Chen; Hung-Hsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Hung-Hsu.The latest application filed is for "method of manufacturing semiconductor devices with multiple silicide regions".
- Chen; Hung-Hsu - Tainan City TW
- Chen; Hung-Hsu - Tainan TW
- Chen; Hung-Hsu - Hsinchu TW
| Patent | Date |
|---|---|
| Method of Manufacturing Semiconductor Devices with Multiple Silicide Regions App 20220293474 - Loh; Wei-Yip ; et al. | 2022-09-15 |
| Contact Structure For Semiconductor Device And Method App 20220278199 - Tsai; Yan-Ming ; et al. | 2022-09-01 |
| Barrier-Free Approach for Forming Contact Plugs App 20220277997 - Chen; Ching-Yi ; et al. | 2022-09-01 |
| Contact with a silicide region Grant 11,411,094 - Cheng , et al. August 9, 2 | 2022-08-09 |
| Semiconductor device pre-cleaning Grant 11,373,905 - Chu , et al. June 28, 2 | 2022-06-28 |
| Method of manufacturing semiconductor devices with multiple silicide regions Grant 11,348,839 - Loh , et al. May 31, 2 | 2022-05-31 |
| Barrier-free approach for forming contact plugs Grant 11,342,225 - Chen , et al. May 24, 2 | 2022-05-24 |
| Contact structure for semiconductor device and method Grant 11,335,774 - Tsai , et al. May 17, 2 | 2022-05-17 |
| Ammonium Fluoride Pre-clean Protection App 20220149519 - CHU; Li-Wei ; et al. | 2022-05-12 |
| Semiconductor Device Pre-cleaning App 20220068712 - CHU; Li-Wei ; et al. | 2022-03-03 |
| Ammonium fluoride pre-clean protection Grant 11,232,947 - Chu , et al. January 25, 2 | 2022-01-25 |
| Deposition Window Enlargement App 20210407808 - Chou; Meng-Han ; et al. | 2021-12-30 |
| Semiconductor structure Grant 11,177,172 - Tsai , et al. November 16, 2 | 2021-11-16 |
| Conductive Feature Formation and Structure App 20210296168 - Loh; Wei-Yip ; et al. | 2021-09-23 |
| Conductive feature formation and structure Grant 11,031,286 - Loh , et al. June 8, 2 | 2021-06-08 |
| Contact Structure For Semiconductor Device And Method App 20210118994 - Tsai; Yan-Ming ; et al. | 2021-04-22 |
| Semiconductor Device and Method of Manufacturing App 20210035868 - Loh; Wei-Yip ; et al. | 2021-02-04 |
| Barrier-Free Approach For Forming Contact Plugs App 20210035861 - Chen; Ching-Yi ; et al. | 2021-02-04 |
| Treatment for Adhesion Improvement App 20200388485 - Chen; Ching-Yi ; et al. | 2020-12-10 |
| Formation of copper layer structure with self anneal strain improvement Grant 10,840,184 - Nian , et al. November 17, 2 | 2020-11-17 |
| Treatment for adhesion improvement Grant 10,755,917 - Chen , et al. A | 2020-08-25 |
| Method of Forming a Contact with a Silicide Region App 20200152763 - Cheng; Yu-Wen ; et al. | 2020-05-14 |
| Semiconductor Structure App 20200083100 - TSAI; YAN-MING ; et al. | 2020-03-12 |
| Method of forming a contact with a silicide region Grant 10,535,748 - Cheng , et al. Ja | 2020-01-14 |
| Treatment for Adhesion Improvement App 20200006055 - Chen; Ching-Yi ; et al. | 2020-01-02 |
| Semiconductor structure and method for manufacturing the same Grant 10,483,164 - Tsai , et al. Nov | 2019-11-19 |
| Conformal Metal Diffusion Barrier And Plasma Treatment For Oxidized Metal Barrier App 20190273147 - CHENG; Yu-Wen ; et al. | 2019-09-05 |
| Conductive Feature Formation and Structure App 20190273023 - LOH; Wei-Yip ; et al. | 2019-09-05 |
| Semiconductor Structure And Method For Manufacturing The Same App 20190148230 - TSAI; YAN-MING ; et al. | 2019-05-16 |
| Formation Of Copper Layer Structure With Self Anneal Strain Improvement App 20180138128 - NIAN; Jun-Nan ; et al. | 2018-05-17 |
| Formation of copper layer structure with self anneal strain improvement Grant 9,870,995 - Nian , et al. January 16, 2 | 2018-01-16 |
| Formation Of Copper Layer Structure With Self Anneal Strain Improvement App 20160372421 - NIAN; Jun-Nan ; et al. | 2016-12-22 |
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