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Pseudo-analog Memory Computing Circuit
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Semiconductor structures
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MEMS structure with an etch stop layer buried within inter-dielectric layer
Grant 10,927,000 - Chen , et al. February 23, 2 | 2021-02-23 |
Semiconductor Structures
App 20210043740 - CHEN; Li-Che ; et al. | 2021-02-11 |
Capacitor structures and methods for fabricating the same
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Capacitor Structures And Methods For Fabricating The Same
App 20200027946 - LIU; Hsing-Chao ; et al. | 2020-01-23 |
Trench isolation structures and methods for forming the same
Grant 10,347,524 - Chang , et al. July 9, 2 | 2019-07-09 |
Semiconductor devices and methods for forming the same
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Semiconductor devices, via structures and methods for forming the same
Grant 10,170,397 - Chen , et al. J | 2019-01-01 |
Methods for forming isolation blocks of semiconductor devices, semiconductor devices and methods for manufacturing the same
Grant 10,115,626 - Chen October 30, 2 | 2018-10-30 |
Semiconductor devices and methods for manufacturing the same
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Semiconductor devices, through-substrate via structures and methods for forming the same
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Semiconductor Devices And Methods For Forming The Same
App 20180076282 - CHOU; Ying-Kai ; et al. | 2018-03-15 |
Trench Isolation Structures And Methods For Forming The Same
App 20180076288 - CHANG; Hsiung-Shih ; et al. | 2018-03-15 |
Semiconductor Devices, Via Structures And Methods For Forming The Same
App 20180012823 - CHEN; Li-Che ; et al. | 2018-01-11 |
Fuse elements and methods for forming the same
Grant 9,799,601 - Hsu , et al. October 24, 2 | 2017-10-24 |
Mems Structure With An Etch Stop Layer Buried Within Inter-dielectric Layer
App 20170036905 - Chen; Li-Che ; et al. | 2017-02-09 |
Vertical diode and fabrication method thereof
Grant 9,548,375 - Chang , et al. January 17, 2 | 2017-01-17 |
Vertical diode and fabrication method thereof
Grant 9,502,584 - Chang , et al. November 22, 2 | 2016-11-22 |
Method for forming MEMS structure with an etch stop layer buried within inter-dielectric layer
Grant 9,499,399 - Chen , et al. November 22, 2 | 2016-11-22 |
Top-side contact structure and fabrication method thereof
Grant 9,391,139 - Chang , et al. July 12, 2 | 2016-07-12 |
MEMS structure and method of forming the same
App 20140367805 - Chen; Li-Che ; et al. | 2014-12-18 |
Method for supporting semiconductor wafer and wafer supporting assembly
Grant 8,776,363 - Hsu , et al. July 15, 2 | 2014-07-15 |
High voltage semiconductor device and fabricating method thereof
Grant 8,742,498 - Chien , et al. June 3, 2 | 2014-06-03 |
Method For Supporting Semiconductor Wafer And Wafer Supporting Assembly
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Integrated circuit and fabricating method thereof
Grant 8,587,078 - Huang , et al. November 19, 2 | 2013-11-19 |
Diaphragm of MEMS electroacoustic transducer
Grant 8,553,911 - Chen October 8, 2 | 2013-10-08 |
Manufacturing method of wafer level chip scale package of image-sensing module
Grant 8,546,739 - Hsuan , et al. October 1, 2 | 2013-10-01 |
Wafer with eutectic bonding carrier and method of manufacturing the same
Grant 8,536,709 - Hsu , et al. September 17, 2 | 2013-09-17 |
MEMS and protection structure thereof
Grant 8,502,382 - Lan , et al. August 6, 2 | 2013-08-06 |
High Voltage Semiconductor Device And Fabricating Method Thereof
App 20130113048 - CHIEN; Fu-Chun ; et al. | 2013-05-09 |
Diaphragm Of Mems Electroacoustic Transducer
App 20130056297 - CHEN; Li-Che | 2013-03-07 |
Wafer level package of MEMS microphone and manufacturing method thereof
Grant 8,368,153 - Huang , et al. February 5, 2 | 2013-02-05 |
Microelectromechanical system microphone package structure
Grant 8,363,859 - Chen January 29, 2 | 2013-01-29 |
Diaphragm of MEMS electroacoustic transducer
Grant 8,345,895 - Chen January 1, 2 | 2013-01-01 |
MEMS and Protection Structure Thereof
App 20120205808 - Lan; Bang-Chiang ; et al. | 2012-08-16 |
Microelectromechanical System Microphone Package Structure
App 20120193735 - CHEN; Li-Che | 2012-08-02 |
Microelectromechanical system microphone structure and microelectromechanical system microphone package structure
Grant 8,208,662 - Chen June 26, 2 | 2012-06-26 |
MEMS and a protection structure thereof
Grant 8,193,640 - Lan , et al. June 5, 2 | 2012-06-05 |
Wafer Level Package of MEMS Microphone and Manufacturing Method thereof
App 20110248364 - Huang; Chien-Hsin ; et al. | 2011-10-13 |
Integrated Circuit and Fabricating Method thereof
App 20110241137 - HUANG; Chien-Hsin ; et al. | 2011-10-06 |
Microelectromechanical System Microphone Structure And Microelectromechanical System Microphone Package Structure
App 20100067728 - Chen; Li-Che | 2010-03-18 |
Image-sensing module of image capture apparatus and manufacturing method thereof
Grant 7,659,501 - Hsuan , et al. February 9, 2 | 2010-02-09 |
Diaphragm Of Mems Electroacoustic Transducer
App 20100020991 - Chen; Li-Che | 2010-01-28 |
Manufacturing Method Of Wafer Level Chip Scale Pacakge Of Image-sensing Module
App 20090305451 - Hsuan; Min-Chih ; et al. | 2009-12-10 |
Image-sensing Module And Manufacturing Method Thereof, And Image Capture Apparatus
App 20080239120 - Hsuan; Min-Chih ; et al. | 2008-10-02 |
MOS transistor device structure combining Si-trench and field plate structures for high voltage device
Grant 7,368,785 - Chen , et al. May 6, 2 | 2008-05-06 |
MOS transistor device structure combining Si-trench and field plate structures for high voltage device
App 20080070369 - Chen; Li-Che ; et al. | 2008-03-20 |
MOS transistor device structure combining Si-trench and field plate structures for high voltage device
App 20060270171 - Chen; Li-Che ; et al. | 2006-11-30 |
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