Chen; I-I

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; I-I.The latest application filed is for "peeling-free porous capping material".

Company Profile

0.5.5

Chen; I-I - Taipei TW
Chen; I-I - Hsinchu TW
Chen; I-I - Hsinchu City TW
Chen; I-I - Taipei City TW
Chen; I. I. - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
UV curing of low-k porous dielectrics Grant 7,482,265 - Chen , et al. January 27, 2	2009-01-27
Method for forming dielectric film to improve adhesion of low-k film Grant 7,465,676 - Tsai , et al. December 16, 2	2008-12-16
Peeling-free porous capping material App 20080188074 - Chen; I-I ; et al.	2008-08-07
Initiation layer for reducing stress transition due to curing App 20080116578 - Wang; Kuan-Chen ; et al.	2008-05-22
Method for forming dielectric film to improve adhesion of low-k film App 20070249159 - Tsai; Fang Wen ; et al.	2007-10-25
UV curing of low-k porous dielectrics App 20070161230 - Chen; I-I ; et al.	2007-07-12
Multi-step plasma treatment method to improve CU interconnect electrical performance Grant 7,094,705 - Lin , et al. August 22, 2	2006-08-22
Multi-step plasma treatment method to improve CU interconnect electrical performance App 20050158999 - Lin, Keng-Chu ; et al.	2005-07-21
Single semiconductor wafer transfer method and manufacturing system Grant 5,976,199 - Wu , et al. November 2, 1	1999-11-02
Automated manufacturing plant for semiconductor devices Grant 5,842,917 - Soung , et al. December 1, 1	1998-12-01

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