CHEN; Kang

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHEN; Kang.The latest application filed is for "rhythm point detection method and apparatus and electronic device".

Company Profile

34.174.164

CHEN; Kang - Hangzhou Zhejiang
Chen; Kang - Singapore SG
Chen; Kang - Minhou CN
Chen; Kang - Zhejiang CN
Chen; Kang - Shanghai CN
CHEN; Kang - Shenzhen Guangdong
Chen; Kang - Beijing CN
Chen; Kang - Guangdong CN
Chen; Kang - Detroit MI
Chen; Kang - Dongguan CN
CHEN; Kang - Kashiwa-shi JP
Chen; Kang - Cupertino CA
Chen; Kang - HuiZhou CN
Chen; Kang - Taizhou CN
CHEN; Kang - HuiZhou City Guangdong
Chen; Kang - Nanjing N/A CN
Chen; Kang - Hukou Township Hsinchu County TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Rhythm Point Detection Method and Apparatus and Electronic Device App 20220310051 - LEI; Jin ; et al.	2022-09-29
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package App 20220289560 - Lin; Yaojian ; et al.	2022-09-15
Cigar humidor assembly Grant D957,731 - Chen July 12, 2	2022-07-12
Semiconductor device and method of forming microelectromechanical systems (MEMS) package Grant 11,370,655 - Lin , et al. June 28, 2	2022-06-28
Method and apparatus for generating face model, storage medium, and terminal Grant 11,328,455 - Yang , et al. May 10, 2	2022-05-10
Signal transmitting circuit and signal receiving circuit for serial communication, and electronic device Grant 11,316,556 - Wang , et al. April 26, 2	2022-04-26
Robotic Welding Device Employing Flexible Guide Rail, And Welding Method App 20220072666 - CHEN; Zhenming ; et al.	2022-03-10
Systems and methods for implementing persistent data structures on an asymmetric non-volatile memory architecture Grant 11,237,925 - Chen , et al. February 1, 2	2022-02-01
Systems And Methods For Implementing Persistent Data Structures On An Asymmetric Non-volatile Memory Architecture App 20210397524 - Chen; Kang ; et al.	2021-12-23
Water cooling head, water cooling radiator and electronic equipment Grant 11,197,391 - Chen December 7, 2	2021-12-07
Method and Apparatus for Generating Face Model, Storage Medium, and Terminal App 20210366162 - YANG; Kewei ; et al.	2021-11-25
Systems and methods for general-purpose temporal graph computing Grant 11,164,348 - Chen , et al. November 2, 2	2021-11-02
Systems and methods for geometric partitioning in object storage Grant 11,165,440 - Wu , et al. November 2, 2	2021-11-02
Methods For The Production Of Therapeutic, Diagnostic, Or Research Antibodies App 20210317405 - Chen; Kang ; et al.	2021-10-14
Signal Transmitting Circuit And Signal Receiving Circuit For Serial Communication, And Electronic Device App 20210306027 - WANG; YiXin ; et al.	2021-09-30
Method and Apparatus for Generating Game Character Model, Processor, and Terminal App 20210291056 - CHEN; Kang ; et al.	2021-09-23
Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure Grant 11,127,666 - Lin , et al. September 21, 2	2021-09-21
Water Cooling Head, Water Cooling Radiator And Electronic Equipment App 20210195797 - Chen; Kang	2021-06-24
Ultrasonic Generator App 20210169450 - MORITA; Takeshi ; et al.	2021-06-10
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 11,024,561 - Shim , et al. June 1, 2	2021-06-01
Postoperative functional exerciser for frozen shoulder Grant 11,007,106 - Zhu , et al. May 18, 2	2021-05-18
Methods for the production of therapeutic, diagnostic, or research antibodies Grant 11,001,804 - Chen , et al. May 11, 2	2021-05-11
Content Discovery Using A Skills Graph App 20210133247 - Chen; Kang ; et al.	2021-05-06
Cloud-end data multicast method and system, and computer device Grant 10,958,723 - Zhang , et al. March 23, 2	2021-03-23
Method for Preparing Lithium Borohydride By Means of Solid-Phase Ball Milling at Room Temperature App 20210039947 - Ouyang; Liuzhang ; et al.	2021-02-11
Content discovery using a skills graph Grant 10,902,061 - Chen , et al. January 26, 2	2021-01-26
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package App 20200399117 - Lin; Yaojian ; et al.	2020-12-24
Hybrid Network System, Communication Method And Network Node App 20200358834 - Zheng; Weimin ; et al.	2020-11-12
Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB App 20200335358 - Lin; Yaojian ; et al.	2020-10-22
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 10,790,158 - Lin , et al. September 29, 2	2020-09-29
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units App 20200294890 - Shim; Il Kwon ; et al.	2020-09-17
Hybrid network system, communication method and network node Grant 10,778,738 - Zheng , et al. Sept	2020-09-15
Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB Grant 10,741,416 - Lin , et al. A	2020-08-11
Method and apparatus for processing seismic data Grant 10,705,238 - Zhang , et al.	2020-07-07
