Chen; Hai-Ming

Patent Applications and Registrations

Patent applications and USPTO patent grants for Chen; Hai-Ming.The latest application filed is for "integrated fan-out package and manufacturing method thereof".

Company Profile

8.9.10

Chen; Hai-Ming - Kaohsiung City TW
Chen; Hai-Ming - Kaohsiung TW
Chen; Hai-Ming - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Fan-out Package And Manufacturing Method Thereof App 20220270994 - Yu; Chi-Yang ; et al.	2022-08-25
Connector formation methods and packaged semiconductor devices Grant 11,424,199 - Cheng , et al. August 23, 2	2022-08-23
Integrated fan-out package and manufacturing method thereof Grant 11,355,461 - Yu , et al. June 7, 2	2022-06-07
Planarization of semiconductor packages and structures resulting therefrom Grant 11,127,644 - Yu , et al. September 21, 2	2021-09-21
Integrated Fan-out Package And Manufacturing Method Thereof App 20200328173 - Yu; Chi-Yang ; et al.	2020-10-15
Integrated fan-out package and manufacturing method thereof Grant 10,700,031 - Yu , et al.	2020-06-30
Connector Formation Methods and Packaged Semiconductor Devices App 20200083185 - Cheng; Jung Wei ; et al.	2020-03-12
Metallization Patterns in Semiconductor Packages and Methods of Forming the Same App 20200006171 - Yu; Chi-Yang ; et al.	2020-01-02
Planarization of semiconductor packages and structures resulting therefrom Grant 10,522,436 - Yu , et al. Dec	2019-12-31
Connector formation methods and packaged semiconductor devices Grant 10,522,486 - Cheng , et al. Dec	2019-12-31
Metallization Patterns In Semiconductor Packages And Methods Of Forming The Same App 20190148250 - Yu; Chi-Yang ; et al.	2019-05-16
Integrated Fan-out Package And Manufacturing Method Thereof App 20190131262 - Yu; Chi-Yang ; et al.	2019-05-02
Integrated fan-out package and manufacturing method thereof Grant 10,157,871 - Yu , et al. Dec	2018-12-18
Packages with Die Stack Including Exposed Molding Underfill App 20180033775 - Liu; Yu-Chih ; et al.	2018-02-01
Connector Formation Methods and Packaged Semiconductor Devices App 20170352632 - Cheng; Jung Wei ; et al.	2017-12-07
Packages with die stack including exposed molding underfill Grant 9,793,242 - Liu , et al. October 17, 2	2017-10-17
Connector formation methods and packaged semiconductor devices Grant 9,691,723 - Cheng , et al. June 27, 2	2017-06-27
Connector Formation Methods And Packaged Semiconductor Devices App 20170125365 - Cheng; Jung Wei ; et al.	2017-05-04
Packages with Die Stack Including Exposed Molding Underfill App 20150187734 - Liu; Yu-Chih ; et al.	2015-07-02

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