| Patent | Date |
|---|
Liquid crystal composition and its application
Grant 10,655,064 - Jiang , et al. | 2020-05-19 |
Liquid crystal composition and application thereof
Grant 10,557,082 - Chen , et al. Feb | 2020-02-11 |
Process-Induced Distortion Prediction and Feedforward and Feedback Correction of Overlay Errors
App 20190353582 - Vukkadala; Pradeep ; et al. | 2019-11-21 |
Liquid crystal composition containing 2-methyl-3,4,5-trifluorobenzene liquid crystal compound and application thereof
Grant 10,414,981 - Chen , et al. Sept | 2019-09-17 |
Systems, Methods And Metrics For Wafer High Order Shape Characterization And Wafer Classification Using Wafer Dimensional Geomet
App 20190271654 - Chen; Haiguang ; et al. | 2019-09-05 |
Process-induced distortion prediction and feedforward and feedback correction of overlay errors
Grant 10,401,279 - Vukkadala , et al. Sep | 2019-09-03 |
Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool
Grant 10,379,061 - Chen , et al. A | 2019-08-13 |
Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool
Grant 10,352,691 - Chen , et al. July 16, 2 | 2019-07-16 |
Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools
Grant 10,330,608 - Chen , et al. | 2019-06-25 |
System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
Grant 10,025,894 - Vukkadala , et al. July 17, 2 | 2018-07-17 |
Liquid Crystal Composition And Application Thereof
App 20180044592 - CHEN; Maoxian ; et al. | 2018-02-15 |
Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool
Grant 9,865,047 - Chen , et al. January 9, 2 | 2018-01-09 |
Liquid Crystal Composition Containing 2-methyl-3,4,5-trifluorobenzene Liquid Crystal Compound And Application Thereof
App 20170335189 - CHEN; Maoxian ; et al. | 2017-11-23 |
Liquid Crystal Composition And Its Application
App 20170313939 - Jiang; Tianmeng ; et al. | 2017-11-02 |
Systems and methods for wafer surface feature detection and quantification
Grant 9,702,829 - Chen , et al. July 11, 2 | 2017-07-11 |
Detection of selected defects in relatively noisy inspection data
Grant 9,646,379 - Chen , et al. May 9, 2 | 2017-05-09 |
Hybrid phase unwrapping systems and methods for patterned wafer measurement
Grant 9,632,038 - Chen , et al. April 25, 2 | 2017-04-25 |
Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool
Grant 9,546,862 - Chen , et al. January 17, 2 | 2017-01-17 |
Hybrid Phase Unwrapping Systems and Methods for Patterned Wafer Measurement
App 20160321799 - Chen; Haiguang ; et al. | 2016-11-03 |
System and Method to Emulate Finite Element Model Based Prediction of In-Plane Distortions Due to Semiconductor Wafer Chucking
App 20160283625 - Vukkadala; Pradeep ; et al. | 2016-09-29 |
System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking
Grant 9,430,593 - Vukkadala , et al. August 30, 2 | 2016-08-30 |
Detection of selected defects in relatively noisy inspection data
Grant 9,355,440 - Chen , et al. May 31, 2 | 2016-05-31 |
Systems and methods of advanced site-based nanotopography for wafer surface metrology
Grant 9,177,370 - Chen , et al. November 3, 2 | 2015-11-03 |
Methods and systems of object based metrology for advanced wafer surface nanotopography
Grant 9,031,810 - Chen , et al. May 12, 2 | 2015-05-12 |
Process-Induced Distortion Prediction and Feedforward and Feedback Correction of Overlay Errors
App 20150120216 - Vukkadala; Pradeep ; et al. | 2015-04-30 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
Grant 8,831,767 - Lehman , et al. September 9, 2 | 2014-09-09 |
Systems, Methods and Metrics for Wafer High Order Shape Characterization and Wafer Classification Using Wafer Dimensional Geometry Tool
App 20140114597 - Chen; Haiguang ; et al. | 2014-04-24 |
System and Method to Emulate Finite Element Model Based Prediction of In-Plane Distortions Due to Semiconductor Wafer Chucking
App 20140107998 - Vukkadala; Pradeep ; et al. | 2014-04-17 |
Methods and systems for improved localized feature quantification in surface metrology tools
Grant 8,630,479 - Chen , et al. January 14, 2 | 2014-01-14 |
Systems and methods for wafer edge feature detection and quantification
Grant 8,594,975 - Chen , et al. November 26, 2 | 2013-11-26 |
Systems And Methods For Wafer Surface Feature Detection, Classification And Quantification With Wafer Geometry Metrology Tools
