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Piezoelectric Anti-stiction Structure For Microelectromechanical Systems
App 20220306452 - Hu; Fan ; et al. | 2022-09-29 |
Piezoelectric anti-stiction structure for microelectromechanical systems
Grant 11,365,115 - Hu , et al. June 21, 2 | 2022-06-21 |
MEMS device
Grant 11,220,422 - Hu , et al. January 11, 2 | 2022-01-11 |
Semiconductor arrangement and formation thereof
Grant 10,981,781 - Huang , et al. April 20, 2 | 2021-04-20 |
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
Grant 10,961,118 - Lee , et al. March 30, 2 | 2021-03-30 |
Piezoelectric Anti-stiction Structure For Microelectromechanical Systems
App 20210061641 - Hu; Fan ; et al. | 2021-03-04 |
Semiconductor Device Comprising Different Types Of Microelectromechanical Systems Devices
App 20210061647 - Chen; Hsiang-Fu ; et al. | 2021-03-04 |
A Semiconductor Device Having Microelectromechanical Systems Devices With Improved Cavity Pressure Uniformity
App 20210060610 - Chiu; I-Hsuan ; et al. | 2021-03-04 |
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
Grant 10,899,608 - Lee , et al. January 26, 2 | 2021-01-26 |
Mems Device
App 20200290863 - HU; FAN ; et al. | 2020-09-17 |
MEMS structure with bilayer stopper and method for forming the same
Grant 10,618,801 - Tai , et al. | 2020-04-14 |
Semiconductor Arrangement And Formation Thereof
App 20200062587 - Huang; Hsin-Ting ; et al. | 2020-02-27 |
Wafer level integrated MEMS device enabled by silicon pillar and smart cap
Grant 10,556,792 - Lee , et al. Feb | 2020-02-11 |
Wafer Level Integrated Mems Device Enabled By Silicon Pillar And Smart Cap
App 20200024137 - Lee; Yi-Chia ; et al. | 2020-01-23 |
Wafer Level Integrated Mems Device Enabled By Silicon Pillar And Smart Cap
App 20200024136 - Lee; Yi-Chia ; et al. | 2020-01-23 |
Semiconductor arrangement and formation thereof
Grant 10,464,808 - Huang , et al. No | 2019-11-05 |
Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity
Grant 10,392,244 - Hung , et al. A | 2019-08-27 |
Wafer Level Integrated Mems Device Enabled By Silicon Pillar And Smart Cap
App 20190161346 - Lee; Yi-Chia ; et al. | 2019-05-30 |
MEMS device with enhanced sensing structure and manufacturing method thereof
Grant 10,266,396 - Shen , et al. | 2019-04-23 |
Mems Device With Enhanced Sensing Structure And Manufacturing Method Thereof
App 20180339899 - SHEN; CHING-KAI ; et al. | 2018-11-29 |
Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications
Grant 10,131,540 - Yu , et al. November 20, 2 | 2018-11-20 |
Method of selectively removing an anti-stiction layer on a eutectic bonding area
Grant 10,053,361 - Hsieh , et al. August 21, 2 | 2018-08-21 |
Mems Structure With Bilayer Stopper And Method For Forming The Same
App 20180127263 - TAI; Wen-Chuan ; et al. | 2018-05-10 |
Semiconductor Arrangement And Formation Thereof
App 20180022602 - Huang; Hsin-Ting ; et al. | 2018-01-25 |
Microelectromechanical systems (MEMS) devices at different pressures
Grant 9,856,139 - Huang , et al. January 2, 2 | 2018-01-02 |
Monolithic MEMS platform for integrated pressure, temperature, and gas sensor
Grant 9,845,236 - Yu , et al. December 19, 2 | 2017-12-19 |
Semiconductor arrangement and formation thereof
Grant 9,776,858 - Huang , et al. October 3, 2 | 2017-10-03 |
Microelectromechanical Systems (mems) Devices At Different Pressures
App 20170233249 - Huang; Hsin-Ting ; et al. | 2017-08-17 |
Thin film structure for hermetic sealing
Grant 9,714,166 - Yu , et al. July 25, 2 | 2017-07-25 |
