CHEN; DA-JUNG
Patent Applications and Registrations
Patent applications and USPTO patent grants for CHEN; DA-JUNG.The latest application filed is for "stacked electronic module and method to make the same".
Company Profile
10.64.64
- CHEN; DA-JUNG - Taoyuan County TW
- CHEN; DA-JUNG - Taoyuan City TW
- Chen; Da-Jung - Taoyuan TW
- Chen; Da-Jung - Singapore SG
- Chen; Da-Jung - Hsinchu TW
- Chen; Da-Jung - Tao Yuan County TW
- - Tao Yuan County TW
- CHEN; DA-JUNG - Taoyuan Count TW
- Chen; Da-Jung - Taoyuan County 325 TW
- Chen; Da-Jung - Sanhe Village TW
- Chen; Da-Jung - Longtan Township TW
- Chen, Da-Jung - Lung-Tan Hsian TW
Patent Activity
| Patent | Date |
|---|---|
| Stacked Electronic Module And Method To Make The Same App 20220130585 - CHEN; DA-JUNG ; et al. | 2022-04-28 |
| Electronic Module App 20220007502 - CHIANG; KAIPENG ; et al. | 2022-01-06 |
| Electronic module Grant 11,153,973 - Chiang , et al. October 19, 2 | 2021-10-19 |
| Electronic Structure Having A Transformer App 20210272747 - CHEN; DA-JUNG ; et al. | 2021-09-02 |
| Stack frame for electrical connections and the method to fabricate thereof Grant 11,031,255 - Lu , et al. June 8, 2 | 2021-06-08 |
| Electronic module Grant 11,017,934 - Lu , et al. May 25, 2 | 2021-05-25 |
| Three-dimensional package structure Grant 10,991,681 - Chen , et al. April 27, 2 | 2021-04-27 |
| Electronic Module App 20210105898 - CHIANG; KAIPENG ; et al. | 2021-04-08 |
| Method to form a stacked electronic structure Grant 10,741,531 - Huang , et al. A | 2020-08-11 |
| A Stack Frame for Electrical Connections and the Method to Fabricate Thereof App 20200176270 - LU; BAU-RU ; et al. | 2020-06-04 |
| Three-dimensional Package Structure App 20200176429 - Chen; Da-Jung ; et al. | 2020-06-04 |
| Stack frame for electrical connections and the method to fabricate thereof Grant 10,593,561 - Lu , et al. | 2020-03-17 |
| Three-dimensional package structure Grant 10,593,656 - Chen , et al. | 2020-03-17 |
| Method to Form a Stacked Electronic Structure App 20190131286 - Huang; Chi-Feng ; et al. | 2019-05-02 |
| Stacked electronic structure Grant 10,199,361 - Huang , et al. Fe | 2019-02-05 |
| Stacked Electronic Structure App 20180308829 - Huang; Chi-Feng ; et al. | 2018-10-25 |
| Power module Grant 10,084,389 - Lai , et al. September 25, 2 | 2018-09-25 |
| Packaging process of electronic component Grant 10,083,925 - Cai , et al. September 25, 2 | 2018-09-25 |
| Electronic Package And Fabrication Method Thereof App 20180240738 - Chen; Da-Jung ; et al. | 2018-08-23 |
| Stack Frame for Electrical Connections and the Method to Fabricate Thereof App 20180233380 - LU; BAU-RU ; et al. | 2018-08-16 |
| Stacked electronic structure Grant 10,034,379 - Huang , et al. July 24, 2 | 2018-07-24 |
| Electronic Module App 20180168045 - LU; BAU-RU ; et al. | 2018-06-14 |
| Electronic Module App 20180166200 - Lu; Bau-Ru ; et al. | 2018-06-14 |
| Stack frame for electrical connections and the method to fabricate thereof Grant 9,978,611 - Lu , et al. May 22, 2 | 2018-05-22 |
| Power module Grant 9,973,104 - Lai , et al. May 15, 2 | 2018-05-15 |
| Packaging Process Of Electronic Component App 20180122756 - Cai; Qin-Jia ; et al. | 2018-05-03 |
| Embedded package structure Grant 9,913,380 - Lai , et al. March 6, 2 | 2018-03-06 |
| Package assembly Grant 9,906,157 - Tan , et al. February 27, 2 | 2018-02-27 |
| Package assembly Grant 9,877,408 - Tan , et al. January 23, 2 | 2018-01-23 |
| Packaging process of electronic component Grant 9,875,977 - Cai , et al. January 23, 2 | 2018-01-23 |
| Power module Grant 9,871,463 - Lai , et al. January 16, 2 | 2018-01-16 |
| Embedded Package Structure App 20170347458 - Lai; Yiu-Wai ; et al. | 2017-11-30 |
| Stack Frame for Electrical Connections and the Method to Fabricate Thereof App 20170316954 - LU; BAU-RU ; et al. | 2017-11-02 |
| Stack frame for electrical connections and the method to fabricate thereof Grant 9,741,590 - Lu , et al. August 22, 2 | 2017-08-22 |
