Chen; Chin-Liang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Chin-Liang.The latest application filed is for "die corner removal for underfill crack suppression in semiconductor die packaging".
Company Profile
26.63.85
- Chen; Chin-Liang - Kaohsiung TW
- CHEN; Chin-Liang - Kaohsiung City TW
- CHEN; Chin-Liang - Hsinchu TW
- CHEN; CHIN-LIANG - New Taipei TW
- Chen; Chin-Liang - Taichung TW
- Chen; Chin-Liang - Taichung City TW
- Chen; Chin-Liang - Kao Hsiung TW
- Chen; Chin-Liang - Kao Hsiung City TW
- Chen; Chin-Liang - Shihlin District Taipei City TW
- Chen; Chin-Liang - Taipei City TW
- Chen; Chin-Liang - Penghu County TW
- Chen; Chin-Liang - Yungkang City Tainan Hsien TW
- Chen; Chin-Liang - Feng Yuan City Taichung Hsien TW
Patent Activity
| Patent | Date |
|---|---|
| Integrated Circuit Packages and Methods of Forming Same App 20220301889 - Yu; Chen-Hua ; et al. | 2022-09-22 |
| Die Corner Removal For Underfill Crack Suppression In Semiconductor Die Packaging App 20220302064 - CHEN; Wei-Yu ; et al. | 2022-09-22 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20220270994 - Yu; Chi-Yang ; et al. | 2022-08-25 |
| Semiconductor structure and manufacturing method thereof Grant 11,424,220 - Yu , et al. August 23, 2 | 2022-08-23 |
| Semiconductor Packages And Forming Methods Thereof App 20220262734 - Wu; Kai-Chiang ; et al. | 2022-08-18 |
| Package-on-package with redistribution structure Grant 11,417,643 - Liu , et al. August 16, 2 | 2022-08-16 |
| Semiconductor Structure And Manufacturing Method Thereof App 20220246513 - Ho; Kuan-Lin ; et al. | 2022-08-04 |
| Integrated circuit packages and methods of forming same Grant 11,387,118 - Yu , et al. July 12, 2 | 2022-07-12 |
| Integrated fan-out package and manufacturing method thereof Grant 11,355,461 - Yu , et al. June 7, 2 | 2022-06-07 |
| Semiconductor packages and forming methods thereof Grant 11,348,874 - Wu , et al. May 31, 2 | 2022-05-31 |
| Semiconductor structure and manufacturing method thereof Grant 11,315,862 - Ho , et al. April 26, 2 | 2022-04-26 |
| Semiconductor structure and associated method for manufacturing the same Grant 11,264,304 - Chen , et al. March 1, 2 | 2022-03-01 |
| Semiconductor Packages And Forming Methods Thereof App 20220013463 - Wu; Kai-Chiang ; et al. | 2022-01-13 |
| Semiconductor Structure And Manufacturing Method Thereof App 20210242119 - Ho; Kuan-Lin ; et al. | 2021-08-05 |
| Package Structure And Method Of Manufacturing The Same App 20210210464 - Yu; Chi-Yang ; et al. | 2021-07-08 |
| Package structure and method of manufacturing the same Grant 10,957,672 - Yu , et al. March 23, 2 | 2021-03-23 |
| Semiconductor Structure And Manufacturing Method Thereof App 20210020606 - YU; CHI-YANG ; et al. | 2021-01-21 |
| System and method for bonding package lid Grant 10,879,140 - Lin , et al. December 29, 2 | 2020-12-29 |
| Semiconductor packaging structure and process Grant 10,867,835 - Ho , et al. December 15, 2 | 2020-12-15 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20200328173 - Yu; Chi-Yang ; et al. | 2020-10-15 |
| Semiconductor structure and manufacturing method thereof Grant 10,804,245 - Yu , et al. October 13, 2 | 2020-10-13 |
| Lid Attach Process And Dispenser Head App 20200286748 - CHEN; Chin-Liang ; et al. | 2020-09-10 |
| Semiconductor Package And Manufacturing Method Thereof App 20200279790 - Yu; Chi-Yang ; et al. | 2020-09-03 |
| Semiconductor Structure And Associated Method For Manufacturing The Same App 20200219788 - CHEN; CHIN-LIANG ; et al. | 2020-07-09 |
| Integrated fan-out package and manufacturing method thereof Grant 10,700,031 - Yu , et al. | 2020-06-30 |
| Lid attach processes for semiconductor packages Grant 10,685,853 - Chen , et al. | 2020-06-16 |
| Semiconductor package and manufacturing method thereof Grant 10,658,263 - Yu , et al. | 2020-05-19 |
| Semiconductor structure and associated method for manufacturing the same Grant 10,622,278 - Chen , et al. | 2020-04-14 |
| Package Structure And Methods Of Forming The Same App 20200066704 - Liu; Yu-Chih ; et al. | 2020-02-27 |
| Methods of forming package-on-package structures Grant 10,515,941 - Liu , et al. Dec | 2019-12-24 |
| Semiconductor Package And Manufacturing Method Thereof App 20190371699 - Yu; Chi-Yang ; et al. | 2019-12-05 |
