Chen; Ming-Ru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Ming-Ru.The latest application filed is for "metal bump structure and manufacturing method thereof and driving substrate".
- Chen; Ming-Ru - Hsinchu City TW
- Chen; Ming-Ru - Hsinchu TW
| Patent | Date |
|---|---|
| Metal Bump Structure And Manufacturing Method Thereof And Driving Substrate App 20220238471 - Tseng; Tzyy-Jang ; et al. | 2022-07-28 |
| Manufacturing Method Of Light Emitting Diode Package Structure App 20220231004 - Chen; Ming-Ru ; et al. | 2022-07-21 |
| Light emitting diode package structure and manufacturing method thereof Grant 11,335,670 - Chen , et al. May 17, 2 | 2022-05-17 |
| Circuit Board Structure And Manufacturing Method Thereof App 20220071010 - TSENG; Tzyy-Jang ; et al. | 2022-03-03 |
| Light Emitting Diode Package Structure And Manufacturing Method Thereof App 20210327861 - Chen; Ming-Ru ; et al. | 2021-10-21 |
| Carbon Nanotube Field Emitting Display App 20070222354 - Chen; Ming-Ru | 2007-09-27 |
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