| Package structure and manufacturing method thereof Grant 9,735,091 - Lee , et al. August 15, 2 | 2017-08-15 |
| Electronic package structure comprising a magnetic body and an inductive element and method for making the same Grant 9,734,944 - Lu , et al. August 15, 2 | 2017-08-15 |
| Stacked Electronic Structure App 20170223834 - HUANG; CHI-FENG ; et al. | 2017-08-03 |
| Package structure Grant 9,673,156 - Lai , et al. June 6, 2 | 2017-06-06 |
| Three-dimensional Package Structure App 20170133355 - Chen; Da-Jung ; et al. | 2017-05-11 |
| Power Module App 20170110978 - Lai; Yiu-Wai ; et al. | 2017-04-20 |
| Three-dimensional package structure Grant 9,601,412 - Chen , et al. March 21, 2 | 2017-03-21 |
| Stack Frame For Electrical Connections And The Method To Fabricate Thereof App 20170047229 - LU; BAU-RU ; et al. | 2017-02-16 |
| Electronic package structure Grant 9,538,660 - Chen , et al. January 3, 2 | 2017-01-03 |
| Stack frame for electrical connections and the method to fabricate thereof Grant 9,514,964 - Lu , et al. December 6, 2 | 2016-12-06 |
| Power Module App 20160352246 - Lai; Yiu-Wai ; et al. | 2016-12-01 |
| Package Assembly App 20160352245 - Tan; Chad-Yao ; et al. | 2016-12-01 |
| Power Module App 20160351478 - Lai; Yiu-Wai ; et al. | 2016-12-01 |
| Package Assembly App 20160353608 - Tan; Chad-Yao ; et al. | 2016-12-01 |
| Electronic package structure Grant 9,451,701 - Chen , et al. September 20, 2 | 2016-09-20 |
| Package structure Grant 9,425,131 - Chen August 23, 2 | 2016-08-23 |
| Packaging Process Of Electronic Component App 20160240498 - CAI; Qin-Jia ; et al. | 2016-08-18 |
| Package Structure App 20160233140 - LAI; Yiu-Wai ; et al. | 2016-08-11 |
| Metal core printed circuit board and electronic package structure Grant 9,386,686 - Huang , et al. July 5, 2 | 2016-07-05 |
| Package structure with direct bond copper substrate Grant 9,287,231 - Chen March 15, 2 | 2016-03-15 |
| Power supply module Grant 9,271,398 - Chen , et al. February 23, 2 | 2016-02-23 |
| Stack Frame For Electrical Connections And The Method To Fabricate Thereof App 20150348801 - LU; BAU-RU ; et al. | 2015-12-03 |
| Choke App 20150310978 - Chen; Da-Jung | 2015-10-29 |
| Package structure and the method to manufacture thereof Grant 9,171,818 - Chen , et al. October 27, 2 | 2015-10-27 |
| Package Structure App 20150303164 - Chen; Da-Jung | 2015-10-22 |
| Stack frame for electrical connections and the method to fabricate thereof Grant 9,142,426 - Lu , et al. September 22, 2 | 2015-09-22 |
| Package Structure App 20150255380 - Chen; Da-Jung | 2015-09-10 |
| Power conversion module Grant 9,111,954 - Chen , et al. August 18, 2 | 2015-08-18 |
| Package structure and stacked package module with the same Grant 9,107,290 - Chen August 11, 2 | 2015-08-11 |
| Electronic Package Structure App 20150116973 - CHEN; DA-JUNG ; et al. | 2015-04-30 |
| Electronic Package Structure App 20150116960 - CHEN; DA-JUNG ; et al. | 2015-04-30 |
| Package Structure And Manufacturing Method Thereof App 20150102475 - Lee; Han-Hsiang ; et al. | 2015-04-16 |
| Electronic package structure Grant 9,001,527 - Chen , et al. April 7, 2 | 2015-04-07 |
| Package structure and manufacturing method thereof Grant 9,000,576 - Lee , et al. April 7, 2 | 2015-04-07 |
| Electronic package structure and method for making the same App 20150055315 - Lu; Bau-Ru ; et al. | 2015-02-26 |
| Electronic package structure having side-wing parts outside of a package layer for dissipating heat and method for making the same Grant 8,906,741 - Lu , et al. December 9, 2 | 2014-12-09 |
| Electronic package structure Grant 8,837,168 - Chen , et al. September 16, 2 | 2014-09-16 |
| Electronic package structure Grant 8,824,165 - Chen , et al. September 2, 2 | 2014-09-02 |
| Electronic package structure Grant 8,619,428 - Lee , et al. December 31, 2 | 2013-12-31 |
| Electronic package structure Grant 08619428 - | 2013-12-31 |
| Package Structure And The Method To Manufacture Thereof App 20130146341 - CHEN; DA-JUNG ; et al. | 2013-06-13 |