| Semiconductor Structure And Associated Method For Manufacturing The Same App 20190237385 - CHEN; CHIN-LIANG ; et al. | 2019-08-01 |
| Package Structure And Method Of Manufacturing The Same App 20190148340 - Yu; Chi-Yang ; et al. | 2019-05-16 |
| Semiconductor Packaging Structure and Process App 20190139817 - Ho; Kuan-Lin ; et al. | 2019-05-09 |
| Integrated Fan-out Package And Manufacturing Method Thereof App 20190131262 - Yu; Chi-Yang ; et al. | 2019-05-02 |
| Semiconductor packages and methods of forming the same Grant 10,276,508 - Ho , et al. | 2019-04-30 |
| System and Method for Bonding Package Lid App 20190122946 - Lin; Shih-Yen ; et al. | 2019-04-25 |
| Semiconductor structure and associated method for manufacturing the same Grant 10,269,679 - Chen , et al. | 2019-04-23 |
| System and method for bonding package lid Grant 10,269,668 - Lin , et al. | 2019-04-23 |
| Semiconductor Packages And Methods Of Forming The Same App 20190096816 - Ho; Kuan-Lin ; et al. | 2019-03-28 |
| Integrated Circuit Packages and Methods of Forming Same App 20190096698 - Yu; Chen-Hua ; et al. | 2019-03-28 |
| Lid design for heat dissipation enhancement of die package Grant 10,163,754 - Ho , et al. Dec | 2018-12-25 |
| Method for forming a lid structure for a semiconductor device package Grant 10,157,863 - Ho , et al. Dec | 2018-12-18 |
| Semiconductor packaging structure and process Grant 10,157,772 - Ho , et al. Dec | 2018-12-18 |
| Integrated fan-out package and manufacturing method thereof Grant 10,157,871 - Yu , et al. Dec | 2018-12-18 |
| Integrated circuit packages and methods of forming same Grant 10,141,201 - Yu , et al. Nov | 2018-11-27 |
| Semiconductor Structure And Associated Method For Manufacturing The Same App 20180226321 - CHEN; CHIN-LIANG ; et al. | 2018-08-09 |
| Semiconductor Structure And Manufacturing Method Thereof App 20180130772 - YU; CHI-YANG ; et al. | 2018-05-10 |
| Package Structure and Methods of Forming the Same App 20180122791 - Liu; Yu-Chih ; et al. | 2018-05-03 |
| Method for manufacturing semiconductor structure Grant 9,941,186 - Chen , et al. April 10, 2 | 2018-04-10 |
| Method For Automatic Distribution Of Ip Address, System And Client Using The Same App 20180077113 - SHIE; MING-GE ; et al. | 2018-03-15 |
| Lid Structure for a Semiconductor Device Package and Method for Forming the Same App 20180061783 - Ho; Kuan-Lin ; et al. | 2018-03-01 |
| Method of manufacturing a chip package Grant 9,893,043 - Chen , et al. February 13, 2 | 2018-02-13 |
| Semiconductor structure and manufacturing method thereof Grant 9,865,566 - Yu , et al. January 9, 2 | 2018-01-09 |
| Semiconductor Structure And Associated Method For Manufacturing The Same App 20180005919 - CHEN; CHIN-LIANG ; et al. | 2018-01-04 |
| Semiconductor Structure And Manufacturing Method Thereof App 20180005916 - CHEN; CHIN-LIANG ; et al. | 2018-01-04 |
| Package structure and methods of forming the same Grant 9,859,265 - Liu , et al. January 2, 2 | 2018-01-02 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170365581 - YU; CHI-YANG ; et al. | 2017-12-21 |
| Semiconductor Packaging Structure and Process App 20170345708 - Ho; Kuan-Lin ; et al. | 2017-11-30 |
| Lid structure for a semiconductor device package and method for forming the same Grant 9,812,410 - Ho , et al. November 7, 2 | 2017-11-07 |
| Packaging methods for semiconductor devices with encapsulant ring Grant 9,805,997 - Liu , et al. October 31, 2 | 2017-10-31 |
| Semiconductor device and manufacturing method thereof Grant 9,786,520 - Liu , et al. October 10, 2 | 2017-10-10 |
| System and Method for Bonding Package Lid App 20170271223 - Lin; Shih-Yen ; et al. | 2017-09-21 |
| Semiconductor packaging structure and process Grant 9,735,043 - Ho , et al. August 15, 2 | 2017-08-15 |
| Lid Structure for a Semiconductor Device Package and Method for Forming the Same App 20170194268 - HO; Kuan-Lin ; et al. | 2017-07-06 |
| System and method for bonding package lid Grant 9,673,119 - Lin , et al. June 6, 2 | 2017-06-06 |
| Lid Attach Processes For Semiconductor Packages App 20170076960 - CHEN; Chin-Liang ; et al. | 2017-03-16 |
