| Patent | Date |
|---|
Magnetic Tunnel Junction Device And Method Of Forming The Same
App 20220310903 - Huang; Chih-Fan ; et al. | 2022-09-29 |
Magnetic Random Access Memory And Manufacturing Method Thereof
App 20220310907 - HSIAO; Tsung-Chieh ; et al. | 2022-09-29 |
Semiconductor Device And Method Of Manufacturing Thereof
App 20220310538 - HSIAO; Tsung-Chieh ; et al. | 2022-09-29 |
Semiconductor Structure With Memory Device And Method For Manufacturing The Same
App 20220302375 - CHIU; Chih-Pin ; et al. | 2022-09-22 |
Semiconductor device structure with salicide layer and method for forming the same
Grant 11,444,173 - Shen , et al. September 13, 2 | 2022-09-13 |
Metal Plate Corner Structure On Metal Insulator Metal
App 20220285264 - Hsiao; Yuan-Yang ; et al. | 2022-09-08 |
Semiconductor Devices And Method Of Forming The Same
App 20220285436 - Shen; Hsiang-Ku ; et al. | 2022-09-08 |
Semiconductor Arrangement And Method Of Making
App 20220285263 - Lo; Wan-Yu ; et al. | 2022-09-08 |
Metal-Insulator-Metal Structure and Methods of Fabrication Thereof
App 20220285479 - Huang; Chih-Fan ; et al. | 2022-09-08 |
Semiconductor Packages And Method Of Manufacturing The Same
App 20220285434 - Shen; Hsiang-Ku ; et al. | 2022-09-08 |
Chip structure and method for forming the same
Grant 11,437,331 - Huang , et al. September 6, 2 | 2022-09-06 |
Multilayer capacitor electrode
Grant 11,424,319 - Shen , et al. August 23, 2 | 2022-08-23 |
Shielding structures
Grant 11,380,639 - Huang , et al. July 5, 2 | 2022-07-05 |
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
Grant 11,362,170 - Huang , et al. June 14, 2 | 2022-06-14 |
Semiconductor device and manufacturing method thereof
Grant 11,355,436 - Wu , et al. June 7, 2 | 2022-06-07 |
Structure And Method For Mram Devices Having Spacer Element
App 20220165936 - SHEN; Hsiang-Ku ; et al. | 2022-05-26 |
Structure And Method For Integrating Mram And Logic Devices
App 20220165940 - Shen; Hsiang-Ku ; et al. | 2022-05-26 |
Metal-insulator-metal structure and methods of fabrication thereof
Grant 11,342,408 - Huang , et al. May 24, 2 | 2022-05-24 |
Structure And Method For Mram Devices
App 20220140228 - Hsiao; Tsung-Chieh ; et al. | 2022-05-05 |
MRAM Structure for Balanced Loading
App 20220069199 - Huang; Chih-Fan ; et al. | 2022-03-03 |
Semiconductor Memory Device And Method Of Forming The Same
App 20220059759 - Shen; Hsiang-Ku ; et al. | 2022-02-24 |
Structure and Method for MRAM Devices with a Slot Via
App 20220044717 - Huang; Chih-Fan ; et al. | 2022-02-10 |
Package structure and method for forming the same
Grant 11,239,142 - Huang , et al. February 1, 2 | 2022-02-01 |
Method of forming a photoresist over a bond pad to mitigate bond pad corrosion
Grant 11,222,857 - Huang , et al. January 11, 2 | 2022-01-11 |
Semiconductor device including a high density MIM capacitor and method
Grant 11,222,946 - Yin , et al. January 11, 2 | 2022-01-11 |
Metal-Insulator-Metal Structure
App 20210398896 - Hsiao; Yuan-Yang ; et al. | 2021-12-23 |
Multilayer Capacitor Electrode
App 20210376058 - Shen; Hsiang-Ku ; et al. | 2021-12-02 |
Semiconductor structure with polyimide packaging and manufacturing method
Grant 11,189,538 - Huang , et al. November 30, 2 | 2021-11-30 |
Semiconductor Device And Manufacturing Method Thereof
App 20210358841 - WU; Yu-Bey ; et al. | 2021-11-18 |
Metal-insulator-metal Capacitive Structure And Methods Of Fabricating Thereof
App 20210328005 - SHEN; Hsiang-Ku ; et al. | 2021-10-21 |
Multi-layer passivation structure and method
Grant 11,145,564 - Huang , et al. October 12, 2 | 2021-10-12 |
Low-Stress Passivation Layer
App 20210287973 - Shen; Hsiang-Ku ; et al. | 2021-09-16 |
Metal-insulator-metal structure
Grant 11,114,373 - Hsiao , et al. September 7, 2 | 2021-09-07 |
Metal-insulator-metal Structure
App 20210265262 - Hsiao; Yuan-Yang ; et al. | 2021-08-26 |