App 20130304399 - Chen; Haiguang ; et al. | 2013-11-14 |
Systems and Methods of Advanced Site-Based Nanotopography for Wafer Surface Metrology
App 20130236085 - Chen; Haiguang ; et al. | 2013-09-12 |
Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer
Grant 8,494,802 - Chen , et al. July 23, 2 | 2013-07-23 |
Methods And Systems For Improved Localized Feature Quantification In Surface Metrology Tools
App 20120177282 - Chen; Haiguang ; et al. | 2012-07-12 |
Methods And Systems Of Object Based Metrology For Advanced Wafer Surface Nanotopography
App 20120179419 - Chen; Haiguang ; et al. | 2012-07-12 |
Methods And Systems For Monitoring A Parameter Of A Measurement Device During Polishing, Damage To A Specimen During Polishing, Or A Characteristic Of A Polishing Pad Or Tool
App 20110313558 - Lehman; Kurt ; et al. | 2011-12-22 |
Systems And Methods For Wafer Edge Feature Detection And Quantification
App 20110218762 - Chen; Haiguang ; et al. | 2011-09-08 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
Grant 8,010,222 - Lehman , et al. August 30, 2 | 2011-08-30 |
Computer-implemented Methods, Computer-readable Media, And Systems For Determining One Or More Characteristics Of A Wafer
App 20110196639 - Chen; Haiguang ; et al. | 2011-08-11 |
Methods and systems for detection of selected defects particularly in relatively noisy inspection data
Grant 7,711,521 - Wu , et al. May 4, 2 | 2010-05-04 |
Methods And Systems For Monitoring A Parameter Of A Measurement Device During Polishing, Damage To A Specimen During Polishing, Or A Characteristic Of A Polishing Pad Or Tool
App 20080207089 - Lehman; Kurt ; et al. | 2008-08-28 |
Methods and systems for detection of selected defects particularly in relatively noisy inspection data
Grant 7,373,277 - Wu , et al. May 13, 2 | 2008-05-13 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
Grant 7,332,438 - Lehman , et al. February 19, 2 | 2008-02-19 |
Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
Grant 7,175,503 - Lehman , et al. February 13, 2 | 2007-02-13 |
Methods and systems for detecting a presence of blobs on a specimen during a polishing process
App 20060148383 - Lehman; Kurt ; et al. | 2006-07-06 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
App 20060131273 - Lehman; Kurt ; et al. | 2006-06-22 |
Methods and systems for detecting a presence of blobs on a specimen during a polishing process
Grant 7,052,369 - Lehman , et al. May 30, 2 | 2006-05-30 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
Grant 7,030,018 - Lehman , et al. April 18, 2 | 2006-04-18 |
Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
Grant 6,935,922 - Lehman , et al. August 30, 2 | 2005-08-30 |
Systems and methods for characterizing a polishing process
Grant 6,884,146 - Lehman , et al. April 26, 2 | 2005-04-26 |
Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad
Grant 6,866,559 - Lehman , et al. March 15, 2 | 2005-03-15 |
Methods and systems for detecting a presence of blobs on a specimen during a polishing process
App 20030190864 - Lehman, Kurt ; et al. | 2003-10-09 |
Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing
App 20030181132 - Lehman, Kurt ; et al. | 2003-09-25 |
Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
App 20030180973 - Lehman, Kurt ; et al. | 2003-09-25 |
Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device
App 20030181138 - Lehman, Kurt ; et al. | 2003-09-25 |
Systems and methods for characterizing a polishing process
App 20030181131 - Lehman, Kurt ; et al. | 2003-09-25 |
Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad
App 20030181139 - Lehman, Kurt ; et al. | 2003-09-25 |
In-situ end point detection for semiconductor wafer polishing
Grant 6,514,775 - Chen , et al. February 4, 2 | 2003-02-04 |
In-situ End Point Detection For Semiconductor Wafer Polishing
App 20030003605 - Chen, Haiguang ; et al. | 2003-01-02 |
Adaptive digital image signal filtering
Grant 5,602,934 - Li , et al. February 11, 1 | 1997-02-11 |
T2 restoration and noise suppression of hybrid MR images using wiener and linear prediction techniques
Grant 5,578,923 - Chen November 26, 1 | 1996-11-26 |
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