| Patent | Date |
|---|
High density MIM capacitor structure and fabrication process
Grant 7,317,221 - Chang , et al. January 8, 2 | 2008-01-08 |
Method of making a metal-insulator-metal capacitor in the CMOS process
Grant 7,294,544 - Ho , et al. November 13, 2 | 2007-11-13 |
Method to fabricate high reliable metal capacitor within copper back-end process
Grant 7,122,878 - Huang , et al. October 17, 2 | 2006-10-17 |
Integrated capacitor
Grant 7,050,290 - Tang , et al. May 23, 2 | 2006-05-23 |
Interdigitated capacitor and method for fabrication thereof
Grant 7,035,083 - Lin , et al. April 25, 2 | 2006-04-25 |
Novel method to fabricate high reliable metal capacitor within copper back-end process
App 20050221575 - Huang, Chi-Feng ; et al. | 2005-10-06 |
Metal-over-metal devices and the method for manufacturing same
Grant 6,949,781 - Chang , et al. September 27, 2 | 2005-09-27 |
Interdigitated capacitor and method for fabrication therof
App 20050206469 - Lin, Wen-Chin ; et al. | 2005-09-22 |
Integrated capacitor
App 20050168914 - Tang, Denny ; et al. | 2005-08-04 |
Method to fabricate high reliable metal capacitor within copper back-end process
Grant 6,916,722 - Huang , et al. July 12, 2 | 2005-07-12 |
High density MIM capacitor structure and fabrication process
App 20050121744 - Chang, Kuan-Lun ; et al. | 2005-06-09 |
Compact capacitor structure having high unit capacitance
App 20050082592 - Chang, Chung Long ; et al. | 2005-04-21 |
Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
Grant 6,881,996 - Chen , et al. April 19, 2 | 2005-04-19 |
Metal-over-metal devices and the method for manufacturing same
App 20050077581 - Chang, Chung-Long ; et al. | 2005-04-14 |
Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
App 20050029566 - Chen, Chun-Hon ; et al. | 2005-02-10 |
Method for making a new metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
Grant 6,812,088 - Chen , et al. November 2, 2 | 2004-11-02 |
Novel method to fabricate high reliable metal capacitor within copper back-end process
App 20040106266 - Huang, Chi-Feng ; et al. | 2004-06-03 |
Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated therein
Grant 6,734,079 - Huang , et al. May 11, 2 | 2004-05-11 |
Method of fabricating a damascene copper inductor structure using a sub-0.18 um CMOS process
Grant 6,667,217 - Hsu , et al. December 23, 2 | 2003-12-23 |
Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated therein
App 20030232481 - Huang, Chi-Feng ; et al. | 2003-12-18 |
Microelectronic fabrication having microelectronic capacitor structure fabricated therein
Grant 6,583,491 - Huang , et al. June 24, 2 | 2003-06-24 |
Dual damascene interconnect structures that include radio frequency capacitors and inductors
Grant 6,472,721 - Ma , et al. October 29, 2 | 2002-10-29 |
Copper MIM structure and process for mixed-signal and Rf capacitors and inductors
App 20020019123 - Ma, Ssu-Pin ; et al. | 2002-02-14 |
Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow
Grant 6,329,234 - Ma , et al. December 11, 2 | 2001-12-11 |
Method for manufacturing a silicide to silicide capacitor
Grant 6,051,475 - Ho , et al. April 18, 2 | 2000-04-18 |
Gate dielectric based on oxynitride grown in N.sub.2 O and annealed in NO
Grant 5,880,040 - Sun , et al. March 9, 1 | 1999-03-09 |
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