CHEN; Jen-Yu

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHEN; Jen-Yu.The latest application filed is for "aqueous polymer, dispersion, and aqueous paint".

Company Profile

0.8.10

CHEN; Jen-Yu - New Taipei City TW
Chen; Jen-Yu - New Taipei TW
Chen; Jen-Yu - Hsin-Chu TW
Chen; Jen Yu - Hsinchu N/A TW
Chen; Jen-Yu - Hsin-Chu City TW
Chen; Jen Yu - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Aqueous Polymer, Dispersion, And Aqueous Paint App 20210070947 - CHANG; Cha-Wen ; et al.	2021-03-11
Aqueous Polymer, Dispersion, And Aqueous Paint App 20210070925 - CHANG; Cha-Wen ; et al.	2021-03-11
Polymer and dispersion Grant 10,213,758 - Chang , et al. Feb	2019-02-26
Optical sensing module with multi-directional optical sensing function Grant 9,976,898 - Shen , et al. May 22, 2	2018-05-22
Semiconductor device and method of forming recesses in conductive layer to detect continuity for interconnect between semiconductor die and substrate Grant 9,685,402 - Chen , et al. June 20, 2	2017-06-20
Optical Sensing Module With Multi-directional Optical Sensing Function App 20170167914 - Shen; Chi-Chih ; et al.	2017-06-15
Polymer And Dispersion App 20170128899 - CHANG; Cha-Wen ; et al.	2017-05-11
Package Structure App 20170133290 - Li; Kuo-Hsiung ; et al.	2017-05-11
Package structure Grant 9,627,286 - Li , et al. April 18, 2	2017-04-18
Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate Grant 9,478,513 - Chen , et al. October 25, 2	2016-10-25
Semiconductor Device with Conductive Pillars Having Recesses or Protrusions to Detect Interconnect Continuity Between Semiconductor Die and Substrate App 20140225256 - Chen; Jen Yu ; et al.	2014-08-14
Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate Grant 8,741,764 - Chen , et al. June 3, 2	2014-06-03
Semiconductor Device and Method of Forming Conductive Pillars Having Recesses or Protrusions to Detect Interconnect Continuity Between Semiconductor Die and Substrate App 20130146872 - Chen; Jen Yu ; et al.	2013-06-13
Semiconductor Device and Method of Forming Recesses in Conductive Layer to Detect Continuity for Interconnect Between Semiconductor Die and Substrate App 20130147035 - Chen; Jen Yu ; et al.	2013-06-13

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