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name:-0.022696018218994
name:-0.019232988357544
name:-0.00082516670227051
CHEN; Hui-Chang Patent Filings

CHEN; Hui-Chang

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHEN; Hui-Chang.The latest application filed is for "flash memory card without a substrate and its fabrication method".

Company Profile
0.17.20
  • CHEN; Hui-Chang - Hukou Shiang TW
  • Chen; Hui-Chang - Hsinchu TW
  • Chen; Hui-Chang - Kaohsiung TW
  • Chen; Hui-Chang - Kaohsiung City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Flash Memory Card Without A Substrate And Its Fabrication Method
App 20130069223 - CHEN; Hui-Chang
2013-03-21
Multi-chip memory package with a small substrate
Grant 8,368,192 - Chen February 5, 2
2013-02-05
Multi-chip Package Having Leaderframe-type Contact Fingers
App 20130009294 - CHEN; Hui-Chang
2013-01-10
Display panel having particular connections between conductive structure with shorting bars and testing lines
Grant 7,576,807 - Chen , et al. August 18, 2
2009-08-18
Flexible printed circuit and display device utilizing the same
Grant 7,576,992 - Chen , et al. August 18, 2
2009-08-18
Printed circuit board for preventing increase of thermal expansion
Grant 7,538,278 - Chen May 26, 2
2009-05-26
Bonding pad structure for a display device and fabrication method thereof
Grant 7,507,592 - Lee , et al. March 24, 2
2009-03-24
Liquid crystal display module
Grant 7,489,382 - Chen February 10, 2
2009-02-10
Thin film transistor substrate and manufacturing method thereof
Grant 7,390,734 - Chen , et al. June 24, 2
2008-06-24
Liquid crystal display devices
Grant 7,375,787 - Cheng , et al. May 20, 2
2008-05-20
Liquid crystal display module
App 20070273820 - Chen; Hui-Chang
2007-11-29
Thin Film Transistor Substrate And Manufacturing Method Thereof
App 20070231982 - Chen; Hui-Chang ;   et al.
2007-10-04
Liquid crystal display module with a filled wiring structure having square shaped pads distributed like a matrix
Grant 7,265,804 - Chen September 4, 2
2007-09-04
Display Panel
App 20070177066 - Chen; Hui-Chang ;   et al.
2007-08-02
Thin film transistor substrate and manufacturing method thereof
Grant 7,245,012 - Chen , et al. July 17, 2
2007-07-17
Bonding Pad Structure For A Display Device And Fabrication Method Thereof
App 20070155156 - Lee; Chun-Yu ;   et al.
2007-07-05
Flexible Printed Circuit And Display Device Utilizing The Same
App 20070144771 - Chen; Chien-Liang ;   et al.
2007-06-28
Liquid crystal display panel module and flexible printed circuit board thereof
App 20070103632 - Chen; Hui-Chang ;   et al.
2007-05-10
Bonding pad structure for a display device and fabrication method thereof
Grant 7,211,738 - Lee , et al. May 1, 2
2007-05-01
Liquid crystal display devices
App 20070030435 - Cheng; Ping-Chin ;   et al.
2007-02-08
Liquid crystal display module
Grant 7,142,262 - Chen , et al. November 28, 2
2006-11-28
Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
Grant 7,139,060 - Cheng , et al. November 21, 2
2006-11-21
Bonding configuration structure for facilitating electrical testing in a bonding process and a testing method using the same
Grant 7,030,622 - Chen , et al. April 18, 2
2006-04-18
Carrier
Grant 7,023,095 - Lee , et al. April 4, 2
2006-04-04
Bonding configuration structure for facilitating electrical testing in a bonding process and a testing method using the same
App 20060017448 - Chen; Hui-Chang ;   et al.
2006-01-26
Flat panel display and assembly process of the flat panel display
App 20050253993 - Chen, Yi-Ru ;   et al.
2005-11-17
Test pad array for contact resistance measuring of ACF bonds on a liquid crystal display panel
Grant 6,940,301 - Chen September 6, 2
2005-09-06
Thin film transistor substrate and manufacturing method thereof
App 20050184389 - Chen, Hui-Chang ;   et al.
2005-08-25
Carrier
App 20050167853 - Lee, Chun-Yu ;   et al.
2005-08-04
Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
App 20050162603 - Cheng, Ping-Chin ;   et al.
2005-07-28
Printed circuit board for preventing increase of thermal expansion
App 20050139382 - Chen, Hui-Chang
2005-06-30
Test pad array for contact resistance measuring of ACF bonds on a liquid crystal display panel
App 20050127936 - Chen, Hui-Chang
2005-06-16
Liquid crystal display module
App 20050083444 - Chen, Hui-Chang ;   et al.
2005-04-21
Liquid crystal display module
App 20050083473 - Chen, Hui-Chang
2005-04-21
Bonding pad structure for a display device and fabrication method thereof
App 20050072597 - Lee, Chun-Yu ;   et al.
2005-04-07

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