Patent | Date |
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Package with embedded heat dissipation features Grant 11,133,237 - Hung , et al. September 28, 2 | 2021-09-28 |
3DIC Packaging with Hot Spot Thermal Management Features App 20210287956 - Hung; Wensen ;   et al. | 2021-09-16 |
3DIC packaging with hot spot thermal management features Grant 11,037,852 - Hung , et al. June 15, 2 | 2021-06-15 |
Package With Embedded Heat Dissipation Features App 20200251398 - Kind Code | 2020-08-06 |
Package with embedded heat dissipation features Grant 10,629,510 - Hung , et al. | 2020-04-21 |
3DIC Packaging with Hot Spot Thermal Management Features App 20200027809 - Hung; Wensen ;   et al. | 2020-01-23 |
3DIC packaging with hot spot thermal management features Grant 10,461,009 - Hung , et al. Oc | 2019-10-29 |
3D semiconductor package interposer with die cavity Grant 10,446,520 - Jeng , et al. Oc | 2019-10-15 |
Packaged semiconductor devices Grant 10,332,823 - Chen , et al. | 2019-06-25 |
Packaged Semiconductor Devices App 20190122959 - Chen; Kim Hong ;   et al. | 2019-04-25 |
3DIC Packaging with Hot Spot Thermal Management Features App 20190096781 - Hung; Wensen ;   et al. | 2019-03-28 |
Methods of cooling packaged semiconductor devices Grant 10,157,818 - Chen , et al. Dec | 2018-12-18 |
3DIC packaging with hot spot thermal management features Grant 10,157,813 - Hung , et al. Dec | 2018-12-18 |
Package with Embedded Heat Dissipation Features App 20180269127 - Hung; Wensen ;   et al. | 2018-09-20 |
Semiconductor packages with thermal management features for reduced thermal crosstalk Grant 10,062,665 - Chen , et al. August 28, 2 | 2018-08-28 |
3DIC package and methods of forming the same Grant 9,985,001 - Chen , et al. May 29, 2 | 2018-05-29 |
Package with embedded heat dissipation features Grant 9,978,660 - Hung , et al. May 22, 2 | 2018-05-22 |
3DIC packages with heat dissipation structures Grant 9,941,251 - Hung , et al. April 10, 2 | 2018-04-10 |
3D Semiconductor Package Interposer with Die Cavity App 20180026008 - Jeng; Shin-Puu ;   et al. | 2018-01-25 |
Method of forming 3D integrated circuit package with panel type lid Grant 9,859,266 - Wang , et al. January 2, 2 | 2018-01-02 |
3DIC Packaging with Hot Spot Thermal Management Features App 20170345732 - Hung; Wensen ;   et al. | 2017-11-30 |
3D semiconductor package interposer with die cavity Grant 9,780,072 - Jeng , et al. October 3, 2 | 2017-10-03 |
3DIC packaging with hot spot thermal management features Grant 9,735,082 - Hung , et al. August 15, 2 | 2017-08-15 |
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same App 20170162542 - Chen; Kim Hong ;   et al. | 2017-06-08 |
3DIC Packages with Heat Dissipation Structures App 20170148767 - Hung; Wensen ;   et al. | 2017-05-25 |
Method Of Forming 3D Integrated Circuit Package With Panel Type Lid App 20170077078 - Wang; Tsung-Ding ;   et al. | 2017-03-16 |
Packages with thermal management features for reduced thermal crosstalk and methods of forming same Grant 9,595,506 - Chen , et al. March 14, 2 | 2017-03-14 |
3DIC Package and Methods of Forming the Same App 20170062391 - Chen; Kim Hong ;   et al. | 2017-03-02 |
Packages with thermal interface material on the sidewalls of stacked dies Grant 9,583,415 - Yu , et al. February 28, 2 | 2017-02-28 |
3DIC packages with heat dissipation structures Grant 9,576,938 - Hung , et al. February 21, 2 | 2017-02-21 |
3D integrated circuit package processing with panel type lid Grant 9,502,383 - Wang , et al. November 22, 2 | 2016-11-22 |
3DIC package and methods of forming the same Grant 9,496,249 - Chen , et al. November 15, 2 | 2016-11-15 |