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 10,707,150 - Shim , et al.	2020-07-07
Semiconductor device and method of forming microelectromechanical systems (MEMS) package Grant 10,662,056 - Lin , et al.	2020-05-26
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP) Grant 10,622,293 - Yoon , et al.	2020-04-14
Systems and methods for remote procedure call Grant 10,613,992 - Chen , et al.	2020-04-07
Semiconductor device and method of forming interconnect substrate for FO-WLCSP Grant 10,607,946 - Lin , et al.	2020-03-31
Method and device for managing virtualized network function Grant 10,511,506 - Wu , et al. Dec	2019-12-17
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Grant 10,475,779 - Lin , et al. Nov	2019-11-12
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units Grant 10,446,479 - Marimuthu , et al. Oc	2019-10-15
Systems And Methods For Remote Procedure Call App 20190286574 - Chen; Kang ; et al.	2019-09-19
Method of prevention and inhibition of preterm labor Grant 10,391,148 - Chen A	2019-08-27
Content Discovery Using A Skills Graph App 20190220547 - CHEN; Kang ; et al.	2019-07-18
Semiconductor device and method of forming build-up interconnect structures over a temporary substrate Grant 10,304,817 - Lin , et al.	2019-05-28
Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package Grant 10,297,518 - Lin , et al.	2019-05-21
Semiconductor device and method of controlling warpage in reconstituted wafer Grant 10,297,556 - Heng , et al.	2019-05-21
Cloud-end Data Multicast Method And System, And Computer Device App 20190141124 - ZHANG; Yiwen ; et al.	2019-05-09
Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in FO-WLCSP App 20190115268 - Lin; Yaojian ; et al.	2019-04-18
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern App 20190109015 - Lin; Yaojian ; et al.	2019-04-11
Methods For The Production Of Therapeutic, Diagnostic, Or Research Antibodies App 20190062705 - Chen; Kang ; et al.	2019-02-28
Semiconductor device and method of forming an embedded SoP fan-out package Grant 10,217,702 - Lin , et al. Feb	2019-02-26
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels Grant 10,211,183 - Lin , et al. Feb	2019-02-19
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package App 20190047845 - Lin; Yaojian ; et al.	2019-02-14
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation Grant 10,204,866 - Lin , et al. Feb	2019-02-12
Semiconductor device and method of forming wafer-level interconnect structures with advanced dielectric characteristics Grant 10,204,879 - Lin , et al. Feb	2019-02-12
Semiconductor device and method of forming dual-sided interconnect structures in FO-WLCSP Grant 10,192,796 - Lin , et al. Ja	2019-01-29
Semiconductor device and method of forming microelectromechanical systems (MEMS) package Grant 10,189,702 - Lin , et al. Ja	2019-01-29
Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound Grant 10,192,801 - Lin , et al. Ja	2019-01-29
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 10,177,010 - Lin , et al. J	2019-01-08
Smart home control method and system based on alljoyn technology Grant 10,178,610 - Chen J	2019-01-08
Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP Grant 10,170,385 - Lin , et al. J	2019-01-01
Postoperative Functional Exerciser For Frozen Shoulder App 20180369055 - ZHU; Weimin ; et al.	2018-12-27
Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages Grant 10,163,737 - Lin , et al. Dec	2018-12-25
Semiconductor device and method of controlling warpage in reconstituted wafer Grant 10,163,747 - Heng , et al. Dec	2018-12-25
Semiconductor device with dummy metal protective structure around semiconductor die for localized planarization of insulating layer Grant 10,163,815 - Lin , et al. Dec	2018-12-25
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units App 20180331018 - Shim; Il Kwon ; et al.	2018-11-15
Asymmetrical hydrogenation reaction of ketonic acid compound Grant 10,112,884 - Yan , et al. October 30, 2	2018-10-30
Semiconductor device and method of forming a fan-out PoP device with PWB vertical interconnect units Grant 10,049,964 - Shim , et al. August 14, 2	2018-08-14
Method And Apparatus For Processing Seismic Data App 20180149764 - ZHANG; Guangrong ; et al.	2018-05-31
Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP Grant 9,978,654 - Lin , et al. May 22, 2	2018-05-22
Semiconductor Device and Method of Forming a POP Device with Embedded Vertical Interconnect Units App 20180068937 - Marimuthu; Pandi C. ; et al.	2018-03-08
Method Of Prevention And Inhibition Of Preterm Labor App 20180055910 - Chen; Kang	2018-03-01
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP App 20180026023 - Lin; Yaojian ; et al.	2018-01-25
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers Grant 9,875,973 - Lin , et al. January 23, 2	2018-01-23
Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units Grant 9,865,525 - Lin , et al. January 9, 2	2018-01-09
Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component Grant 9,865,482 - Lin , et al. January 9, 2	2018-01-09
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate App 20180006008 - Lin; Yaojian ; et al.	2018-01-04
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Grant 9,847,324 - Lin , et al. December 19, 2	2017-12-19
Semiconductor device and method of forming a PoP device with embedded vertical interconnect units Grant 9,842,798 - Marimuthu , et al. December 12, 2	2017-12-12
Semiconductor method and device of forming a fan-out device with PWB vertical interconnect units Grant 9,837,303 - Lin , et al. December 5, 2	2017-12-05
Semiconductor device and method of forming build-up interconnect structures over a temporary substrate Grant 9,818,734 - Lin , et al. November 14, 2	2017-11-14
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package App 20170297903 - Lin; Yaojian ; et al.	2017-10-19
Method and Device for Managing Virtualized Network Function App 20170302543 - WU; Daoli ; et al.	2017-10-19
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Grant 9,768,155 - Lin , et al. September 19, 2	2017-09-19
Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB App 20170263470 - Lin; Yaojian ; et al.	2017-09-14
Asymmetrical hydrogenation reaction of ketonic acid compound App 20170260119 - YAN; Pucha ; et al.	2017-09-14
Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package Grant 9,754,867 - Lin , et al. September 5, 2	2017-09-05
Semiconductor Device and Method of Forming Interconnect Substrate for FO-WLCSP App 20170236788 - Lin; Yaojian ; et al.	2017-08-17
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer App 20170194228 - Heng; Kian Meng ; et al.	2017-07-06
Hybrid Network System, Communication Method And Network Node App 20170187766 - Zheng; Weimin ; et al.	2017-06-29
Semiconductor device and method of forming embedded conductive layer for power/ground planes in Fo-eWLB Grant 9,685,350 - Lin , et al. June 20, 2	2017-06-20
Semiconductor device and method of forming micro-vias partially through insulating material around bump interconnect Grant 9,685,415 - Lin , et al. June 20, 2	2017-06-20
Semiconductor device and method of forming interconnect substrate for FO-WLCSP Grant 9,679,863 - Lin , et al. June 13, 2	2017-06-13
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 9,666,500 - Lin , et al. May 30, 2	2017-05-30
Semiconductor Device and Method of Forming Openings Through Insulating Layer Over Encapsulant for Enhanced Adhesion of Interconnect Structure App 20170148721 - Lin; Yaojian ; et al.	2017-05-25
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer App 20170133330 - Heng; Kian Meng ; et al.	2017-05-11
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation App 20170098612 - Lin; Yaojian ; et al.	2017-04-06
Semiconductor device and method of controlling warpage in reconstituted wafer Grant 9,607,965 - Heng , et al. March 28, 2	2017-03-28
Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation Grant 9,607,958 - Lin , et al. March 28, 2	2017-03-28
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package App 20170084526 - Lin; Yaojian ; et al.	2017-03-23
Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure Grant 9,601,434 - Lin , et al. March 21, 2	2017-03-21
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation Grant 9,558,958 - Lin , et al. January 31, 2	2017-01-31
Semiconductor device and method of forming repassivation layer for robust low cost fan-out semiconductor package Grant 9,548,240 - Lin , et al. January 17, 2	2017-01-17
Semiconductor device and method of forming microelectromechanical systems (MEMS) package Grant 9,527,723 - Lin , et al. December 27, 2	2016-12-27
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers Grant 9,520,365 - Lin , et al. December 13, 2	2016-12-13
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern App 20160351419 - Lin; Yaojian ; et al.	2016-12-01
Semiconductor device and method of forming protection and support structure for conductive interconnect structure Grant 9,484,259 - Lin , et al. November 1, 2	2016-11-01
Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die Grant 9,472,452 - Lin , et al. October 18, 2	2016-10-18
Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package App 20160276238 - Lin; Yaojian ; et al.	2016-09-22
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over Carrier for Testing at Interim Stages App 20160276232 - Lin; Yaojian ; et al.	2016-09-22
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out Package App 20160276258 - Lin; Yaojian ; et al.	2016-09-22
