Chen; Ju-Shi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Ju-Shi.The latest application filed is for "3dic structure and method for hybrid bonding semiconductor wafers".
- Chen; Ju-Shi - Tainan TW
- Chen; Ju-Shi - Tainan City TW
- Chen; Ju-Shi - Hsin-Chu TW
| Patent | Date |
|---|---|
| 3DIC structure and method for hybrid bonding semiconductor wafers Grant 9,887,182 - Chen , et al. February 6, 2 | 2018-02-06 |
| 3DIC Structure and Method for Hybrid Bonding Semiconductor Wafers App 20170309603 - Chen; Ju-Shi ; et al. | 2017-10-26 |
| Hybrid bond using a copper alloy for yield improvement Grant 9,728,521 - Tsai , et al. August 8, 2 | 2017-08-08 |
| 3DIC structure and method for hybrid bonding semiconductor wafers Grant 9,666,566 - Chen , et al. May 30, 2 | 2017-05-30 |
| Hybrid Bond Using A Copper Alloy For Yield Improvement App 20170025381 - Tsai; Yu-Cheng ; et al. | 2017-01-26 |
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