Patent | Date |
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Method for forming biochips and biochips with non-organic landings for improved thermal budget Grant 11,280,786 - Chu , et al. March 22, 2 | 2022-03-22 |
Backside CMOS compatible BioFET with no plasma induced damage Grant 11,099,152 - Liu , et al. August 24, 2 | 2021-08-24 |
Wafer stack and fabrication method thereof Grant 10,867,836 - Chang , et al. December 15, 2 | 2020-12-15 |
Backside CMOS Compatible BioFET with No Plasma Induced Damage App 20200072789 - LIU; Yi-Shao ;   et al. | 2020-03-05 |
Backside CMOS compatible BioFET with no plasma induced damage Grant 10,473,616 - Liu , et al. Nov | 2019-11-12 |
Method for Forming Biochips and Biochips With Non-Organic Landings for Improved Thermal Budget App 20190101531 - Chu; Chia-Hua ;   et al. | 2019-04-04 |
Method for forming biochips and biochips with non-organic landings for improved thermal budget Grant 10,145,847 - Chu , et al. De | 2018-12-04 |
Optical biosensor device Grant 9,968,927 - Liu , et al. May 15, 2 | 2018-05-15 |
Backside CMOS Compatible BioFET With No Plasma Induced Damage App 20170315085 - LIU; Yi-Shao ;   et al. | 2017-11-02 |
Wafer Stack And Fabrication Method Thereof App 20170316969 - Chang; Kuei-Sung ;   et al. | 2017-11-02 |
Backside CMOS compatible BioFET with no plasma induced damage Grant 9,709,525 - Liu , et al. July 18, 2 | 2017-07-18 |
Optical Biosensor Device App 20160341656 - Liu; Yi-Shao ;   et al. | 2016-11-24 |
Method of forming a semiconductor device Grant 9,493,347 - Chang , et al. November 15, 2 | 2016-11-15 |
Backside CMOS Compatible BioFET With No Plasma Induced Damage App 20160011144 - Liu; Yi-Shao ;   et al. | 2016-01-14 |
Backside CMOS compatible BioFET with no plasma induced damage Grant 9,080,969 - Liu , et al. July 14, 2 | 2015-07-14 |
BioMEMS and planar light circuit with integrated package Grant 9,034,678 - Chang , et al. May 19, 2 | 2015-05-19 |
Method Of Forming A Semiconductor Device App 20150024533 - CHANG; Yi-Hsien ;   et al. | 2015-01-22 |
Method for Forming Biochips and Biochips With Non-Organic Landings for Improved Thermal Budget App 20150011021 - Chu; Chia-Hua ;   et al. | 2015-01-08 |
Biomems And Planar Light Circuit With Integrated Package App 20140335640 - Chang; Allen Timothy ;   et al. | 2014-11-13 |
MEMS nanostructures and methods of forming the same Grant 8,883,021 - Chang , et al. November 11, 2 | 2014-11-11 |
Method for forming biochips and biochips with non-organic landings for improved thermal budget Grant 8,846,416 - Chu , et al. September 30, 2 | 2014-09-30 |
Method For Forming Biochips And Biochips With Non-organic Landings For Improved Thermal Budget App 20140273281 - Chu; Chia-Hua ;   et al. | 2014-09-18 |
Backside CMOS Compatible BioFET with No Plasma Induced Damage App 20140252421 - Liu; Yi-Shao ;   et al. | 2014-09-11 |
Microelectromechanical device with integrated package Grant 8,791,557 - Chang , et al. July 29, 2 | 2014-07-29 |
Backside Cmos Compatible Biofet With No Plasma Induced Damage App 20140151755 - Liu; Yi-Shao ;   et al. | 2014-06-05 |
Backside CMOS compatible bioFET with no plasma induced damage Grant 8,728,844 - Liu , et al. May 20, 2 | 2014-05-20 |
BioMEMS and Planar Light Circuit with Integrated Package App 20130293878 - Chang; Allen Timothy ;   et al. | 2013-11-07 |
Mems Nanostructures And Methods Of Forming The Same App 20130256259 - CHANG; Yi-Hsien ;   et al. | 2013-10-03 |
Handling layer for transparent substrate Grant 8,405,169 - Cheng , et al. March 26, 2 | 2013-03-26 |
Handling Layer For Transparent Substrate App 20120091598 - Cheng; Chun-Ren ;   et al. | 2012-04-19 |