Semiconductor Device and Method of Forming Stacked Vias Within Interconnect Structure for FO-WLCSP App 20160276239 - Lin; Yaojian ; et al.	2016-09-22
Semiconductor device and method of balancing surfaces of an embedded PCB unit with a dummy copper pattern Grant 9,449,943 - Lin , et al. September 20, 2	2016-09-20
Integrated passive devices Grant 9,449,925 - Lin , et al. September 20, 2	2016-09-20
Semiconductor device and method of forming insulating layer around semiconductor die Grant 9,437,552 - Lin , et al. September 6, 2	2016-09-06
Smart Home Control Method And System Based On Alljoyn Technology App 20160249286 - CHEN; Kang	2016-08-25
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Grant 9,401,331 - Lin , et al. July 26, 2	2016-07-26
Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels App 20160197059 - Lin; Yaojian ; et al.	2016-07-07
Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages Grant 9,385,052 - Lin , et al. July 5, 2	2016-07-05
Semiconductor device and method of forming an embedded SOP fan-out package Grant 9,385,006 - Lin , et al. July 5, 2	2016-07-05
Semiconductor device and method of forming supporting layer over semiconductor die in thin fan-out wafer level chip scale package Grant 9,385,102 - Lin , et al. July 5, 2	2016-07-05
Semiconductor device including integrated passive device formed over semiconductor die with conductive bridge and fan-out redistribution layer Grant 9,368,563 - Lin , et al. June 14, 2	2016-06-14
Semiconductor Device and Method for Forming a Low Profile Embedded Wafer Level Ball Grid Array Molded Laser Package (EWLB-MLP) App 20160141238 - Yoon; Seung Wook ; et al.	2016-05-19
Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels Grant 9,324,700 - Lin , et al. April 26, 2	2016-04-26
Semiconductor device and method of forming stress relieving vias for improved fan-out WLCSP package Grant 9,318,404 - Lin , et al. April 19, 2	2016-04-19
Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLP-MLP) Grant 9,293,401 - Yoon , et al. March 22, 2	2016-03-22
Three-dimensional Scene Model Generating Method App 20160078674 - Xu; Kun ; et al.	2016-03-17
Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in FO-WLCSP Grant 9,281,259 - Lin , et al. March 8, 2	2016-03-08
Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit Grant 9,269,598 - Lin , et al. February 23, 2	2016-02-23
Semiconductor device and method of forming through mold hole with alignment and dimension control Grant 9,252,092 - Lin , et al. February 2, 2	2016-02-02
Semiconductor Device and Method of Forming Wafer-Level Interconnect Structures with Advanced Dielectric Characteristics App 20160013148 - Lin; Yaojian ; et al.	2016-01-14
Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereof Grant 9,236,278 - Huang , et al. January 12, 2	2016-01-12
Semiconductor device and method of forming RDL over contact pad with high alignment tolerance or reduced interconnect pitch Grant 9,202,713 - Lin , et al. December 1, 2	2015-12-01
Semiconductor device having embedded integrated passive devices electrically interconnected using conductive pillars Grant 9,184,103 - Lin , et al. November 10, 2	2015-11-10
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP App 20150294962 - Lin; Yaojian ; et al.	2015-10-15
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP App 20150287708 - Lin; Yaojian ; et al.	2015-10-08
Semiconductor device and method of forming FO-WLCSP with multiple encapsulants Grant 9,142,428 - Lin , et al. September 22, 2	2015-09-22
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package App 20150259194 - Lin; Yaojian ; et al.	2015-09-17
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief App 20150228552 - Lin; Yaojian ; et al.	2015-08-13
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 9,087,930 - Lin , et al. July 21, 2	2015-07-21
Data Backup Method Of Distributed File System App 20150199243 - WU; Yongwei ; et al.	2015-07-16
Semiconductor device and method of forming a robust fan-out package including vertical interconnects and mechanical support layer Grant 9,082,780 - Lin , et al. July 14, 2	2015-07-14
Semiconductor device and method of forming protection and support structure for conductive interconnect structure Grant 9,082,832 - Lin , et al. July 14, 2	2015-07-14
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Grant 9,082,806 - Lin , et al. July 14, 2	2015-07-14
Application Virtualization System And Method App 20150186163 - WU; YONGWEI ; et al.	2015-07-02
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over a Temporary Substrate App 20150179616 - Lin; Yaojian ; et al.	2015-06-25
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Grant 9,064,936 - Lin , et al. June 23, 2	2015-06-23
Detecting Method And System For Concurrency Bugs App 20150161030 - WU; Yongwei ; et al.	2015-06-11
