| Patent | Date |
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Epoxy-containing Siloxane-modified Resin, Package Material, And Package Structure
App 20220169800 - CHEN; Wen-Bin ; et al. | 2022-06-02 |
Block copolymer, preparation method thereof, and thin film structure comprising the same
Grant 11,319,434 - Hsu , et al. May 3, 2 | 2022-05-03 |
Extracted material for forward osmosis, preparation method thereof, and forward-osmosis water desalination system using the same
Grant 11,273,410 - Chen , et al. March 15, 2 | 2022-03-15 |
Faucet Aerator
App 20210324616 - Chen; Wen-Pin ; et al. | 2021-10-21 |
Extracted Material For Forward Osmosis, Preparation Method Thereof, And Forward-osmosis Water Desalination System Using The Same
App 20210197123 - CHEN; Yi-Chun ; et al. | 2021-07-01 |
Block Copolymer, Preparation Method Thereof, And Thin Film Structure Comprising The Same
App 20210198474 - HSU; Meei-Yu ; et al. | 2021-07-01 |
Packaging material and film
Grant 10,717,806 - Chen , et al. | 2020-07-21 |
Multi-branched cationic phosphonium salt, forward osmosis extract employing the same and forward osmosis seawater desalination process
Grant 10,584,139 - Chen , et al. | 2020-03-10 |
Packaging Material And Film
App 20190127513 - CHEN; Wen-Bin ; et al. | 2019-05-02 |
Multi-branched Cationic Phosphonium Salt, Forward Osmosis Extract Employing The Same And Forward Osmosis Seawater Desalination Process
App 20180346496 - CHEN; Yi-Chun ; et al. | 2018-12-06 |
Optical solid state prepolymer and molding composition
Grant 9,773,958 - Chan , et al. September 26, 2 | 2017-09-26 |
Optical Solid State Prepolymer And Molding Composition
App 20170179349 - CHAN; Ying-Nan ; et al. | 2017-06-22 |
Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same
Grant 9,617,411 - Chan , et al. April 11, 2 | 2017-04-11 |
Siloxane resin composition, and photoelectric device employing the same
Grant 9,540,488 - Lin , et al. January 10, 2 | 2017-01-10 |
Organic-inorganic Hybrid Resin, Molding Composition, And Photoelectric Device Employing The Same
App 20150197631 - CHAN; Ying-Nan ; et al. | 2015-07-16 |
Encapsulant composition for a light-emitting diode
Grant 8,013,039 - Hsu , et al. September 6, 2 | 2011-09-06 |
Encapsulant Composition For A Light-emitting Diode
App 20090093570 - Hsu; Chia-Wen ; et al. | 2009-04-09 |
Chip package structure and process for fabricating the same
Grant 7,230,331 - Chen , et al. June 12, 2 | 2007-06-12 |
Process For Fabricating Chip Package Structure
App 20070072339 - Chen; Kai-Chi ; et al. | 2007-03-29 |
Chip Package Structure
App 20060261499 - Chen; Kai-Chi ; et al. | 2006-11-23 |
Chip package structure
Grant 7,061,103 - Chen , et al. June 13, 2 | 2006-06-13 |
Chip package structure
Grant 7,057,277 - Chen , et al. June 6, 2 | 2006-06-06 |
Chip package structure and process for fabricating the same
App 20050087852 - Chen, Kai-Chi ; et al. | 2005-04-28 |
Fine conductive particles for making anisotropic conductive adhesive composition
Grant 6,841,094 - Li , et al. January 11, 2 | 2005-01-11 |
Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedly
Grant 6,821,818 - Chen , et al. November 23, 2 | 2004-11-23 |
[chip Package Structure]
App 20040212970 - Chen, Kai-Chi ; et al. | 2004-10-28 |
[chip Package Structure]
App 20040212056 - Chen, Kai-Chi ; et al. | 2004-10-28 |
[chip Package Structure And Process For Fabricating The Same]
App 20040212080 - Chen, Kai-Chi ; et al. | 2004-10-28 |
Method Of Assembling A Semiconductor Device Including Sweeping (with A Squeegee) Encapsulant Over The Device Repeatedly
App 20040180472 - Chen, Kai-Chi ; et al. | 2004-09-16 |
Fine conductive particles for making anisotropic conductive adhesive composition
App 20040056236 - Li, Hsun-Tien ; et al. | 2004-03-25 |
Dielectric compositions having two steps of laminating temperatures
Grant 6,627,684 - Lee , et al. September 30, 2 | 2003-09-30 |
Dielectric compositions having two steps of laminating temperatures
App 20020123540 - Lee, Tzong-Ming ; et al. | 2002-09-05 |
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