Chen; Huei-Jen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Huei-Jen.The latest application filed is for "chip package substrate having soft circuit board and method for fabricating the same".
- Chen; Huei-Jen - Yungho TW
- Chen; Huei-Jen - Yungho City TW
| Patent | Date |
|---|---|
| Method for fabricating a substrate, including a plurality of chip package substrates Grant 7,117,587 - Chen , et al. October 10, 2 | 2006-10-10 |
| Chip package substrate having soft circuit board and method for fabricating the same Grant 7,075,176 - Chen , et al. July 11, 2 | 2006-07-11 |
| Chip package substrate having soft circuit board and method for fabricating the same App 20060006487 - Chen; Huei-Jen ; et al. | 2006-01-12 |
| Chip package substrate having soft circuit board and method for fabricating the same App 20050001278 - Chen, Huei-Jen ; et al. | 2005-01-06 |
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