Method Of Forming A Photoresist Over A Bond Pad To Mitigate Bond Pad Corrosion
App 20210265291 - Huang; Chih-Fan ; et al. | 2021-08-26 |
Semiconductor device comprising air gaps having different configurations
Grant 11,081,445 - Wu , et al. August 3, 2 | 2021-08-03 |
Metal-insulator-metal capacitive structure and methods of fabricating thereof
Grant 11,056,556 - Shen , et al. July 6, 2 | 2021-07-06 |
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
Grant 11,031,458 - Huang , et al. June 8, 2 | 2021-06-08 |
Low-stress passivation layer
Grant 11,031,325 - Shen , et al. June 8, 2 | 2021-06-08 |
Semiconductor Device And Manufacturing Method Thereof
App 20210143101 - WU; Yu-Bey ; et al. | 2021-05-13 |
Chip Structure And Method For Forming The Same
App 20210118829 - HUANG; Chih-Fan ; et al. | 2021-04-22 |
Package Structure And Method For Forming The Same
App 20210118782 - HUANG; Chih-Fan ; et al. | 2021-04-22 |
Low-stress Passivation Layer
App 20210118783 - Shen; Hsiang-Ku ; et al. | 2021-04-22 |
Metal Pad Corrosion Prevention
App 20210098399 - Huang; Chih-Fan ; et al. | 2021-04-01 |
Metal-insulator-metal Structure And Methods Thereof
App 20210098564 - YIN; Jin-Mu ; et al. | 2021-04-01 |
Redistribution Layers And Methods Of Fabricating The Same In Semiconductor Devices
App 20210098400 - Shen; Hsiang-Ku ; et al. | 2021-04-01 |
Shielding Structures
App 20210091029 - Huang; Chih-Fan ; et al. | 2021-03-25 |
Metal-insulator-metal (mim) Capacitor Structure And Method For Forming The Same
App 20210013301 - HUANG; Chih-Fan ; et al. | 2021-01-14 |
Semiconductor device and manufacturing method thereof
Grant 10,879,179 - Wu , et al. December 29, 2 | 2020-12-29 |
Shielding structures
Grant 10,861,810 - Huang , et al. December 8, 2 | 2020-12-08 |
Metal-Insulator-Metal Structure and Methods of Fabrication Thereof
App 20200365683 - Huang; Chih-Fan ; et al. | 2020-11-19 |
Metal-insulator-metal structure and methods of fabrication thereof
Grant 10,734,474 - Huang , et al. | 2020-08-04 |
Semiconductor Device including a High Density MIM Capacitor and Method
App 20200176557 - Yin; Jin-Mu ; et al. | 2020-06-04 |
Shielding Structures
App 20200168574 - Huang; Chih-Fan ; et al. | 2020-05-28 |
Semiconductor Structure with Polyimide Packaging and Manufacturing Method
App 20200105634 - Huang; Chih-Fan ; et al. | 2020-04-02 |
Metal-insulator-metal Capacitive Structure And Methods Of Fabricating Thereof
App 20200105863 - SHEN; Hsiang-Ku ; et al. | 2020-04-02 |
Metal-insulator-metal (mim) Capacitor Structure And Method For Forming The Same
App 20200035780 - HUANG; Chih-Fan ; et al. | 2020-01-30 |
Metal-Insulator-Metal Structure and Methods of Fabrication Thereof
App 20200035779 - Huang; Chih-Fan ; et al. | 2020-01-30 |
Multi-Layer Passivation Structure and Method
App 20200006183 - Huang; Chih-Fan ; et al. | 2020-01-02 |
Semiconductor Device And Manufacturing Method Thereof
App 20190348362 - WU; Yu-Bey ; et al. | 2019-11-14 |
Metal-insulator-metal (MIM) capacitor structure and method for forming the same
Grant 10,468,478 - Huang , et al. No | 2019-11-05 |
Fin patterning for semiconductor devices
Grant 10,395,937 - Tsai , et al. A | 2019-08-27 |
Semiconductor structure having an air-gap region and a method of manufacturing the same
Grant 10,361,152 - Su , et al. | 2019-07-23 |
Semiconductor device and manufacturing method thereof
Grant 10,361,156 - Wu , et al. | 2019-07-23 |
Semiconductor Device And Manufacturing Method Thereof
App 20190157204 - WU; Yu-Bey ; et al. | 2019-05-23 |
Metal-insulator-metal (mim) Capacitor Structure And Method For Forming The Same
App 20190131385 - HUANG; Chih-Fan ; et al. | 2019-05-02 |
Semiconductor Device Structure With Salicide Layer And Method For Forming The Same
App 20190131421 - SHEN; Hsiang-Ku ; et al. | 2019-05-02 |
Fin Patterning for Semiconductor Devices