Microelectromechanical systems (MEMS) devices at different pressures
Grant 9,656,857 - Huang , et al. May 23, 2 | 2017-05-23 |
Method For Sealing A Cavity Of A Microelectromechanical Systems (mems) Device Using A Seal Layer Covering Or Lining A Hole In Fluid Communication With The Cavity
App 20170121174 - Hung; Chia-Ming ; et al. | 2017-05-04 |
Semiconductor device and method of manufacturing
Grant 9,630,832 - Lin , et al. April 25, 2 | 2017-04-25 |
Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device
Grant 9,567,204 - Hung , et al. February 14, 2 | 2017-02-14 |
Structure And Method To Mitigate Soldering Offset For Wafer-level Chip Scale Package (wlcsp) Applications
App 20160264402 - Yu; Shao-Chi ; et al. | 2016-09-15 |
Monolithic Mems Platform For Integrated Pressure, Temperature, And Gas Sensor
App 20160266061 - Yu; Shao-Chi ; et al. | 2016-09-15 |
Semiconductor device and manufacturing method thereof
Grant 9,422,151 - Tai , et al. August 23, 2 | 2016-08-23 |
Method of Selectively Removing an Anti-Stiction Layer on a Eutectic Bonding Area
App 20160185592 - Hsieh; Yuan-Chih ; et al. | 2016-06-30 |
Structure and method for motion sensor
Grant 9,365,416 - Shu , et al. June 14, 2 | 2016-06-14 |
Microelectromechanical Systems (mems) Devices At Different Pressures
App 20160130137 - Huang; Hsin-Ting ; et al. | 2016-05-12 |
High Vacuum Sealing for Sensor Platform Process
App 20160060103 - Hung; Chia-Ming ; et al. | 2016-03-03 |
Micro-electro mechanical system (MEMS) structures and methods of forming the same
Grant 9,266,714 - Shu , et al. February 23, 2 | 2016-02-23 |
Thin Film Structure For Hermetic Sealing
App 20160016789 - Yu; Shao-Chi ; et al. | 2016-01-21 |
Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)
Grant 9,202,792 - Yu , et al. December 1, 2 | 2015-12-01 |
Structure And Method Of Providing A Re-distribution Layer (rdl) And A Through-silicon Via (tsv)
App 20150311168 - YU; SHAO-CHI ; et al. | 2015-10-29 |
Semiconductor Arrangement And Formation Thereof
App 20150239732 - Huang; Hsin-Ting ; et al. | 2015-08-27 |
Semiconductor Device And Method Of Manufacturing
App 20150175406 - LIN; Chin-Min ; et al. | 2015-06-25 |
Electrical bypass structure for MEMS device
Grant 8,878,312 - Hung , et al. November 4, 2 | 2014-11-04 |
Micro-electro Mechanical System (mems) Structures And Methods Of Forming The Same
App 20140203421 - SHU; Chia-Pao ; et al. | 2014-07-24 |
Hybrid MEMS bump design to prevent in-process and in-use stiction
Grant 8,723,280 - Shu , et al. May 13, 2 | 2014-05-13 |
Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same
Grant 8,716,852 - Shu , et al. May 6, 2 | 2014-05-06 |
Hybrid Mems Bump Design To Prevent In-process And In-use Stiction
App 20140035072 - Shu; Chia-Pao ; et al. | 2014-02-06 |
Micro-electro Mechanical Systems (mems) Structures And Methods Of Forming The Same
App 20130214400 - SHU; Chia-Pao ; et al. | 2013-08-22 |
Structure And Method For Motion Sensor
App 20130043510 - Shu; Chia-Pao ; et al. | 2013-02-21 |
Process for eliminating delamination between amorphous silicon layers
Grant 8,309,441 - Lee , et al. November 13, 2 | 2012-11-13 |
Electrical Bypass Structure For Mems Device
App 20120223613 - Hung; Chia-Ming ; et al. | 2012-09-06 |
Infrared imaging sensor and vacuum packaging method thereof
App 20060219924 - Lee; Tzong-Sheng ; et al. | 2006-10-05 |
Method for fabricating a hollow micro-needle array
App 20050011858 - Kuo, Shyh-Chyi ; et al. | 2005-01-20 |
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