| Electronic Package Structure App 20130141886 - CHEN; DA-JUNG ; et al. | 2013-06-06 |
| Three-dimensional Package Structure App 20130001756 - Chen; Da-Jung ; et al. | 2013-01-03 |
| Three-dimensional package structure Grant 8,338,933 - Chen , et al. December 25, 2 | 2012-12-25 |
| Three-dimensional package structure Grant 8,338,928 - Chen , et al. December 25, 2 | 2012-12-25 |
| Stack Frame For Electrical Connections And The Method To Fabricate Thereof App 20120319258 - LU; BAU-RU ; et al. | 2012-12-20 |
| Package Structure And Manufacturing Method Thereof App 20120313229 - Lee; Han-Hsiang ; et al. | 2012-12-13 |
| Metal Core Printed Circuit Board And Electronic Package Structure App 20120268896 - HUANG; Chi-Feng ; et al. | 2012-10-25 |
| Power-supply Module App 20120262145 - Chen; Da-Jung ; et al. | 2012-10-18 |
| Electronic Package Structure App 20120236519 - Chen; Da-Jung ; et al. | 2012-09-20 |
| MOSFET pair with stack capacitor and manufacturing method thereof Grant 8,269,330 - Lee , et al. September 18, 2 | 2012-09-18 |
| Electronic element packaging module Grant 8,253,041 - Chen , et al. August 28, 2 | 2012-08-28 |
| Chip package structure including heat dissipation device and an insulation sheet Grant 8,247,891 - Wen , et al. August 21, 2 | 2012-08-21 |
| Electronic Package Structure App 20120075808 - LEE; Han-Hsiang ; et al. | 2012-03-29 |
| Power Conversion Module App 20120069529 - Chen; Da-Jung ; et al. | 2012-03-22 |
| Electronic Package Structure And Method For Making The Same App 20120044656 - LU; Bau-Ru ; et al. | 2012-02-23 |
| Electronic Package Structure App 20120014079 - CHEN; Da-Jung ; et al. | 2012-01-19 |
| Three-dimensional Package Structure App 20110278704 - CHEN; Da-Jung ; et al. | 2011-11-17 |
| Chip package structure Grant 7,982,304 - Lu , et al. July 19, 2 | 2011-07-19 |
| Electronic Package Structure App 20110090648 - CHEN; Da-Jung ; et al. | 2011-04-21 |
| Electronic Element Packaging Module App 20100309638 - Chen; Da-Jung ; et al. | 2010-12-09 |
| Chip Package Structure App 20100117216 - LU; BAU-RU ; et al. | 2010-05-13 |
| Chip Package Structure App 20100059870 - Wen; Chau-Chun ; et al. | 2010-03-11 |
| Electronic Package Structure App 20090207574 - Chen; Da-Jung ; et al. | 2009-08-20 |
| Package structure Grant 7,551,455 - Chen , et al. June 23, 2 | 2009-06-23 |
| Three-dimensional Package Structure App 20080303125 - CHEN; DA-JUNG ; et al. | 2008-12-11 |
| Package device with electromagnetic interference shield Grant 7,411,278 - Wen , et al. August 12, 2 | 2008-08-12 |
| Electronic Package Structure App 20080180921 - Chen; Da-Jung ; et al. | 2008-07-31 |
| Electronic Package Structure App 20080179722 - Chen; Da-Jung ; et al. | 2008-07-31 |
| Power module package structure Grant 7,405,467 - Liu , et al. July 29, 2 | 2008-07-29 |
| Package structure App 20070257377 - Chen; Da-Jung ; et al. | 2007-11-08 |
| Package device with electromagnetic interference shield App 20070096293 - Wen; Chau Chun ; et al. | 2007-05-03 |
| Method for preventing the overflowing of molding compound during fabricating package device App 20060284340 - Liu; Chun-Tiao ; et al. | 2006-12-21 |
| Power module package structure App 20060267187 - Liu; Chun-Tiao ; et al. | 2006-11-30 |
| Package structure having mixed circuit and composite substrate App 20060220188 - Liu; Chun-Tiao ; et al. | 2006-10-05 |
| Construction for high density power module package Grant 6,975,513 - Chen , et al. December 13, 2 | 2005-12-13 |
| Package with stacked substrates Grant 6,972,479 - Chen , et al. December 6, 2 | 2005-12-06 |
| [package With Stacked Substrates] App 20050205970 - Chen, Da-Jung ; et al. | 2005-09-22 |
| Chip package and substrate App 20050093121 - Chen, Da-Jung ; et al. | 2005-05-05 |
| Construction for high density power module package App 20040228097 - Chen, Da-Jung ; et al. | 2004-11-18 |
| Construction for high density power module package (case II) Grant 6,775,145 - Chen , et al. August 10, 2 | 2004-08-10 |
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