CHEN; Jenchun

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHEN; Jenchun.The latest application filed is for "semiconductor device package and method of manufacturing the same".

Company Profile

0.9.11

CHEN; Jenchun - Kaohsiung TW
Chen; Jenchun - New Taipei TW
CHEN; JENCHUN - NEW TAIPEI CITY TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Package And Method Of Manufacturing The Same App 20220181182 - CHEN; Jenchun ; et al.	2022-06-09
Optical device and method for manufacturing the same Grant 11,342,476 - Chen May 24, 2	2022-05-24
Semiconductor Device Package And Method Of Manufacturing The Same App 20220068665 - CHEN; Jenchun ; et al.	2022-03-03
Semiconductor Device Package And Method Of Manufacturing The Same App 20210398921 - CHEN; Jenchun ; et al.	2021-12-23
Tape, encapsulating process and optical device Grant 11,094,858 - Chen August 17, 2	2021-08-17
Semiconductor Device Package And Method For Manufacturing The Same App 20210233868 - CHEN; Jenchun	2021-07-29
Tape, Encapsulating Process And Optical Device App 20210036194 - CHEN; Jenchun	2021-02-04
Optical Device And Method For Manufacturing The Same App 20210005772 - CHEN; Jenchun	2021-01-07
Semiconductor package and method of manufacturing the same Grant 10,872,866 - Chen December 22, 2	2020-12-22
Compartment shielding for warpage improvement Grant 10,784,230 - Chen Sept	2020-09-22
Optical device and method for manufacturing the same Grant 10,734,540 - Chen	2020-08-04
Semiconductor Package And Method Of Manufacturing The Same App 20200111752 - CHEN; Jenchun	2020-04-09
Electronic module and method for manufacturing the same, and thermoelectric device including the same Grant 10,396,264 - Chen A	2019-08-27
Compartment Shielding For Warpage Improvement App 20180138148 - CHEN; Jenchun	2018-05-17
Electronic Module And Method For Manufacturing The Same, And Thermoelectric Device Including The Same App 20180130937 - CHEN; Jenchun	2018-05-10
3D stacked package structure and method of manufacturing the same Grant 9,167,686 - Chen , et al. October 20, 2	2015-10-20
Method of manufacturing electronic package module and electronic package module manufactured by the same Grant 9,105,613 - Chen , et al. August 11, 2	2015-08-11
Package structure and manufacturing method thereof Grant 8,742,573 - Chen , et al. June 3, 2	2014-06-03
3d Stacked Package Structure And Method Of Manufacturing The Same App 20140104799 - CHEN; JENCHUN ; et al.	2014-04-17
Package Structure And Manufacturing Method Thereof App 20140084483 - CHEN; JENCHUN ; et al.	2014-03-27

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