CHEN; Jyh-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHEN; Jyh-Wei.The latest application filed is for "chip package and manufacturing method thereof".
- CHEN; Jyh-Wei - New Taipei City TW
- Chen; Jyh-Wei - Taipei County TW
- Chen; Jyh-Wei - Taipei TW
- Chen; Jyh-Wei - Taipei City TW
- Chen, Jyh-Wei - Jhonghe City TW
| Patent | Date |
|---|---|
| Chip Package And Manufacturing Method Thereof App 20180012853 - LIN; Hsi-Chien ; et al. | 2018-01-11 |
| Chip Scale Sensing Chip Package And A Manufacturing Method Thereof App 20170025370 - CHEN; Yin-Chen ; et al. | 2017-01-26 |
| Promoters and usage thereof Grant 8,114,665 - Wu , et al. February 14, 2 | 2012-02-14 |
| Promoters And Usage Thereof App 20090093048 - WU; Wen-Jung ; et al. | 2009-04-09 |
| Method of designing an RPWM inverter with unwanted harmonic elimination Grant 7,420,824 - Chen September 2, 2 | 2008-09-02 |
| Method of designing an RPWM inverter with unwanted harmonic elimination App 20070242489 - Chen; Jyh-Wei | 2007-10-18 |
| Promoters and usage thereof App 20050164369 - Chen, I-Ching ; et al. | 2005-07-28 |
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