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Substrate Structuring Methods
App 20220278248 - CHEN; Han-Wen ; et al. | 2022-09-01 |
Drying process for high aspect ratio features
Grant 11,424,137 - Gouk , et al. August 23, 2 | 2022-08-23 |
Laser ablation for package fabrication
Grant 11,400,545 - Leschkies , et al. August 2, 2 | 2022-08-02 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
Grant 11,398,433 - Chen , et al. July 26, 2 | 2022-07-26 |
Methods for improved polymer-copper adhesion
Grant 11,388,822 - Chakraborty , et al. July 12, 2 | 2022-07-12 |
Method for substrate registration and anchoring in inkjet printing
Grant 11,367,643 - Zhang , et al. June 21, 2 | 2022-06-21 |
Substrate structuring methods
Grant 11,362,235 - Chen , et al. June 14, 2 | 2022-06-14 |
Method For Via Formation By Micro-imprinting
App 20220171281 - GOUK; Roman ; et al. | 2022-06-02 |
Method of fine redistribution interconnect formation for advanced packaging applications
Grant 11,342,256 - Chen , et al. May 24, 2 | 2022-05-24 |
Package Structures With Built-in Emi Shielding
App 20220157740 - VERHAVERBEKE; Steven ; et al. | 2022-05-19 |
Anchoring dies using 3D printing to form reconstructed wafer
Grant 11,329,003 - Zhang , et al. May 10, 2 | 2022-05-10 |
High Connectivity Device Stacking
App 20220139884 - LESCHKIES; Kurtis ; et al. | 2022-05-05 |
Method for substrate registration and anchoring in inkjet printing
Grant 11,322,381 - Zhang , et al. May 3, 2 | 2022-05-03 |
Method for via formation by micro-imprinting
Grant 11,281,094 - Gouk , et al. March 22, 2 | 2022-03-22 |
Methods for Improved Polymer-Copper Adhesion
App 20220071023 - Chakraborty; Tapash ; et al. | 2022-03-03 |
Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
Grant 11,264,333 - Chen , et al. March 1, 2 | 2022-03-01 |
Package structure and fabrication methods
Grant 11,264,331 - Chen , et al. March 1, 2 | 2022-03-01 |
High connectivity device stacking
Grant 11,257,790 - Leschkies , et al. February 22, 2 | 2022-02-22 |
Laser Ablation System For Package Fabrication
App 20220028709 - LESCHKIES; Kurtis ; et al. | 2022-01-27 |
Laser Ablation For Package Fabrication
App 20210346983 - LESCHKIES; Kurtis ; et al. | 2021-11-11 |
Reduced volume processing chamber
Grant 11,133,174 - Gouk , et al. September 28, 2 | 2021-09-28 |
High Connectivity Device Stacking
App 20210288027 - LESCHKIES; Kurtis ; et al. | 2021-09-16 |
Reconstituted Substrate Structure And Fabrication Methods For Heterogeneous Packaging Integration
App 20210257307 - CHEN; Han-Wen ; et al. | 2021-08-19 |
Package Core Assembly And Fabrication Methods
App 20210257289 - CHEN; Han-Wen ; et al. | 2021-08-19 |
Package Structure And Fabrication Methods
App 20210257306 - CHEN; Han-Wen ; et al. | 2021-08-19 |
Package Core Assembly And Fabrication Methods
App 20210249345 - CHEN; Han-Wen ; et al. | 2021-08-12 |
Substrate Structuring Methods
App 20210234060 - CHEN; Han-Wen ; et al. | 2021-07-29 |
Substrate structuring methods
Grant 11,063,169 - Chen , et al. July 13, 2 | 2021-07-13 |
Package Core Assembly And Fabrication Methods
App 20210159160 - CHEN; Han-Wen ; et al. | 2021-05-27 |
Package Core Assembly And Fabrication Methods
App 20210159158 - CHEN; Han-Wen ; et al. | 2021-05-27 |
Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures
