Chen; Hsu-Hsien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Hsu-Hsien.The latest application filed is for "semiconductor package and manufacturing process thereof".

Company Profile

4.11.12

Chen; Hsu-Hsien - Hsinchu City TW
Chen; Hsu-Hsien - Hsinchu TW
Chen; Hsu-Hsien - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package And Manufacturing Process Thereof App 20220246511 - Chu; Li-Huan ; et al.	2022-08-04
Semiconductor package and manufacturing process thereof Grant 11,315,860 - Chu , et al. April 26, 2	2022-04-26
Semiconductor Package And Manufacturing Process Thereof App 20210118789 - Chu; Li-Huan ; et al.	2021-04-22
Package structure having a plurality of conductive balls with narrow width for ball waist Grant 10,535,593 - Chang , et al. Ja	2020-01-14
Package Structure And Method Of Fabricating The Same App 20190252304 - Chang; Pi-Lan ; et al.	2019-08-15
Package structure having a plurality of conductive balls having narrow width for the ball waist Grant 10,276,481 - Chang , et al.	2019-04-30
Package Structure And Method Of Fabricating The Same App 20180374785 - Chang; Pi-Lan ; et al.	2018-12-27
Method for manufacturing semiconductor package structure Grant 10,037,973 - Tseng , et al. July 31, 2	2018-07-31
Package structures including a capacitor and methods of forming the same Grant 9,576,821 - Lo , et al. February 21, 2	2017-02-21
Method For Manufacturing Semiconductor Package Structure App 20160336298 - TSENG; HUA-WEI ; et al.	2016-11-17
Pop structures and methods of forming the same Grant 9,490,167 - Chen , et al. November 8, 2	2016-11-08
Methods and apparatus for forming package-on-packages Grant 9,478,474 - Chen , et al. October 25, 2	2016-10-25
Semiconductor package structure and manufacturing method thereof Grant 9,406,629 - Tseng , et al. August 2, 2	2016-08-02
Semiconductor Package Structure And Manufacturing Method Thereof App 20160111384 - TSENG; HUA-WEI ; et al.	2016-04-21
POP Structures and Methods of Forming the Same App 20150155203 - Chen; Hsu-Hsien ; et al.	2015-06-04
POP structures and methods of forming the same Grant 8,975,726 - Chen , et al. March 10, 2	2015-03-10
Methods And Apparatus For Forming Package-on-packages App 20140185264 - Chen; Hsu-Hsien ; et al.	2014-07-03
Package Structures Including a Capacitor and Methods of Forming the Same App 20140127866 - Lo; Sut-I ; et al.	2014-05-08
POP Structures and Methods of Forming the Same App 20140103488 - Chen; Hsu-Hsien ; et al.	2014-04-17
Package structures including a capacitor and methods of forming the same Grant 8,653,626 - Lo , et al. February 18, 2	2014-02-18
Package Structures Including A Capacitor And Methods Of Forming The Same App 20140021583 - Lo; Sut-I ; et al.	2014-01-23

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