprint identification Grant 11,450,137 - Chen , et al. September 20, 2 | 2022-09-20 |
Display apparatus Grant 11,444,113 - Chen , et al. September 13, 2 | 2022-09-13 |
Sensing Device Substrate And Display Apparatus Having The Same App 20220067323 - Chen; Ming-Yao ;   et al. | 2022-03-03 |
Display Device App 20220036030 - Chen; Ming-Yao ;   et al. | 2022-02-03 |
Display panel Grant 11,175,555 - Chen , et al. November 16, 2 | 2021-11-16 |
Active device substrate and manufacturing method thereof Grant 11,127,808 - Chen , et al. September 21, 2 | 2021-09-21 |
Pixel array substrate Grant 11,086,452 - Chen , et al. August 10, 2 | 2021-08-10 |
Pixel array substrate Grant 11,037,504 - Chen , et al. June 15, 2 | 2021-06-15 |
Pixel Array Substrate App 20210157441 - Chen; Ming-Yao ;   et al. | 2021-05-27 |
Pixel Array Substrate App 20210142731 - Chen; Ming-Yao ;   et al. | 2021-05-13 |
Display Apparatus App 20210134866 - Chen; Ming-Yao ;   et al. | 2021-05-06 |
Pixel array substrate Grant 10,811,441 - Chen , et al. October 20, 2 | 2020-10-20 |
Pixel Array Substrate App 20200152662 - Chen; Ming-Yao ;   et al. | 2020-05-14 |
Active Device Substrate And Manufacturing Method Thereof App 20200105857 - Chen; Ming-Yao ;   et al. | 2020-04-02 |
Display Panel App 20190339554 - CHEN; Ming-Yao ;   et al. | 2019-11-07 |
Array substrate Grant 9,064,749 - Chen , et al. June 23, 2 | 2015-06-23 |
Array Substrate App 20150048367 - Chen; Ming-Yao ;   et al. | 2015-02-19 |
Array substrate and manufacturing method thereof Grant 8,900,900 - Chen , et al. December 2, 2 | 2014-12-02 |
Array Substrate And Manufacturing Method Thereof App 20140138714 - Chen; Ming-Yao ;   et al. | 2014-05-22 |
Liquid Crystal Display Having A High Aperture Ratio App 20130099238 - Chen; Ming-Yao ;   et al. | 2013-04-25 |
Semiconductor chip having TSV (through silicon via) and stacked assembly including the chips Grant 7,838,967 - Chen November 23, 2 | 2010-11-23 |
Core-shell structure with magnetic, thermal, and optical characteristics and manufacturing method thereof Grant 7,700,193 - Chen , et al. April 20, 2 | 2010-04-20 |
Semiconductor Chip Having Tsv (through Silicon Via) And Stacked Assembly Including The Chips App 20090267194 - CHEN; Ming-Yao | 2009-10-29 |
Bond quality indication by bump structure on substrate Grant 7,449,716 - Chen , et al. November 11, 2 | 2008-11-11 |
Bump Structure On Substrate App 20080197352 - Chen; Ming-Yao ;   et al. | 2008-08-21 |
Fluorescent magnetic nanoparticles with specific targeting functions App 20070148095 - Chen; Ming-Yao ;   et al. | 2007-06-28 |
Core-shell structure with magnetic, thermal, and optical characteristics and manufacturing method thereof App 20060228551 - Chen; Ming-Yao ;   et al. | 2006-10-12 |
Method for forming superparamagnetic nanoparticles App 20060141149 - Chen; Ming-Yao ;   et al. | 2006-06-29 |
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