Grant 11,011,392 - Verhaverbeke , et al. May 18, 2 | 2021-05-18 |
Package structure with embedded core
Grant 10,937,726 - Chen , et al. March 2, 2 | 2021-03-02 |
Package structure and fabrication methods
Grant 10,886,232 - Chen , et al. January 5, 2 | 2021-01-05 |
Method For Substrate Registration And Anchoring In Inkjet Printing
App 20200411351 - Zhang; Daihua ; et al. | 2020-12-31 |
Anchoring Dies Using 3d Printing To Form Reconstructed Wafer
App 20200411447 - Zhang; Daihua ; et al. | 2020-12-31 |
Method For Substrate Registration And Anchoring In Inkjet Printing
App 20200411312 - Zhang; Daihua ; et al. | 2020-12-31 |
Planarization Methods For Packaging Substrates
App 20200391343 - CHEN; Han-Wen ; et al. | 2020-12-17 |
Reconstituted Substrate Structure And Fabrication Methods For Heterogeneous Packaging Integration
App 20200395305 - CHEN; Han-Wen ; et al. | 2020-12-17 |
Reconstituted Substrate Structure And Fabrication Methods For Heterogeneous Packaging Integration
App 20200395304 - CHEN; Han-Wen ; et al. | 2020-12-17 |
Reconstituted Substrate Structure And Fabrication Methods For Heterogeneous Packaging Integration
App 20200395306 - CHEN; Han-Wen ; et al. | 2020-12-17 |
Package Structure And Fabrication Methods
App 20200357749 - CHEN; Han-Wen ; et al. | 2020-11-12 |
Substrate Structuring Methods
App 20200357947 - CHEN; Han-Wen ; et al. | 2020-11-12 |
Package Structure And Fabrication Methods
App 20200357750 - CHEN; Han-Wen ; et al. | 2020-11-12 |
Drying process for high aspect ratio features
Grant 10,777,405 - Gouk , et al. Sept | 2020-09-15 |
Method Of Fine Redistribution Interconnect Formation For Advanced Packaging Applications
App 20200243432 - CHEN; Han-Wen ; et al. | 2020-07-30 |
Method for via formation in flowable epoxy materials by micro-imprint
Grant 10,727,083 - Gouk , et al. | 2020-07-28 |
Method For Via Formation By Micro-imprinting
App 20200159113 - GOUK; Roman ; et al. | 2020-05-21 |
Substrate support and baffle apparatus
Grant 10,573,510 - Gouk , et al. Feb | 2020-02-25 |
Stiction-free Drying Process With Contaminant Removal For High-aspect Ratio Semiconductor Device Structures
App 20190287823 - VERHAVERBEKE; Steven ; et al. | 2019-09-19 |
Small Thermal Mass Pressurized Chamber
App 20190273002 - GOUK; Roman ; et al. | 2019-09-05 |
Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures
Grant 10,354,892 - Verhaverbeke , et al. July 16, 2 | 2019-07-16 |
Reduced Volume Processing Chamber
App 20190214247 - GOUK; Roman ; et al. | 2019-07-11 |
Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device STR
Grant 10,347,511 - Verhaverbeke , et al. July 9, 2 | 2019-07-09 |
Method Of Reconstituted Substrate Formation For Advanced Packaging Applications
App 20190181019 - CHEN; Han-Wen ; et al. | 2019-06-13 |
Small thermal mass pressurized chamber
Grant 10,304,703 - Gouk , et al. | 2019-05-28 |
Apparatus And Methods For Packaging Semiconductor Dies
App 20190139788 - FU; Boyi ; et al. | 2019-05-09 |
Supercritical carbon dioxide process for low-k thin films
Grant 10,283,344 - Verhaverbeke , et al. | 2019-05-07 |
Method of redistribution layer formation for advanced packaging applications
Grant 10,229,827 - Chen , et al. | 2019-03-12 |
Method of reconstituted substrate formation for advanced packaging applications
