Chen; Hung-Nan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Hung-Nan.The latest application filed is for "light-emitting diode chip and package structure thereof".

Company Profile

0.4.8

Chen; Hung-Nan - Kaohsiung Hsien TW
CHEN; HUNG-NAN - Kaohsiung City TW
Chen; Hung-Nan - Kaohsiung TW
Chen; Hung Nan - Niaosung TW
Chen, Hung Nan - Niaosung Kaohsiung CN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Micromechanical device with microfluidic lubricant channel Grant 8,247,879 - Chen , et al. August 21, 2	2012-08-21
Light-emitting Diode Chip And Package Structure Thereof App 20110241026 - CHEN; HUNG-NAN ; et al.	2011-10-06
Micromechanical Device With Microfluidic Lubricant Channel App 20110215430 - CHEN; Dongmin ; et al.	2011-09-08
Micromechanical device with microfluidic lubricant channel Grant 7,932,569 - Chen , et al. April 26, 2	2011-04-26
Method of Forming a Micromechanical Device with Microfluidic Lubricant Channel App 20080248613 - Chen; Dongmin ; et al.	2008-10-09
Micromechanical Device with Microfluidic Lubricant Channel App 20080179696 - Chen; Dongmin ; et al.	2008-07-31
Fabrication method for printed circuit board Grant 7,384,566 - Chen , et al. June 10, 2	2008-06-10
Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates App 20080096313 - Patel; Satayadev R. ; et al.	2008-04-24
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates Grant 7,307,775 - Patel , et al. December 11, 2	2007-12-11
Fabrication method for printed circuit board App 20050246892 - Chen, Hung-Nan ; et al.	2005-11-10
Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates App 20050074919 - Patel, Satayadev R. ; et al.	2005-04-07
Multi-chip module App 20020158318 - Chen, Hung Nan	2002-10-31

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