Chen; Hung Min

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Hung Min.The latest application filed is for "method of manufacturing printed circuit board with embedded electronic components positioned by using solder paste".

Company Profile

0.5.5

Chen; Hung Min - New Taipei TW
CHEN; HUNG MIN - NEW TAIPEI CITY TW
Chen; Hung-Min - Taipei N/A TW
Chen; Hung-Min - Kaohsiung TW
CHEN; Hung-Min - Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing printed circuit board with embedded electronic components positioned by using solder paste Grant 9,974,186 - Yeh , et al. May 15, 2	2018-05-15
Method Of Manufacturing Printed Circuit Board With Embedded Electronic Components Positioned By Using Solder Paste App 20170006708 - YEH; MING YI ; et al.	2017-01-05
Method for directly attaching dielectric to circuit board with embedded electronic devices Grant 9,443,743 - Yeh , et al. September 13, 2	2016-09-13
Method for making dual silicide and germanide semiconductors Grant 8,603,882 - Chen , et al. December 10, 2	2013-12-10
Semiconductor Structure And Fabricating Method Thereof App 20130320408 - CHEN; Szu-Hung ; et al.	2013-12-05
Method of manufacturing a multilayer printed circuit board with a built-in electronic device Grant 8,302,299 - Chou , et al. November 6, 2	2012-11-06
Method For Making Dual Silicide And Germanide Semiconductors App 20120190163 - Chen; Szu-Hung ; et al.	2012-07-26
Method Of Manufacturing A Multilayer Printed Circuit Board With A Built-in Electronic Device App 20110225816 - CHOU; Cheng-Hsien ; et al.	2011-09-22

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