Chen; Ke-Hung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Ke-Hung.The latest application filed is for "methods of utilizing etch-stop material during fabrication of capacitors, integrated assemblies comprising capacitors".

Company Profile

1.13.11

Chen; Ke-Hung - Boise ID
Chen; Ke-Hung - Kao-Hsiung N/A TW
Chen; Ke-Hung - Kaohsiung TW
Chen; Ke-Hung - Kao-Hsiung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of Utilizing Etch-Stop Material During Fabrication of Capacitors, Integrated Assemblies Comprising Capacitors App 20210327881 - Tang; Sanh D. ; et al.	2021-10-21
Compositional optical emission spectroscopy for detection of particle induced arcs in a fabrication process Grant 10,436,717 - Omstead , et al. O	2019-10-08
Compositional Optical Emission Spectroscopy For Detection Of Particle Induced Arcs In A Fabrication Process App 20180143141 - Omstead; Thomas ; et al.	2018-05-24
Circuitry component and method for forming the same Grant 8,884,433 - Lin , et al. November 11, 2	2014-11-11
Post passivation structure for a semiconductor device and packaging process for same Grant 8,558,383 - Lin , et al. October 15, 2	2013-10-15
Metal pad or metal bump over pad exposed by passivation layer Grant 8,399,989 - Lin , et al. March 19, 2	2013-03-19
Semiconductor chip with a bonding pad having contact and test areas Grant 8,304,766 - Lin , et al. November 6, 2	2012-11-06
Chip package with dam bar restricting flow of underfill Grant 8,294,279 - Chen , et al. October 23, 2	2012-10-23
Bonding pad on IC substrate and method for making the same Grant 8,148,822 - Lin , et al. April 3, 2	2012-04-03
Semiconductor Chip App 20110198589 - Lin; Mou-Shiung ; et al.	2011-08-18
Semiconductor chip with bond area Grant 7,947,978 - Lin , et al. May 24, 2	2011-05-24
Circuitry Component And Method For Forming The Same App 20090309224 - Lin; Mou-Shiung ; et al.	2009-12-17
Circuitry component and method for forming the same Grant 7,582,556 - Lin , et al. September 1, 2	2009-09-01
Post Passivation Structure For A Semiconductor Device And Packaging Process For Same App 20090057895 - Lin; Mou-Shiung ; et al.	2009-03-05
Post passivation structure for a semiconductor device and packaging process for same Grant 7,468,545 - Lin , et al. December 23, 2	2008-12-23
Semiconductor Chip App 20070164279 - Lin; Mou-Shiung ; et al.	2007-07-19
Metal Pad Or Metal Bump Over Pad Exposed By Passivation Layer App 20070026631 - Lin; Mou-Shiung ; et al.	2007-02-01
Bonding Pad On Ic Substrate And Method For Making The Same App 20070023919 - Lin; Mou-Shiung ; et al.	2007-02-01
Post passivation structure for a semiconductor device and packaging process for same App 20060291029 - Lin; Mou-Shiung ; et al.	2006-12-28
Circuitry Component And Method For Forming The Same App 20060292851 - Lin; Mou-Shiung ; et al.	2006-12-28
Multi-chip Structure And Method Of Assembling Chips App 20060220259 - Chen; Ke-Hung ; et al.	2006-10-05

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