CHEN; Jen-Mao

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHEN; Jen-Mao.The latest application filed is for "active cooling devices for cooling an electronic assembly downstream of a computing system".

Company Profile

4.6.7

CHEN; Jen-Mao - Taoyuan City TW
Chen; Jen-Mao - Taoyuan TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Active Cooling Devices For Cooling An Electronic Assembly Downstream Of A Computing System App 20220279677 - CHEN; Jen-Mao ; et al.	2022-09-01
Automated fan adjustment system Grant 11,333,157 - Chen , et al. May 17, 2	2022-05-17
Automated Fan Adjustment System App 20210172448 - CHEN; Yi-Chieh ; et al.	2021-06-10
Open Compute Project Card Auxiliary Mode Cooling App 20210173457 - CHEN; Yi-Chieh ; et al.	2021-06-10
External air baffle nozzle Grant 10,986,751 - Chen , et al. April 20, 2	2021-04-20
Add-on processing unit with I/O connectors Grant 10,381,761 - Jau , et al. A	2019-08-13
Dynamically Adjust Maximum Fan Duty In A Server System App 20190116690 - CHEN; Chao-Jung ; et al.	2019-04-18
Bidirectional and uniform cooling for multiple components in a computing device Grant 10,219,365 - Chen , et al. Feb	2019-02-26
Add-on Processing Unit With I/o Connectors App 20190027850 - JAU; Maw-Zan ; et al.	2019-01-24
Different HDD gap architecture to reduce upstream preheat for high-density storage Grant 9,968,005 - Chen , et al. May 8, 2	2018-05-08
System with fresh air flow toward downstream components for cooling Grant 9,968,009 - Chen , et al. May 8, 2	2018-05-08
System With Fresh Air Flow Toward Downstream Components For Cooling App 20170325361 - CHEN; Chao-Jung ; et al.	2017-11-09
Different Hdd Gap Architecture To Reduce Upstream Preheat For High-density Storage App 20170265332 - CHEN; Chao-Jung ; et al.	2017-09-14

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