Protecting System And Method For Privacy Information In Mobile Terminal App 20150163668 - WU; Yongwei ; et al.	2015-06-11
Semiconductor Device and Method of Forming Repassivation Layer for Robust Low Cost Fan-Out Semiconductor Package App 20150155248 - Lin; Yaojian ; et al.	2015-06-04
Semiconductor Device and Method of Balancing Surfaces of an Embedded PCB Unit with a Dummy Copper Pattern App 20150115465 - Lin; Yaojian ; et al.	2015-04-30
Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP Grant 8,994,185 - Lin , et al. March 31, 2	2015-03-31
Semiconductor Device and Method of Controlling Warpage in Reconstituted Wafer App 20150084213 - Heng; Kian Meng ; et al.	2015-03-26
Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation App 20150061123 - Lin; Yaojian ; et al.	2015-03-05
Method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis Grant 8,962,476 - Lin , et al. February 24, 2	2015-02-24
Semiconductor Device and Method of Forming Through Mold Hole with Alignment and Dimension Control App 20150028471 - Lin; Yaojian ; et al.	2015-01-29
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation App 20150008597 - Lin; Yaojian ; et al.	2015-01-08
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation Grant 8,907,476 - Lin , et al. December 9, 2	2014-12-09
Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation Grant 8,900,929 - Lin , et al. December 2, 2	2014-12-02
Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die App 20140339683 - Lin; Yaojian ; et al.	2014-11-20
Semiconductor device and method of forming insulating layer around semiconductor die Grant 8,878,359 - Lin , et al. November 4, 2	2014-11-04
Semiconductor Method and Device of Forming a Fan-Out POP Device with PWB Vertical Interconnect Units App 20140319679 - Lin; Yaojian ; et al.	2014-10-30
Semiconductor Device and Method of Forming Embedded Conductive Layer for Power/Ground Planes in FO-EWLB App 20140252573 - Lin; Yaojian ; et al.	2014-09-11
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die App 20140252654 - Lin; Yaojian ; et al.	2014-09-11
Methods for treating IgE-mediated disorder Grant 8,828,394 - Cerutti , et al. September 9, 2	2014-09-09
Semiconductor Device and Method of Forming Insulating Layer Disposed Over the Semiconductor Die For Stress Relief App 20140246779 - Lin; Yaojian ; et al.	2014-09-04
Semiconductor Device and Method of Forming Micro-Vias Partially Through Insulating Material Over Bump Interconnect Conductive Layer for Stress Relief App 20140239496 - Lin; Yaojian ; et al.	2014-08-28
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP App 20140239495 - Lin; Yaojian ; et al.	2014-08-28
Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units Grant 8,810,024 - Lin , et al. August 19, 2	2014-08-19
Semiconductor Device and Method of Forming Stress Relieving Vias for Improved Fan-Out WLCSP Package App 20140217597 - Lin; Yaojian ; et al.	2014-08-07
Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP Grant 8,796,846 - Lin , et al. August 5, 2	2014-08-05
Semiconductor device and method of forming micro-vias partially through insulating material over bump interconnect conductive layer for stress relief Grant 8,791,008 - Lin , et al. July 29, 2	2014-07-29
Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die Grant 8,786,100 - Lin , et al. July 22, 2	2014-07-22
Method And Device For Implementing Local Operation On Web Page App 20140201619 - Mo; Hongling ; et al.	2014-07-17
Integrated circuit packaging system with warpage control and method of manufacture thereof Grant 8,766,426 - Goh , et al. July 1, 2	2014-07-01
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 8,759,155 - Lin , et al. June 24, 2	2014-06-24
Semiconductor Device and Method of Forming a POP Device with Embedded Vertical Interconnect Units App 20140103527 - Marimuthu; Pandi C. ; et al.	2014-04-17
Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package App 20140091454 - Lin; Yaojian ; et al.	2014-04-03
Semiconductor Device with Protective Structure Around Semiconductor Die for Localized Planarization of Insulating Layer App 20140084424 - Lin; Yaojian ; et al.	2014-03-27
Semiconductor Device and Method of Forming Integrated Passive Device Over Semiconductor Die with Conductive Bridge and Fan-Out Redistribution Layer App 20140084415 - Lin; Yaojian ; et al.	2014-03-27
Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in Fo-WLCSP App 20140077363 - Lin; Yaojian ; et al.	2014-03-20
Semiconductor Device and Method of Forming Dual-Sided Interconnect Structures in FO-WLCSP App 20140077362 - Lin; Yaojian ; et al.	2014-03-20
Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants App 20140077381 - Lin; Yaojian ; et al.	2014-03-20
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over Carrier for Testing at Interim Stages App 20140077361 - Lin; Yaojian ; et al.	2014-03-20
Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP App 20140061944 - Lin; Yaojian ; et al.	2014-03-06
Semiconductor Device and Method of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units App 20140048906 - Shim; Il Kwon ; et al.	2014-02-20
Semiconductor device and method of forming FO-WLCSP with multiple encapsulants Grant 8,648,470 - Lin , et al. February 11, 2	2014-02-11
Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer Grant 8,642,446 - Lin , et al. February 4, 2	2014-02-04
Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro Via Array for 3-D FO-WLCSP App 20140027929 - Lin; Yaojian ; et al.	2014-01-30
Semiconductor device and method of forming integrated passive device over semiconductor die with conductive bridge and fan-out redistribution layer Grant 8,624,353 - Lin , et al. January 7, 2	2014-01-07
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out Package App 20130341784 - Lin; Yaojian ; et al.	2013-12-26
Semiconductor device and method of forming thick encapsulant for stiffness with recesses for stress relief in Fo-WLCSP Grant 8,610,286 - Lin , et al. December 17, 2	2013-12-17
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Grant 8,592,311 - Lin , et al. November 26, 2	2013-11-26
Semiconductor device and method of forming vertical interconnect structure with conductive micro via array for 3-D Fo-WLCSP Grant 8,592,992 - Lin , et al. November 26, 2	2013-11-26
Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area Grant 8,575,018 - Lin , et al. November 5, 2	2013-11-05
Semiconductor Method and Device of Forming a Fan-Out Device with PWB Vertical Interconnect Units App 20130277851 - Lin; Yaojian ; et al.	2013-10-24
Semiconductor Method of Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units App 20130249101 - Lin; Yaojian ; et al.	2013-09-26
Semiconductor Method and Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units App 20130249115 - Lin; Yaojian ; et al.	2013-09-26
Semiconductor Device and Method of Forming RDL Wider than Contact Pad Along First Axis and Narrower than Contact Pad along Second Axis App 20130249111 - Lin; Yaojian ; et al.	2013-09-26
Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation App 20130249080 - Lin; Yaojian ; et al.	2013-09-26
Semiconductor Device and Method of Forming a Robust Fan-Out Package including Vertical Interconnects and Mechanical Support Layer App 20130249106 - Lin; Yaojian ; et al.	2013-09-26
Semiconductor Device and Method of Forming Micro-Vias Partially through Insulating Material over Bump Interconnect Conductive Layer for Stress Relief App 20130249105 - Lin; Yaojian ; et al.	2013-09-26
Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers App 20130241048 - Lin; Yaojian ; et al.	2013-09-19
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP App 20130200528 - Lin; Yaojian ; et al.	2013-08-08
Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis Grant 8,501,618 - Lin , et al. August 6, 2	2013-08-06
Semiconductor device and method for forming semiconductor package having build-up interconnect structure over semiconductor die with different CTE insulating layers Grant 8,492,203 - Lin , et al. July 23, 2	2013-07-23
Semiconductor Device and Method of Making Integrated Passive Devices App 20130175668 - Lin; Yaojian ; et al.	2013-07-11
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief App 20130175696 - Lin; Yaojian ; et al.	2013-07-11
Semiconductor Device and Method of Forming Vertical Interconnect Structure with Conductive Micro Via Array for 3-D FO-WLCSP App 20130154108 - Lin; Yaojian ; et al.	2013-06-20
Semiconductor Device and Method of Forming Thick Encapsulant for Stiffness with Recesses for Stress Relief in FO-WLCSP App 20130147054 - Lin; Yaojian ; et al.	2013-06-13
Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die App 20130147019 - Lin; Yaojian ; et al.	2013-06-13
Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers App 20130140719 - Lin; Yaojian ; et al.	2013-06-06
Integrated circuit packaging system with warpage control and method of manufacture thereof Grant 8,455,991 - Hsiao , et al. June 4, 2	2013-06-04
Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief Grant 8,456,002 - Lin , et al. June 4, 2	2013-06-04
Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die Grant 8,445,990 - Lin , et al. May 21, 2	2013-05-21
Semiconductor package with semiconductor core structure and method of forming same Grant 8,445,323 - Lin , et al. May 21, 2	2013-05-21
Semiconductor Device And Method Of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief App 20130113092 - Lin; Yaojian ; et al.	2013-05-09
Integrated circuit packaging system with active surface heat removal and method of manufacture thereof Grant 8,421,212 - Chen , et al. April 16, 2	2013-04-16
