Chen; Jau-Shoung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Jau-Shoung.The latest application filed is for "flip chip package process".
Company Profile
0.24.32
- Chen; Jau-Shoung - Hsinchu County TW
- Chen; Jau-Shoung - Hsinchu Hsien TW
- Chen; Jau-Shoung - Jubei TW
- Chen, Jau-Shoung - Jubei City TW
- Chen; Jau-Shoung - Hsinchu TW
Patent Activity
| Patent | Date |
|---|---|
| Thermally enhanced package structure Grant 8,059,422 - Tong , et al. November 15, 2 | 2011-11-15 |
| Flip chip package process Grant 7,614,888 - Tong , et al. November 10, 2 | 2009-11-10 |
| Flip-chip package structure with stiffener Grant 7,538,421 - Chen May 26, 2 | 2009-05-26 |
| Flip Chip Package Process App 20090087947 - Tong; Ho-Ming ; et al. | 2009-04-02 |
| Manufacturing Process And Structure Of A Thermally Enhanced Package App 20090075027 - Tong; Ho-Ming ; et al. | 2009-03-19 |
| Semiconductor Package Having Electromagnetic Interference Shielding And Fabricating Method Thereof App 20080009104 - Chen; Jau-Shoung | 2008-01-10 |
| Flip-chip Package Structure With Stiffener App 20080001308 - Chen; Jau-Shoung | 2008-01-03 |
| Wafer-level package structure Grant 7,064,428 - Tong , et al. June 20, 2 | 2006-06-20 |
| Process Of Fabricating Flip-chip Packages App 20060063305 - Wei; Tzu-Chung ; et al. | 2006-03-23 |
| Bump manufacturing method Grant 6,989,326 - Tong , et al. January 24, 2 | 2006-01-24 |
| Bump fabrication process Grant 6,967,153 - Tong , et al. November 22, 2 | 2005-11-22 |
| Wafer bumping process with solder balls bonded to under bump metallurgy layer formed over active surface by forming flux on solder ball surfaces and reflowing the solder Grant 6,939,790 - Chen , et al. September 6, 2 | 2005-09-06 |
| Structure for preventing burnt fuse pad from further electrical connection Grant 6,927,964 - Tong , et al. August 9, 2 | 2005-08-09 |
| Bumping process Grant 6,908,842 - Chen , et al. June 21, 2 | 2005-06-21 |
| Method of modifying tin to lead ratio in tin-lead bump Grant 6,877,653 - Tong , et al. April 12, 2 | 2005-04-12 |
| Method of forming bump Grant 6,875,683 - Tong , et al. April 5, 2 | 2005-04-05 |
| Solder ball fabricating process Grant 6,861,346 - Tong , et al. March 1, 2 | 2005-03-01 |
| Process for fabricating wafer bumps Grant 6,846,719 - Tong , et al. January 25, 2 | 2005-01-25 |
| Bump manufacturing method Grant 6,827,252 - Tong , et al. December 7, 2 | 2004-12-07 |
| Bumping process App 20040127009 - Chen, Jau-Shoung ; et al. | 2004-07-01 |
| Bumping process App 20040127010 - Chen, Jau-Shoung ; et al. | 2004-07-01 |
| Method for preventing burnt fuse pad from further electrical connection Grant 6,756,256 - Tong , et al. June 29, 2 | 2004-06-29 |
| [solder Ball Fabricating Process] App 20040112944 - Tong, Ho-Ming ; et al. | 2004-06-17 |
| [structure For Preventing Burnt Fuse Pad From Further Electrical Connection] App 20040114294 - Tong, Ho-Ming ; et al. | 2004-06-17 |
| Bump fabrication process Grant 6,743,707 - Tong , et al. June 1, 2 | 2004-06-01 |
| Solder ball attaching process Grant 6,732,912 - Tong , et al. May 11, 2 | 2004-05-11 |
| Solder ball fabrication process Grant 6,723,630 - Tong , et al. April 20, 2 | 2004-04-20 |
| Bump fabrication method Grant 6,720,244 - Tong , et al. April 13, 2 | 2004-04-13 |
| Bump manufacturing method Grant 6,716,739 - Tong , et al. April 6, 2 | 2004-04-06 |
| Bumping process Grant 6,713,320 - Tong , et al. March 30, 2 | 2004-03-30 |
| Solder ball fabricating process Grant 6,673,711 - Tong , et al. January 6, 2 | 2004-01-06 |
| Bump fabrication process Grant 6,664,128 - Tong , et al. December 16, 2 | 2003-12-16 |
| Lead-free bump fabrication process Grant 6,617,237 - Tong , et al. September 9, 2 | 2003-09-09 |
| Solder Ball Attaching Process App 20030164395 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Under-ball metallic layer App 20030164552 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump fabrication method App 20030166332 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump Fabrication Process App 20030166330 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Bump Fabrication Process App 20030166331 - Tong, Ho-Ming ; et al. | 2003-09-04 |
| Flip Chip Interconnection Structure And Fabrication Process Thereof App 20030160335 - TONG, HO-MING ; et al. | 2003-08-28 |
| Bonding Structure For Bonding Substrates By Metal Studs App 20030161123 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Solder Ball Fabrication Process App 20030162379 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Method Of Modifying Tin To Lead Ratio In Tin-lead Bump App 20030160089 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Wafer-level Package Structure App 20030160323 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Bmuping Process App 20030162321 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Method For Preventing Burnt Fuse Pad From Further Electrical Connection App 20030162331 - TONG, HO-MING ; et al. | 2003-08-28 |
| Wafer Bump Fabrication Process App 20030162362 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Lead-free Bump Fabrication Process App 20030162381 - Tong, Ho-Ming ; et al. | 2003-08-28 |
| Solder Ball Fabricating Process App 20030162380 - TONG, HO-MING ; et al. | 2003-08-28 |
| Bump Forming Process App 20030157438 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump manufacturing method App 20030155406 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Process of fabricating bumps App 20030157791 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump Manufacturing Method App 20030157792 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Bump manufacturing method App 20030157789 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Method of forming bump App 20030157790 - Tong, Ho-Ming ; et al. | 2003-08-21 |
| Etching Method For Nickel-vanadium Alloy App 20030146191 - Tong, Ho-Ming ; et al. | 2003-08-07 |
| Bump Fabrication Process App 20030124833 - Tong , Ho-Ming ; et al. | 2003-07-03 |
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