| Patent | Date |
|---|
Electronic Device
App 20220238477 - CHEN; HSIEN-TE | 2022-07-28 |
Micro semiconductor stacked structure and electronic apparatus having the same
Grant 11,296,061 - Chen April 5, 2 | 2022-04-05 |
Electrical Device
App 20210225905 - CHEN; Hsien-Te | 2021-07-22 |
Method of medical image registration
Grant 11,062,445 - Hsieh , et al. July 13, 2 | 2021-07-13 |
Photoelectric Device
App 20210202281 - CHEN; Hsien-Te | 2021-07-01 |
Electronic Device
App 20210202814 - CHEN; Hsien-Te | 2021-07-01 |
Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
Grant 10,994,516 - Liao , et al. May 4, 2 | 2021-05-04 |
Method Of Using Optoelectronic Semiconductor Stamp To Manufacture Optoelectronic Semiconductor Device
App 20210111148 - CHEN; Hsien-Te | 2021-04-15 |
Method Of Medical Image Registration
App 20210065359 - HSIEH; Bao-Yu ; et al. | 2021-03-04 |
Electronic Detection Interface And Electronic Detection Module Using The Same
App 20210050381 - CHEN; Hsien-Te | 2021-02-18 |
Target substrate with micro semiconductor structures
Grant 10,872,801 - Chen December 22, 2 | 2020-12-22 |
Pre-conductive array disposed on target circuit substrate and conductive structure array thereof
Grant 10,854,566 - Chen December 1, 2 | 2020-12-01 |
Micro Semiconductor Stacked Structure And Electronic Apparatus Having The Same
App 20200350298 - CHEN; HSIEN-TE | 2020-11-05 |
Luminance compensation method of light-emitting device
Grant 10,796,628 - Chen October 6, 2 | 2020-10-06 |
Display device
Grant 10,672,347 - Chen | 2020-06-02 |
Manufacturing method of optoelectronic semiconductor device
Grant 10,600,932 - Chen | 2020-03-24 |
Optoelectronic semiconductor device
Grant 10,566,322 - Chen Feb | 2020-02-18 |
Pre-conductive Array Disposed On Target Circuit Substrate And Conductive Structure Array Thereof
App 20190393179 - CHEN; Hsien-Te | 2019-12-26 |
Method of batch transferring micro semiconductor structures
Grant 10,504,872 - Chen Dec | 2019-12-10 |
Pre-conductive array disposed on target circuit substrate and conductive structure array thereof
Grant 10,431,561 - Chen O | 2019-10-01 |
Manufacturing Method Of Optoelectronic Semiconductor Device
App 20190280151 - CHEN; Hsien-Te | 2019-09-12 |
Optoelectronic Semiconductor Stamp And Manufacturing Method Thereof, And Optoelectronic Semiconductor
App 20190189477 - CHEN; Hsien-Te | 2019-06-20 |
Luminance Compensation Method Of Light-emitting Device
App 20190130819 - CHEN; Hsien-Te | 2019-05-02 |
Display Device
App 20190114974 - CHEN; Hsien-Te | 2019-04-18 |
Pre-conductive Array Disposed On Target Circuit Substrate And Conductive Structure Array Thereof
App 20190096835 - CHEN; Hsien-Te | 2019-03-28 |
Resin Composition, And Pre-preg, Metal-clad Laminate And Printed Circuit Board Prepared Using The Same
App 20190071548 - LIAO; CHIH-WEI ; et al. | 2019-03-07 |
Target Substrate With Micro Semiconductor Structures
App 20190074206 - CHEN; Hsien-Te | 2019-03-07 |
Method Of Batch Transferring Micro Semiconductor Structures
App 20190035688 - CHEN; Hsien-Te | 2019-01-31 |
Method Of Batch Transferring Micro Semiconductor Structures
App 20180294248 - CHEN; Hsien-Te | 2018-10-11 |
Resin composition and uses of the same
Grant 10,081,728 - Liu , et al. September 25, 2 | 2018-09-25 |
Optoelectronic Semiconductor Device
App 20170365588 - CHEN; Hsien-Te | 2017-12-21 |
Prepreg And Uses Of The Same
App 20150189746 - Liao; Chih-Wei ; et al. | 2015-07-02 |
Resin composition, and prepreg and printed circuit board prepared using the same
Grant 8,846,790 - Liu , et al. September 30, 2 | 2014-09-30 |
