Chen; Kuo-Ching

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Kuo-Ching.The latest application filed is for "wiring board with embedded interposer substrate and method of fabricating the same".

Company Profile

0.9.12

Chen; Kuo-Ching - Taoyuan City TW
CHEN; Kuo-Ching - Miaoli County TW
Chen; Kuo-Ching - Taipei TW
Chen; Kuo-Ching - Changhua TW
Chen; Kuo-Ching - Changhua City TW
Chen; Kuo-Ching - Kaohsiung TW
Chen; Kuo Ching - Newark CA
Chen; Kuo-Ching - Kaohsiung City TW
Chen; Kuo-Ching - Chung-Huo TW
Chen, Kuo-Ching - Chung-Huo City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wiring Board With Embedded Interposer Substrate And Method Of Fabricating The Same App 20220285255 - Peng; Yan-Jia ; et al.	2022-09-08
Circuit Board And Manufacture Method Of The Circuit Board App 20220217841 - KUO; Chun Hung ; et al.	2022-07-07
Light Tube Device App 20140321110 - CHEN; Kuo-Ching ; et al.	2014-10-30
Light emitting diode module Grant D687,788 - Chen , et al. August 13, 2	2013-08-13
Circuit board of communication product and manufacturing method thereof Grant 8,106,302 - Chen , et al. January 31, 2	2012-01-31
Package substrate with a cavity, semiconductor package and fabrication method thereof Grant 8,049,114 - Chen , et al. November 1, 2	2011-11-01
Circuit board having isolation cover and assembling method thereof Grant 7,999,195 - Huang , et al. August 16, 2	2011-08-16
Assembly device Grant 7,958,625 - Lee , et al. June 14, 2	2011-06-14
Package Substrate With A Cavity, Semiconductor Package And Fabrication Method Thereof App 20100236817 - Chen; Kuo-Ching ; et al.	2010-09-23
Package Substrate Strucutre With Cavity And Method For Making The Same App 20100206619 - Chen; Kuo-Ching ; et al.	2010-08-19
Assembly Device App 20100095518 - LEE; Chia-Hung ; et al.	2010-04-22
Circuit Board Of Communication Product And Manufacturing Method Thereof App 20100089619 - CHEN; Kuo-Ching ; et al.	2010-04-15
Circuit Board Having Isolation Cover And Assembling Method Thereof App 20100091471 - HUANG; Chung-Shao ; et al.	2010-04-15
Method for improving flexibility of arbitration of direct memory access (DMA) engines requesting access to shared DMA channels Grant 7,689,732 - Chen , et al. March 30, 2	2010-03-30
Method for improving flexibility of direct memory access channels App 20070204073 - Chen; Kuo-Ching ; et al.	2007-08-30
Level shifter ESD protection circuit with power-on-sequence consideration Grant 7,233,468 - Chang , et al. June 19, 2	2007-06-19
External optical disk stabilizer and method of use App 20070104084 - Chen; Kuo Ching	2007-05-10
Level Shifter Esd Protection Circuit With Power-on-sequence Consideration App 20070014061 - Chang; Chyh-Yih ; et al.	2007-01-18
Packet receiving method on a network with parallel and multiplexing capability Grant 7,012,926 - Weng , et al. March 14, 2	2006-03-14
Packet receiving method on a network with parallel and multiplexing capability App 20010007565 - Weng, Chih-Hsien ; et al.	2001-07-12

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