Semiconductor device and method of forming insulating layer around semiconductor die Grant 8,409,926 - Lin , et al. April 2, 2	2013-04-02
Semiconductor device and method of making integrated passive devices Grant 8,409,970 - Lin , et al. April 2, 2	2013-04-02
Semiconductor Device and Method of Forming Stacked Vias Within Interconnect Structure for FO-WLCSP App 20130075924 - Lin; Yaojian ; et al.	2013-03-28
Integrated Circuit Packaging System With A Substrate Embedded Dummy-die Paddle And Method Of Manufacture Thereof App 20130075922 - Huang; Rui ; et al.	2013-03-28
Semiconductor Device and Method of Forming Protection and Support Structure for Conductive Interconnect Structure App 20130069225 - Lin; Yaojian ; et al.	2013-03-21
Semiconductor Device and Method of Forming Protection and Support Structure for Conductive Interconnect Structure App 20130069227 - Lin; Yaojian ; et al.	2013-03-21
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die App 20130056879 - Lin; Yaojian ; et al.	2013-03-07
Semiconductor Device and Method for Forming Passive Circuit Elements With Through Silicon Vias to Backside Interconnect Structures App 20130015554 - Lin; Yaojian ; et al.	2013-01-17
Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die Grant 8,343,809 - Lin , et al. January 1, 2	2013-01-01
Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area App 20120299176 - Lin; Yaojian ; et al.	2012-11-29
Semiconductor Device and Method of Forming an IPD over a High-Resistivity Encapsulant Separated from other IPDS and Baseband Circuit App 20120292738 - Lin; Yaojian ; et al.	2012-11-22
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Grant 8,310,058 - Lin , et al. November 13, 2	2012-11-13
Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit Grant 8,263,437 - Lin , et al. September 11, 2	2012-09-11
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation App 20120199965 - Lin; Yaojian ; et al.	2012-08-09
Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component App 20120187572 - Lin; Yaojian ; et al.	2012-07-26
Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants App 20120187568 - Lin; Yaojian ; et al.	2012-07-26
Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers App 20120187584 - Lin; Yaojian ; et al.	2012-07-26
Semiconductor Device and Method of Forming Vertical Interconnect Structure in Substrate for IPD and Baseband Circuit Separated by High-Resistivity Molding Compound App 20120175784 - Lin; Yaojian ; et al.	2012-07-12
Semiconductor Package with Semiconductor Core Structure and Method of Forming Same App 20120175732 - Lin; Yaojian ; et al.	2012-07-12
Semiconductor Device and Method of Forming Integrated Passive Device Over Semiconductor Die with Conductive Bridge and Fan-Out Redistribution Layer App 20120161279 - Lin; Yaojian ; et al.	2012-06-28
Semiconductor Device and Method of Forming Openings Through Insulating Layer Over Encapsulant for Enhanced Adhesion of Interconnect Structure App 20120146236 - Lin; Yaojian ; et al.	2012-06-14
Semiconductor Device and Method of Forming an Inductor Within Interconnect Layer Vertically Separated from Semiconductor Die App 20120146181 - Lin; Yaojian ; et al.	2012-06-14
Semiconductor package with semiconductor core structure and method of forming the same Grant 8,193,604 - Lin , et al. June 5, 2	2012-06-05
Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation Grant 8,183,095 - Lin , et al. May 22, 2	2012-05-22
Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component Grant 8,183,087 - Lin , et al. May 22, 2	2012-05-22
Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief App 20120112340 - Lin; Yaojian ; et al.	2012-05-10
Semiconductor device and method of forming vertical interconnect structure in substrate for IPD and baseband circuit separated by high-resistivity molding compound Grant 8,168,470 - Lin , et al. May 1, 2	2012-05-01
Integrated Circuit Packaging System With Warpage Control And Method Of Manufacture Thereof App 20120074588 - Hsiao; Yung Kuan ; et al.	2012-03-29
Semiconductor Device and Method of Forming Protective Structure Around Semiconductor Die for Localized Planarization of Insulating Layer App 20120074534 - Lin; Yaojian ; et al.	2012-03-29
Integrated Circuit Packaging System With Warpage Control And Method Of Manufacture Thereof App 20120074560 - Goh; Hin Hwa ; et al.	2012-03-29
Integrated Circuit Packaging System With Active Surface Heat Removal And Method Of Manufacture Thereof App 20120068328 - Chen; Kang ; et al.	2012-03-22
Semiconductor device and method of forming high-frequency circuit structure and method thereof Grant 8,110,477 - Lin , et al. February 7, 2	2012-02-07
METHODS FOR TREATING IgE-MEDIATED DISORDER App 20120020979 - Cerutti; Andrea ; et al.	2012-01-26