Epoxy resin composition, and prepreg and printed circuit board using the same
Grant 8,748,513 - Chen June 10, 2 | 2014-06-10 |
Resin composition and uses of the same
Grant 8,734,950 - Chen , et al. May 27, 2 | 2014-05-27 |
Resin Compositions And Uses Of The Same
App 20140072807 - YU; Te-Liang ; et al. | 2014-03-13 |
Resin Composition And Uses Of The Same
App 20140044973 - Liu; Kai-Lun ; et al. | 2014-02-13 |
Epoxy Resin Composition, And Prepreg And Printed Circuit Board Using The Same
App 20140039094 - CHEN; Hsien Te | 2014-02-06 |
Epoxy Resin Composition, And Prepreg And Printed Circuit Board Usng The Same
App 20130306357 - HSU; Hsuan Hao ; et al. | 2013-11-21 |
Stable solution of the polymer prepared from N,O-heterocycles and its preparation method and use
Grant 8,580,916 - Liao , et al. November 12, 2 | 2013-11-12 |
Epoxy Resin Composition, And Prepreg And Metal-clad Laminate Using The Same
App 20130143046 - CHEN; HSIEN TE ; et al. | 2013-06-06 |
Epoxy resin composition, and prepreg and printed circuit board using the same
Grant 8,383,738 - Chen , et al. February 26, 2 | 2013-02-26 |
Fused Filler And Its Manufacturing Method And Use
App 20120329912 - LIU; Cheng-Ping ; et al. | 2012-12-27 |
Resin Composition, And Prepreg And Printed Circuit Board Prepared Using The Same
App 20120279769 - Liu; Cheng Ping ; et al. | 2012-11-08 |
Resin Composition And Uses Of The Same
App 20120263955 - Chen; Hsien-Te ; et al. | 2012-10-18 |
Stacked multi-chip
Grant 8,174,126 - Hwang , et al. May 8, 2 | 2012-05-08 |
Resin Composition, and Prepreg and Printed Circuit Board Prepared Using the Same
App 20120097437 - Liao; Shih-Hao ; et al. | 2012-04-26 |
Epoxy Resin Blend
App 20120055704 - TSENG; Tsung Fan ; et al. | 2012-03-08 |
Stable Solution of the Polymer Prepared from N,O-Heterocycles and its Preparation Method and Use
App 20120059096 - Liao; Shih-Hao ; et al. | 2012-03-08 |
Epoxy Resin Composition, And Prepreg And Printed Circuit Board Using The Same
App 20120024580 - HSU; Hsuan Hao ; et al. | 2012-02-02 |
Epoxy Resin Composition, And Prepreg And Printed Circuit Board Using The Same
App 20110303446 - Chen; Hsien-Te ; et al. | 2011-12-15 |
Epoxy Resin Composition, And Prepreg And Printed Circuit Board Using The Same
App 20110284276 - CHEN; Hsien Te | 2011-11-24 |
Epoxy Resin Composition, And Prepreg And Printed Circuit Board Using The Same
App 20110253433 - CHEN; Hsien-Te | 2011-10-20 |
Epoxy Resin Composition, And Prepreg And Printed Circuit Board Using The Same
App 20110253434 - CHEN; Hsien-Te | 2011-10-20 |
Reverse-biased PN diode decoupling capacitor
Grant 7,550,820 - Chen , et al. June 23, 2 | 2009-06-23 |
Reverse-biased PN diode decoupling capacitor
App 20080122036 - Chen; Hsien-Te ; et al. | 2008-05-29 |
Fence assembly with projected light
App 20080099751 - Chen; Hsien-Te | 2008-05-01 |
Artistic bulbs
App 20070041184 - Lavy; Danny ; et al. | 2007-02-22 |
Connector structure for rope light
App 20040043667 - Chen, Hsien-Te | 2004-03-04 |
Light bar for decorative lamp strip
App 20040012956 - Chen, Hsien-Te | 2004-01-22 |
Collapsible lampshade
App 20030189833 - Chen, Hsien-Te | 2003-10-09 |
Method for cell modeling and timing verification of chip designs with voltage drop
Grant 6,453,443 - Chen , et al. September 17, 2 | 2002-09-17 |
System and measuring access time of embedded memories
Grant 6,424,583 - Sung , et al. July 23, 2 | 2002-07-23 |
System For Measuring Access Time Of Embedded Memories
App 20020075740 - Sung, Nai-Yin ; et al. | 2002-06-20 |
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