Test structure and method of testing electrical characteristics of through vias Grant 9,462,692 - Hou , et al. October 4, 2 | 2016-10-04 |
3DIC Packages with Heat Dissipation Structures App 20160284670 - Hung; Wensen ;   et al. | 2016-09-29 |
3D Semiconductor Package Interposer with Die Cavity App 20160254249 - Jeng; Shin-Puu ;   et al. | 2016-09-01 |
3D semiconductor package interposer with die cavity Grant 9,385,095 - Jeng , et al. July 5, 2 | 2016-07-05 |
3DIC packages with heat dissipation structures Grant 9,379,036 - Hung , et al. June 28, 2 | 2016-06-28 |
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same App 20160133602 - Chen; Kim Hong ;   et al. | 2016-05-12 |
Methods of Cooling Packaged Semiconductor Devices App 20160111350 - Chen; Kim Hong ;   et al. | 2016-04-21 |
Packages with thermal management features for reduced thermal crosstalk and methods of forming same Grant 9,269,694 - Chen , et al. February 23, 2 | 2016-02-23 |
3DIC Package and Methods of Forming the Same App 20160049389 - Chen; Kim Hong ;   et al. | 2016-02-18 |
Packages for semiconductor devices, packaged semiconductor devices, and methods of cooling packaged semiconductor devices Grant 9,224,673 - Chen , et al. December 29, 2 | 2015-12-29 |
3DIC package and methods of forming the same Grant 9,184,128 - Hung , et al. November 10, 2 | 2015-11-10 |
Package with Embedded Heat Dissipation Features App 20150262904 - Hung; Wensen ;   et al. | 2015-09-17 |
3d Integrated Circuit Package Processing With Panel Type Lid App 20150262973 - Wang; Tsung-Ding ;   et al. | 2015-09-17 |
Test Structure and Method of Testing Electrical Characteristics of Through Vias App 20150208504 - Hou; Shang-Yun ;   et al. | 2015-07-23 |
3DIC packages with heat dissipation structures Grant 9,082,743 - Hung , et al. July 14, 2 | 2015-07-14 |
3DIC packages with heat sinks attached to heat dissipating rings Grant 9,076,754 - Hung , et al. July 7, 2 | 2015-07-07 |
3DIC Package and Methods of Forming the Same App 20150171006 - Hung; Wensen ;   et al. | 2015-06-18 |
Packages with Thermal Management Features for Reduced Thermal Crosstalk and Methods of Forming Same App 20150162307 - Chen; Kim Hong ;   et al. | 2015-06-11 |
3DIC Packaging with Hot Spot Thermal Management Features App 20150155218 - Hung; Wensen ;   et al. | 2015-06-04 |
Packages with Thermal Interface Material on the Sidewalls of Stacked Dies App 20150108628 - Yu; Chen-Hua ;   et al. | 2015-04-23 |
3DIC Packages with Heat Dissipation Structures App 20150108631 - Hung; Wensen ;   et al. | 2015-04-23 |
Test structure and method of testing electrical characteristics of through vias Grant 8,993,432 - Hou , et al. March 31, 2 | 2015-03-31 |
3dic Packages With Heat Dissipation Structures App 20150035134 - Hung; Wensen ;   et al. | 2015-02-05 |
3DIC Packages with Heat Sinks Attached to Heat Dissipating Rings App 20150035135 - Hung; Wensen ;   et al. | 2015-02-05 |
3D semiconductor package interposer with die cavity Grant 8,865,521 - Jeng , et al. October 21, 2 | 2014-10-21 |
Packages for Semiconductor Devices, Packaged Semiconductor Devices, and Methods of Cooling Packaged Semiconductor Devices App 20140252585 - Chen; Kim Hong ;   et al. | 2014-09-11 |
3D Semiconductor Package Interposer with Die Cavity App 20140217610 - Jeng; Shin-Puu ;   et al. | 2014-08-07 |
3D Semiconductor Package Interposer with Die Cavity App 20130252378 - Jeng; Shin-Puu ;   et al. | 2013-09-26 |
3D semiconductor package interposer with die cavity Grant 8,519,537 - Jeng , et al. August 27, 2 | 2013-08-27 |
Test Structure and Method of Testing Electrical Characteristics of Through Vias App 20130120018 - Hou; Shang-Yun ;   et al. | 2013-05-16 |
3D Semiconductor Package Using An Interposer App 20110210444 - Jeng; Shin-Puu ;   et al. | 2011-09-01 |