Chen; Kuei-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Kuei-Wei.The latest application filed is for "manufacturing method of chip package and chip package".
- Chen; Kuei-Wei - Taoyuan TW
- Chen; Kuei-Wei - Taoyuan City TW
- CHEN; Kuei-Wei - Keelung City TW
- Chen; Kuei-Wei - Keelung TW
| Patent | Date |
|---|---|
| Chip package with substrate having first opening surrounded by second opening and method for forming the same Grant 11,450,697 - Chen , et al. September 20, 2 | 2022-09-20 |
| Manufacturing Method Of Chip Package And Chip Package App 20210343591 - Lin; Chia-Sheng ; et al. | 2021-11-04 |
| Manufacturing method of chip package and chip package Grant 11,121,031 - Lin , et al. September 14, 2 | 2021-09-14 |
| Chip package Grant 11,056,427 - Chen , et al. July 6, 2 | 2021-07-06 |
| Manufacturing Method Of Chip Package And Chip Package App 20200144116 - LIN; Chia-Sheng ; et al. | 2020-05-07 |
| Chip Package App 20200111737 - CHEN; Kuei-Wei ; et al. | 2020-04-09 |
| Chip Package And Method For Forming The Same App 20200098811 - CHEN; Kuei-Wei ; et al. | 2020-03-26 |
| Chip Package And Method For Forming The Same App 20170256496 - LIN; Chia-Sheng ; et al. | 2017-09-07 |
| Wafer level array of chips and method thereof Grant 9,318,461 - Chang , et al. April 19, 2 | 2016-04-19 |
| Wafer Level Array Of Chips And Method Thereof App 20140312482 - CHANG; Chun-Wei ; et al. | 2014-10-23 |
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