| Patent | Date |
|---|
Integrated thermoelectric cooling devices and methods for fabricating same
Grant 8,129,609 - Chen , et al. March 6, 2 | 2012-03-06 |
Carrier wafer having alignment keys and supporting a chip
Grant 8,004,097 - Chen , et al. August 23, 2 | 2011-08-23 |
Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate
Grant 7,947,566 - Chen , et al. May 24, 2 | 2011-05-24 |
Methods for forming co-planar wafer-scale chip packages
Grant 7,867,820 - Burrell , et al. January 11, 2 | 2011-01-11 |
Device and method for fabricating double-sided SOI wafer scale package with optical through via connections
Grant 7,736,949 - Chen , et al. June 15, 2 | 2010-06-15 |
Integrated Thermoelectric Cooling Devices and Methods for Fabricating Same
App 20090217961 - Chen; Howard Hao ; et al. | 2009-09-03 |
Integrated thermoelectric cooling devices and methods for fabricating same
Grant 7,544,883 - Chen , et al. June 9, 2 | 2009-06-09 |
Method And Apparatus For Making Coplanar Isolated Regions Of Different Semiconductor Materials On A Substrate
App 20090121312 - Chen; Howard Hao ; et al. | 2009-05-14 |
Cooling system for a semiconductor device and method of fabricating same
Grant 7,528,483 - Chen , et al. May 5, 2 | 2009-05-05 |
Device and method for fabricating double-sided SOI wafer scale package with optical through via connections
Grant 7,489,025 - Chen , et al. February 10, 2 | 2009-02-10 |
Methods to Achieve Precision Alignment for Wafter Scale Packages
App 20090020891 - Chen; Howard Hao ; et al. | 2009-01-22 |
Device And Method For Fabricating Double-sided Soi Wafer Scale Package With Optical Through Via Connections
App 20080318360 - CHEN; HOWARD HAO ; et al. | 2008-12-25 |
Methods for Forming Co-Planar Wafer-Scale Chip Packages
App 20080280399 - Burrell; Lloyd G. ; et al. | 2008-11-13 |
Methods to achieve precision alignment for wafer scale packages
Grant 7,442,579 - Chen , et al. October 28, 2 | 2008-10-28 |
Methods for forming co-planar wafer-scale chip packages
Grant 7,405,108 - Burrell , et al. July 29, 2 | 2008-07-29 |
Method and apparatus for making coplanar dielectrically-isolated regions of different semiconductor materials on a substrate
Grant 7,399,686 - Chen , et al. July 15, 2 | 2008-07-15 |
Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate
Grant 7,335,599 - Chen , et al. February 26, 2 | 2008-02-26 |
On-chip power supply regulator and temperature control system
Grant 7,214,910 - Chen , et al. May 8, 2 | 2007-05-08 |
Method and apparatus for making coplanar isolated regions of different semiconductor materials on a substrate
App 20070087525 - Chen; Howard Hao ; et al. | 2007-04-19 |
Cooling System For A Semiconductor Device And Method Of Fabricating Same
App 20070064395 - Chen; Howard Hao ; et al. | 2007-03-22 |
Method and apparatus for making coplanar dielectrically-isolated regions of different semiconductor materials on a substrate
App 20070048975 - Chen; Howard Hao ; et al. | 2007-03-01 |
Cooling system for a semiconductor device and method of fabricating same
Grant 7,170,164 - Chen , et al. January 30, 2 | 2007-01-30 |
Device and method for fabricating double-sided SOI wafer scale package with through via connections
Grant 7,098,070 - Chen , et al. August 29, 2 | 2006-08-29 |
Circuits and methods for matching device characteristics for analog and mixed-signal designs
Grant 7,086,020 - Chen , et al. August 1, 2 | 2006-08-01 |
Device and method for fabricating double-sided SOI wafer scale package with optical through via connections
App 20060113598 - Chen; Howard Hao ; et al. | 2006-06-01 |
Methods for forming co-planar wafer-scale chip packages
App 20060110851 - Burrell; Lloyd G. ; et al. | 2006-05-25 |
Methods to achieve precision alignment for wafer scale packages
App 20060110852 - Chen; Howard Hao ; et al. | 2006-05-25 |
Integrated thermoelectric cooling devices and methods for fabricating same
App 20060102223 - Chen; Howard Hao ; et al. | 2006-05-18 |
Device and method for fabricating double-sided SOI wafer scale package with through via connections
App 20060105496 - Chen; Howard Hao ; et al. | 2006-05-18 |
Cooling system for a semiconductor device and method of fabricating same
App 20060099815 - Chen; Howard Hao ; et al. | 2006-05-11 |
Cooling system for a semiconductor device and method of fabricating same
Grant 7,029,951 - Chen , et al. April 18, 2 | 2006-04-18 |
Global planarization of wafer scale package with precision die thickness control
Grant 7,005,319 - Chen , et al. February 28, 2 | 2006-02-28 |
On-chip power supply regulator and temperature control system
App 20060006166 - Chen; Howard Hao ; et al. | 2006-01-12 |
Circuits and methods for matching device characteristics for analog and mixed-signal designs
App 20050132314 - Chen, Howard Hao ; et al. | 2005-06-16 |
Cooling system for a semiconductor device and method of fabricating same
App 20050059238 - Chen, Howard Hao ; et al. | 2005-03-17 |
Method of automating chip power consumption estimation calculation
Grant 6,865,722 - Chen , et al. March 8, 2 | 2005-03-08 |
Semiconductor high dielectric constant decoupling capacitor structures and process for fabrication
Grant 6,781,185 - Chen , et al. August 24, 2 | 2004-08-24 |
Method of automating chip power consumption estimation calculation
App 20040117745 - Chen, Howard Hao ; et al. | 2004-06-17 |
Low-power static column redundancy scheme for semiconductor memories
Grant 6,603,690 - Chen , et al. August 5, 2 | 2003-08-05 |
Semiconductor high dielectric constant decoupling capacitor structures and process for fabrication
App 20020163058 - Chen, Howard Hao ; et al. | 2002-11-07 |
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