Chen; Li-Chih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Li-Chih.The latest application filed is for "hydrogen carbon cleaning method for vehicle".
- Chen; Li-Chih - Taoyuan City TW
- Chen; Li-Chih - New Taipei TW
- CHEN; LI-CHIH - NEW TAIPEI CITY TW
- Chen; Li-Chih - Taipei N/A TW
- Chen; Li-Chih - Danshuei Township Taipei County TW
| Patent | Date |
|---|---|
| Hydrogen Carbon Cleaning Method For Vehicle App 20170191412 - Tsai; Yu-Chou ; et al. | 2017-07-06 |
| Temperature measurement component embedded hot runner nozzle structure Grant 9,205,588 - Lin , et al. December 8, 2 | 2015-12-08 |
| Temperature Measurement Component Embedded Hot Runner Nozzle Structure App 20140377395 - LIN; YUAN-SHIANG ; et al. | 2014-12-25 |
| Method to improve bump reliability for flip chip device Grant 8,497,584 - Chen , et al. July 30, 2 | 2013-07-30 |
| Fluxless bumping process Grant 7,906,425 - Su , et al. March 15, 2 | 2011-03-15 |
| Application of impressed-current cathodic protection to prevent metal corrosion and oxidation Grant 7,276,454 - Ching , et al. October 2, 2 | 2007-10-02 |
| Fluxless bumping process App 20070028445 - Su; Chao-Yuan ; et al. | 2007-02-08 |
| Fluxless bumping process Grant 7,134,199 - Su , et al. November 14, 2 | 2006-11-14 |
| Method of forming a solder ball using a thermally stable resinous protective layer Grant 6,974,659 - Su , et al. December 13, 2 | 2005-12-13 |
| Stencil design for solder paste printing Grant 6,802,250 - Su , et al. October 12, 2 | 2004-10-12 |
| Novel method to improve bump reliability for flip chip device App 20040180296 - Chen, Yen-Ming ; et al. | 2004-09-16 |
| Method for improving bump reliability for flip chip devices Grant 6,756,294 - Chen , et al. June 29, 2 | 2004-06-29 |
| Method of making a wafer level chip scale package Grant 6,743,660 - Lee , et al. June 1, 2 | 2004-06-01 |
| Fluxless bumping process using ions App 20040000580 - Lee, Hsin-Hui ; et al. | 2004-01-01 |
| Fluxless bumping process App 20030229986 - Su, Chao-Yuan ; et al. | 2003-12-18 |
| DFR laminating and film removing system App 20030226638 - Chen, Li-Chih ; et al. | 2003-12-11 |
| Stencil design for solder paste printing App 20030213384 - Su, Chao-Yuan ; et al. | 2003-11-20 |
| Method of measuring photoresist and bump misalignment Grant 6,636,313 - Chen , et al. October 21, 2 | 2003-10-21 |
| Method of measuring photoresist and bump misalignment App 20030133115 - Chen, Yen-Ming ; et al. | 2003-07-17 |
| Method of making a wafer level chip scale package App 20030134496 - Lee, Hsin-Hui ; et al. | 2003-07-17 |
| Method of forming a solder ball using a thermally stable resinous protective layer App 20030134233 - Su, Chao-Yuan ; et al. | 2003-07-17 |
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