App 20190067020 - Tsai; Tzung-Yi ; et al. | 2019-02-28 |
Semiconductor device and manufacturing method thereof
Grant 10,157,843 - Wu , et al. Dec | 2018-12-18 |
Semiconductor Device And Manufacturing Method Thereof
App 20180122738 - Wu; Yu-Bey ; et al. | 2018-05-03 |
Semiconductor Device And Manufacturing Method Thereof
App 20180076141 - WU; Yu-Bey ; et al. | 2018-03-15 |
Semiconductor device and manufacturing method thereof
Grant 9,881,870 - Wu , et al. January 30, 2 | 2018-01-30 |
Semiconductor device and manufacturing method thereof
Grant 9,852,992 - Wu , et al. December 26, 2 | 2017-12-26 |
Semiconductor Device And Manufacturing Method Thereof
App 20170221827 - WU; Yu-Bey ; et al. | 2017-08-03 |
Semiconductor Device And Manufacturing Method Thereof
App 20170194243 - WU; Yu-Bey ; et al. | 2017-07-06 |
Semiconductor device and manufacturing method thereof
Grant 9,653,348 - Wu , et al. May 16, 2 | 2017-05-16 |
Interconnect structure having smaller transition layer via
Grant 9,553,043 - Lu , et al. January 24, 2 | 2017-01-24 |
Non-hierarchical metal layers for integrated circuits
Grant 9,543,193 - Lu , et al. January 10, 2 | 2017-01-10 |
Mask treatment for double patterning design
Grant 9,257,279 - Yang , et al. February 9, 2 | 2016-02-09 |
Non-Hierarchical Metal Layers for Integrated Circuits
App 20150364359 - Lu; Lee-Chung ; et al. | 2015-12-17 |
Methods of forming integrated circuits
Grant 9,153,484 - Chen , et al. October 6, 2 | 2015-10-06 |
Non-hierarchical metal layers for integrated circuits
Grant 9,117,882 - Lu , et al. August 25, 2 | 2015-08-25 |
Methods of patterning small via pitch dimensions
Grant 9,099,530 - Lin , et al. August 4, 2 | 2015-08-04 |
Semiconductor Structure Having An Air-gap Region And A Method Of Manufacturing The Same
App 20150200160 - SU; Shu-Hui ; et al. | 2015-07-16 |
Semiconductor structure having an air-gap region and a method of manufacturing the same
Grant 8,999,839 - Su , et al. April 7, 2 | 2015-04-07 |
Mask assignment optimization
Grant 9,003,336 - Huang , et al. April 7, 2 | 2015-04-07 |
Method of making a semiconductor device including barrier layers for copper interconnect
Grant 8,975,749 - Liu , et al. March 10, 2 | 2015-03-10 |
Mask Assignment Optimization
App 20140248768 - Huang; Wen-Chun ; et al. | 2014-09-04 |
Methods of Patterning Small Via Pitch Dimensions
App 20140242794 - Lin; Chung-Yi ; et al. | 2014-08-28 |
Integrated Circuits Including Ild Structure, Systems, And Fabrication Methods Thereof
App 20140220769 - CHEN; Chii-Ping ; et al. | 2014-08-07 |
Semiconductor devices and methods of manufacture thereof
Grant 8,786,094 - Fu , et al. July 22, 2 | 2014-07-22 |
Methods of patterning small via pitch dimensions
Grant 8,728,332 - Lin , et al. May 20, 2 | 2014-05-20 |
Method Of Making A Semiconductor Device Including Barrier Layers For Copper Interconnect
App 20140127898 - LIU; Nai-Wei ; et al. | 2014-05-08 |
Integrated circuit including a gate and a metallic connecting line
Grant 8,716,862 - Chen , et al. May 6, 2 | 2014-05-06 |
Barrier layers for copper interconnect
Grant 8,653,664 - Liu , et al. February 18, 2 | 2014-02-18 |
Semiconductor Devices and Methods of Manufacture Thereof
App 20140001638 - Fu; Chung-Min ; et al. | 2014-01-02 |
Methods Of Patterning Small Via Pitch Dimensions
App 20130295769 - Lin; Chung-Yi ; et al. | 2013-11-07 |
Method of manufacturing an electronic device
Grant 8,564,103 - Hung , et al. October 22, 2 | 2013-10-22 |
Interconnect Structure Having Smaller Transition Layer Via
App 20130256902 - LU; Lee-Chung ; et al. | 2013-10-03 |
Mask Treatment for Double Patterning Design
App 20130260563 - Yang; Jiing-Feng ; et al. | 2013-10-03 |
Semiconductor Structure Having An Air-gap Region And A Method Of Manufacturing The Same
App 20130252144 - SU; Shu-Hui ; et al. | 2013-09-26 |
Semiconductor structure having an air-gap region and a method of manufacturing the same
