Chen; Meng-Huei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Meng-Huei.The latest application filed is for "halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same".

Company Profile

3.16.19

Chen; Meng-Huei - Chupei TW
CHEN; Meng-Huei - Chupei City TW
Chen; Meng-Huei - Kaohsiung County N/A TW
CHEN; Meng-Huei - Gangshan Township TW
Chen; Meng-Huei - Hsinchu County TW
Chen; Meng-Huei - Hsinchu TW
Chen; Meng-Huei - Kaohsiung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same Grant 11,124,614 - Liu , et al. September 21, 2	2021-09-21
Resin composition and uses of the same Grant 10,793,716 - Chen , et al. October 6, 2	2020-10-06
Resin composition and uses of the same Grant 10,774,216 - Liu , et al. Sept	2020-09-15
Resin composition, and prepreg, metal-clad laminate, and printed circuit board using the same Grant 10,689,512 - Liu , et al.	2020-06-23
Halogen-free Low Dielectric Resin Composition, And Pre-preg, Metal-clad Laminate, And Printed Circuit Board Using The Same App 20200071477 - LIU; Shur-Fen ; et al.	2020-03-05
Resin composition and uses of the same Grant 10,568,211 - Liu , et al. Feb	2020-02-18
Resin composition and uses of the same Grant 10,513,607 - Liu , et al. Dec	2019-12-24
Resin Composition And Uses Of The Same App 20190144666 - Liu; Shur-Fen ; et al.	2019-05-16
Resin composition and uses of the same Grant 10,196,502 - Liu , et al. Fe	2019-02-05
Resin Composition and uses of the same Grant 10,059,841 - Liu , et al. August 28, 2	2018-08-28
Resin Composition, and Prepreg, Metal-Clad Laminate, and Printed Circuit Board Using the Same App 20180208765 - Liu; Shur-Fen ; et al.	2018-07-26
Resin Composition And Uses Of The Same App 20180030267 - Liu; Shur-Fen ; et al.	2018-02-01
Resin Composition And Uses Of The Same App 20170260367 - Liu; Shur-Fen ; et al.	2017-09-14
Resin Composition And Uses Of The Same App 20170260365 - Liu; Shur-Fen ; et al.	2017-09-14
Resin composition and uses of the same Grant 9,708,484 - Liu , et al. July 18, 2	2017-07-18
Resin composition and uses of the same Grant 9,657,154 - Liu , et al. May 23, 2	2017-05-23
Resin Composition And Uses Of The Same App 20160297988 - LIU; Shur-Fen ; et al.	2016-10-13
Resin Composition And Uses Of The Same App 20160280913 - LIU; Shur-Fen ; et al.	2016-09-29
Resin Composition And Uses Of The Same App 20150183952 - Liu; Shur-Fen ; et al.	2015-07-02
Resin Composition And Uses Of The Same App 20150183987 - LIU; Shur-Fen ; et al.	2015-07-02
Resin Composition And Uses Of The Same App 20140255711 - Chen; Meng-Huei ; et al.	2014-09-11
Capacitor substrate structure Grant 8,390,984 - Liu , et al. March 5, 2	2013-03-05
Adhesive Composition App 20120121913 - CHANG; Li-Ming ; et al.	2012-05-17
Flexible, low dielectric loss composition and method for preparing the same Grant 8,138,263 - Liu , et al. March 20, 2	2012-03-20
Capacitor Substrate Structure App 20100309607 - Liu; Shur-Fen ; et al.	2010-12-09
Curable High Dielectric Constant Ink Composition and High Dielectric Film App 20090227719 - Hung; Chin-Hsien ; et al.	2009-09-10
Flexible, Low Dielectric Loss Composition And Method For Preparing The Same App 20090170993 - Liu; Shur-Fen ; et al.	2009-07-02
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof Grant 7,271,206 - Liu , et al. September 18, 2	2007-09-18
Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof Grant 7,008,981 - Liu , et al. March 7, 2	2006-03-07
Organic-inorganic hybrid compositions with sufficient flexibility, high dielectric constant and high thermal stability, and cured compositions thereof App 20050154092 - Liu, Shur-Fen ; et al.	2005-07-14
Organic-inorganic hybrid compositions with high dielectric constant and high thermal stability, and cured compositions thereof App 20050137293 - Liu, Shur-Fen ; et al.	2005-06-23
Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resin Grant 6,780,943 - Liu , et al. August 24, 2	2004-08-24
Resin composition for circuit boards App 20030144430 - Liu, Shur-Fen ; et al.	2003-07-31

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