Chen; Liang-Chun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Liang-Chun.The latest application filed is for "semiconductor package structure and method for manufacturing the same".
- Chen; Liang-Chun - Kaohsiung TW
- Chen; Liang-Chun - New Taipei TW
- Chen; Liang-Chun - Taipei TW
| Patent | Date |
|---|---|
| Semiconductor package structure and method for manufacturing the same Grant 11,094,649 - Min , et al. August 17, 2 | 2021-08-17 |
| Semiconductor Package Structure And Method For Manufacturing The Same App 20210225781 - MIN; Fan-Yu ; et al. | 2021-07-22 |
| Semiconductor package device and method of forming package body Grant 10,943,800 - Min , et al. March 9, 2 | 2021-03-09 |
| Electronic device with multiple display modules Grant 10,168,739 - Chen J | 2019-01-01 |
| Semiconductor Package Device And Method Of Forming Package Body App 20180301361 - MIN; Fan-Yu ; et al. | 2018-10-18 |
| Voice-Over-IP Capable Sideshow Device App 20090129370 - Toorians; Arman ; et al. | 2009-05-21 |
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