Grant 8,456,009 - Su , et al. June 4, 2 | 2013-06-04 |
Non-Hierarchical Metal Layers for Integrated Circuits
App 20120313256 - Lu; Lee-Chung ; et al. | 2012-12-13 |
Partial air gap formation for providing interconnect isolation in integrated circuits
Grant 8,304,906 - Huang , et al. November 6, 2 | 2012-11-06 |
Mask-shift-aware Rc Extraction For Double Patterning Design
App 20120052422 - Lu; Lee-Chung ; et al. | 2012-03-01 |
Mask-shift-aware RC extraction for double patterning design
Grant 8,119,310 - Lu , et al. February 21, 2 | 2012-02-21 |
Partial Air Gap Formation For Providing Interconnect Isolation In Integrated Circuits
App 20110291281 - Huang; Cheng-Lin ; et al. | 2011-12-01 |
Semiconductor Structure Having An Air-gap Region And A Method Of Manufacturing The Same
App 20110198757 - SU; Shu-Hui ; et al. | 2011-08-18 |
Barrier Layers For Copper Interconnect
App 20110006429 - LIU; Nai-Wei ; et al. | 2011-01-13 |
Method of Manufacturing an Electronic Device
App 20100308444 - Hung; Bin-Yuan ; et al. | 2010-12-09 |
Integrated Circuits Including Ild Structure, Systems, And Fabrication Methods Thereof
App 20100283152 - CHEN; Chii-Ping ; et al. | 2010-11-11 |
Laminated silicate glass layer etch stop method for fabricating microelectronic product
Grant 7,160,811 - Chen , et al. January 9, 2 | 2007-01-09 |
Microelectronic fabrication having edge passivated bond pad integrated with option selection device access aperture
Grant 7,067,896 - Wu , et al. June 27, 2 | 2006-06-27 |
Partially photoexposed positive photoresist layer blocking method for regio-selectively processing a microelectronic layer
Grant 6,936,408 - Liao , et al. August 30, 2 | 2005-08-30 |
In-situ photoresist removal by an attachable chamber with light source
Grant 6,929,713 - Peng , et al. August 16, 2 | 2005-08-16 |
Photoresist scum free process for via first dual damascene process
Grant 6,861,376 - Chen , et al. March 1, 2 | 2005-03-01 |
Microelectronic fabrication having edge passivated bond pad integrated with option selection device access aperture
App 20040089916 - Wu, Juei-Kuo ; et al. | 2004-05-13 |
Damascene method employing multi-layer etch stop layer
Grant 6,734,116 - Guo , et al. May 11, 2 | 2004-05-11 |
Laminated silicate glass layer etch stop method for fabricating microelectronic product
App 20040074872 - Chen, Yen-Ming ; et al. | 2004-04-22 |
Partially photoexposed positive photoresist layer blocking method for regio-selectively processing a microelectronic layer
App 20040013981 - Liao, Yong-Shun ; et al. | 2004-01-22 |
Passivation and planarization process for flip chip packages
Grant 6,667,230 - Chen , et al. December 23, 2 | 2003-12-23 |
Photoexposure method for facilitating photoresist stripping
Grant 6,664,194 - Chen , et al. December 16, 2 | 2003-12-16 |
Wet dip method for photoresist and polymer stripping without buffer treatment step
Grant 6,652,666 - Ma , et al. November 25, 2 | 2003-11-25 |
Damascene method employing multi-layer etch stop layer
App 20030134521 - Guo, Cheng-Cheng ; et al. | 2003-07-17 |
IMD film composition for dual damascene process
Grant 6,570,257 - Chen , et al. May 27, 2 | 2003-05-27 |
Passivation and planarization process for flip chip packages
App 20030013291 - Chen, Dian-Hau ; et al. | 2003-01-16 |
Wet dip method for photoresist and polymer stripping without buffer treatment step
App 20020162578 - Ma, Ching-Tien ; et al. | 2002-11-07 |
In-situ photoresist removal by an attachable chamber with light source
App 20020164878 - Peng, Chiang Jen ; et al. | 2002-11-07 |
Novel IMD film composition for dual damascene process
App 20020013024 - Chen, Dian-Hau ; et al. | 2002-01-31 |
Inter-metal dielectric film composition for dual damascene process
Grant 6,316,351 - Chen , et al. November 13, 2 | 2001-11-13 |
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