Grant 10,211,072 - Chen , et al. Feb | 2019-02-19 |
Method Of Reconstituted Substrate Formation For Advanced Packaging Applications
App 20180374718 - CHEN; Han-Wen ; et al. | 2018-12-27 |
Method Of Redistribution Layer Formation For Advanced Packaging Applications
App 20180374696 - CHEN; Han-Wen ; et al. | 2018-12-27 |
Substrate Support And Baffle Apparatus
App 20180350593 - GOUK; Roman ; et al. | 2018-12-06 |
Substrate support and baffle apparatus
Grant 10,032,624 - Gouk , et al. July 24, 2 | 2018-07-24 |
Stiction-free Drying Process With Contaminant Removal For High-aspect Ratio Semiconductor Device Str
App 20170250094 - VERHAVERBEKE; Steven ; et al. | 2017-08-31 |
Supercritical Carbon Dioxide Process For Low-k Thin Films
App 20170148624 - VERHAVERBEKE; Steven ; et al. | 2017-05-25 |
Substrate Support And Baffle Apparatus
App 20170098542 - GOUK; Roman ; et al. | 2017-04-06 |
Reduced Volume Processing Chamber
App 20170098537 - GOUK; Roman ; et al. | 2017-04-06 |
Drying Process For High Aspect Ratio Features
App 20170098541 - GOUK; Roman ; et al. | 2017-04-06 |
Small Thermal Mass Pressurized Chamber
App 20170098555 - GOUK; Roman ; et al. | 2017-04-06 |
Stiction-free Drying Process With Contaminant Removal For High-aspect Ratio Semiconductor Device Structures
App 20140144462 - VERHAVERBEKE; Steven ; et al. | 2014-05-29 |
Super-hydrophobic And Oleophobic Transparent Coatings For Displays
App 20130302595 - LIU; Biao ; et al. | 2013-11-14 |
Method of BARC removal in semiconductor device manufacturing
Grant 8,530,356 - Gouk , et al. September 10, 2 | 2013-09-10 |
Method of barc removal in semiconductor device manufacturing
App 20130089987 - Gouk; Roman ; et al. | 2013-04-11 |
Stiction-free drying of high aspect ratio devices
App 20130081301 - Gouk; Roman ; et al. | 2013-04-04 |
Post-ion implant cleaning for silicon on insulator substrate preparation
Grant 7,914,623 - Papanu , et al. March 29, 2 | 2011-03-29 |
Cleaning submicron structures on a semiconductor wafer surface
Grant 7,718,009 - Verhaverbeke , et al. May 18, 2 | 2010-05-18 |
Process And Hardware For Plasma Treatments
App 20100104953 - Papanu; James S. ; et al. | 2010-04-29 |
Post-ion implant cleaning for silicon on insulator substrate preparation
Grant 7,432,177 - Papanu , et al. October 7, 2 | 2008-10-07 |
Two Step Process For Post Ash Cleaning For Cu/low-k Dual Damascene Structure With Metal Hard Mask
App 20080163897 - TANG; JIANSHE ; et al. | 2008-07-10 |
Two step process for post ash cleaning for Cu/low-k dual damascene structure with metal hard mask
App 20080163905 - Tang; Jianshe ; et al. | 2008-07-10 |
Methods To Accelerate Photoimageable Material Stripping From A Substrate
App 20080078424 - Gouk; Roman ; et al. | 2008-04-03 |
Post-ion implant cleaning on silicon on insulator substrate preparation
App 20080081485 - Papanu; James S. ; et al. | 2008-04-03 |
Apparatus and methods for mask cleaning
App 20070068558 - Papanu; James S. ; et al. | 2007-03-29 |
Post-ion implant cleaning for silicon on insulator substrate preparation
App 20060286783 - Papanu; James S. ; et al. | 2006-12-21 |
Cleaning submicron structures on a semiconductor wafer surface
App 20060042651 - Verhaverbeke; Steven ; et al. | 2006-03-02 |
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