Semiconductor Device and Method of Forming RDL over Contact Pad with High Alignment Tolerance or Reduced Interconnect Pitch App 20120018874 - Lin; Yaojian ; et al.	2012-01-26
Semiconductor Device and Method of Forming RDL Wider than Contact Pad along First Axis and Narrower than Contact Pad Along Second Axis App 20120018904 - Lin; Yaojian ; et al.	2012-01-26
Bounce attack prevention based on e-mail message tracking Grant 8,103,627 - Qiu , et al. January 24, 2	2012-01-24
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP App 20110278736 - Lin; Yaojian ; et al.	2011-11-17
Semiconductor Device and Method of Forming Sacrificial Protective Layer to Protect Semiconductor Die Edge During Singulation App 20110221057 - Lin; Yaojian ; et al.	2011-09-15
Semiconductor Device and Method of Forming Insulating Layer Around Semiconductor Die App 20110221041 - Lin; Yaojian ; et al.	2011-09-15
Semiconductor Device and Method of Forming Repassivation Layer with Reduced Opening to Contact Pad of Semiconductor Die App 20110221055 - Lin; Yaojian ; et al.	2011-09-15
Semiconductor Device Having Embedded Integrated Passive Devices Electrically Interconnected Using Conductive Pillars App 20110163414 - Lin; Yaojian ; et al.	2011-07-07
Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area App 20110127668 - Lin; Yaojian ; et al.	2011-06-02
Semiconductor device and method of embedding integrated passive devices into the package electrically interconnected using conductive pillars Grant 7,935,570 - Lin , et al. May 3, 2	2011-05-03
Semiconductor Package with Semiconductor Core Structure and Method of Forming the Same App 20110068468 - Lin; Yaojian ; et al.	2011-03-24
Semiconductor package with semiconductor core structure and method of forming same Grant 7,858,441 - Lin , et al. December 28, 2	2010-12-28
Semiconductor Device and Method of Forming High-Frequency Circuit Structure and Method Thereof App 20100264512 - Lin; Yaojian ; et al.	2010-10-21
Semiconductor device and method of forming integrated passive device module Grant 7,790,503 - Lin , et al. September 7, 2	2010-09-07
Semiconductor device and method of forming high-frequency circuit structure and method thereof Grant 7,772,081 - Lin , et al. August 10, 2	2010-08-10
Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate Grant 7,749,814 - Lin , et al. July 6, 2	2010-07-06
Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP App 20100148360 - Lin; Yaojian ; et al.	2010-06-17
Semiconductor Package with Semiconductor Core Structure and Method of Forming Same App 20100140779 - Lin; Yaojian ; et al.	2010-06-10
Semiconductor Device and Method of Embedding Integrated Passive Devices into the Package Electrically Interconnected Using Conductive Pillars App 20100140736 - Lin; Yaojian ; et al.	2010-06-10
Semiconductor Device and Method for Forming Passive Circuit Elements With Through Silicon Vias to Backside Interconnect Structures App 20100140737 - Lin; Yaojian ; et al.	2010-06-10
Semiconductor Device and Method of Forming Vertical Interconnect Structure in Substrate for IPD and Baseband Circuit Separated by High-Resistivity Molding Compound App 20100140772 - Lin; Yaojian ; et al.	2010-06-10
Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures Grant 7,691,747 - Lin , et al. April 6, 2	2010-04-06
Semiconductor Device and Method of Forming High-Frequency Circuit Structure and Method Thereof App 20100065942 - Lin; Yaojian ; et al.	2010-03-18
Semiconductor Device and Method of Forming a Fan-Out Structure with Integrated Passive Device and Discrete Component App 20100059855 - Lin; Yaojian ; et al.	2010-03-11
Semiconductor Device and Method of Forming an IPD over a High-Resistivity Encapsulant Separated from other IPDS and Baseband Circuit App 20100059854 - Lin; Yaojian ; et al.	2010-03-11
Semiconductor Device and Method of Forming Shielding Layer over Integrated Passive Device Using Conductive Channels App 20100059853 - Lin; Yaojian ; et al.	2010-03-11
Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Grant 7,642,128 - Lin , et al. January 5, 2	2010-01-05
Semiconductor Device With Integrated Passive Circuit and Method of Making the Same Using Sacrificial Substrate App 20090230542 - Lin; Yaojian ; et al.	2009-09-17
Organic electroluminescent display panel with dummy areas Grant 7,564,183 - Luo , et al. July 21, 2	2009-07-21
Semiconductor Device and Method of Forming Integrated Passive Device Module App 20090155959 - Lin; Yaojian ; et al.	2009-06-18
Semiconductor Device and Method for Forming Passive Circuit Elements with Through Silicon Vias to Backside Interconnect Structures App 20090140381 - Lin; Yaojian ; et al.	2009-06-04
Semiconductor Device and Method of Making Integrated Passive Devices App 20090140421 - Lin; Yaojian ; et al.	2009-06-04
Organic electroluminescent display panel App 20060273711 - Luo; Tzeng-Cherng ; et al.	2006-12-07