| Lid attach process and apparatus for fabrication of semiconductor packages Grant 9,502,373 - Chen , et al. November 22, 2 | 2016-11-22 |
| Apparatus for manufacturing a semiconductor device and method of manufacturing a semiconductor device Grant 9,415,501 - Ho , et al. August 16, 2 | 2016-08-16 |
| Adhesive pattern for advance package reliability improvement Grant 9,287,233 - Chen , et al. March 15, 2 | 2016-03-15 |
| Semiconductor Device And Manufacturing Method Thereof App 20160071744 - LIU; YU-CHIH ; et al. | 2016-03-10 |
| Integrated Circuit Packages and Methods of Forming Same App 20150364344 - Yu; Chen-Hua ; et al. | 2015-12-17 |
| Package Structure and Methods of Forming the Same App 20150357309 - Liu; Yu-Chih ; et al. | 2015-12-10 |
| Method Of Manufacturing A Chip Package App 20150357318 - Chen; Chin-Liang ; et al. | 2015-12-10 |
| Semiconductor device and manufacturing method thereof Grant 9,209,046 - Liu , et al. December 8, 2 | 2015-12-08 |
| Semiconductor device and manufacturing method thereof Grant 9,142,523 - Liu , et al. September 22, 2 | 2015-09-22 |
| Packaging Methods for Semiconductor Devices, and Packaged Semiconductor Devices App 20150214074 - Liu; Yu-Chih ; et al. | 2015-07-30 |
| System and Method for Bonding Package Lid App 20150214128 - Lin; Shih-Yen ; et al. | 2015-07-30 |
| Touch panel and a bonding structure and method thereof Grant 9,087,703 - Chen , et al. July 21, 2 | 2015-07-21 |
| Lid Design for Heat Dissipation Enhancement of Die Package App 20150187679 - Ho; Kuan-Lin ; et al. | 2015-07-02 |
| Adhesive Film For Adhering To Substrate App 20150177778 - CHEN; CHIN-LIANG ; et al. | 2015-06-25 |
| Semiconductor Packaging Structure and Process App 20150179607 - Ho; Kuan-Lin ; et al. | 2015-06-25 |
| Adhesive Pattern For Advance Package Reliability Improvement App 20150155221 - Chen; Chin-Liang ; et al. | 2015-06-04 |
| Emiconductor Device And Manufacturing Method Thereof App 20150145115 - LIU; YU-CHIH ; et al. | 2015-05-28 |
| Illumination apparatus Grant 9,016,891 - Lin , et al. April 28, 2 | 2015-04-28 |
| Method Of Increasing Strength Of A Panel Edge App 20150104584 - Chen; Ting-Chieh ; et al. | 2015-04-16 |
| Semiconductor Device And Manufacturing Method Thereof App 20150093856 - LIU; YU-CHIH ; et al. | 2015-04-02 |
| Lid Attach Process And Apparatus For Fabrication Of Semiconductor Packages App 20150069089 - CHEN; Chin-Liang ; et al. | 2015-03-12 |
| Apparatus For Manufacturing A Semiconductor Device And Method Of Manufacturing A Semiconductor Device App 20150059159 - HO; KUAN-LIN ; et al. | 2015-03-05 |
| Decoration Plate And Electronic Apparatus Having The Same App 20150002980 - Hsu; Fu-Min ; et al. | 2015-01-01 |
| Lid attach process and apparatus for fabrication of semiconductor packages Grant 8,916,419 - Chen , et al. December 23, 2 | 2014-12-23 |
| Printing Method For Touch Panel Device App 20140345799 - Chen; Ting-Chieh ; et al. | 2014-11-27 |
| Light guide device Grant 8,894,266 - Ye , et al. November 25, 2 | 2014-11-25 |
| Decoration plate and electronic apparatus having the same Grant 8,873,248 - Hsu , et al. October 28, 2 | 2014-10-28 |
| Light guide device and illumination module using the same thereof Grant 8,864,355 - Lin , et al. October 21, 2 | 2014-10-21 |
| Illumination device Grant 8,845,164 - Ye , et al. September 30, 2 | 2014-09-30 |
| Rotatable illumination device Grant 8,777,464 - Lin , et al. July 15, 2 | 2014-07-15 |
| Illumination device capable of being controlled by blow Grant 8,770,782 - Ye , et al. July 8, 2 | 2014-07-08 |
| Touch Device App 20140126124 - HSU; CHEN-CHANG ; et al. | 2014-05-08 |
| Rotatable lighting apparatus Grant 8,708,510 - Chen , et al. April 29, 2 | 2014-04-29 |
| Light Emitting Device App 20130314939 - Ye; Zhi-Ting ; et al. | 2013-11-28 |
| Illumination Device App 20130258664 - Ye; Zhi-Ting ; et al. | 2013-10-03 |
| Lid Attach Process And Apparatus For Fabrication Of Semiconductor Packages App 20130260511 - CHEN; Chin-Liang ; et al. | 2013-10-03 |
| Illumination Device App 20130250605 - Ye; Zhi-Ting ; et al. | 2013-09-26 |
| Weight Sensing Device And Weight Sensing System App 20130234858 - Chen; Chin-Liang ; et al. | 2013-09-12 |
| Illumination Apparatus And Light Emitting Device Thereof App 20130208470 - Ye; Zhi-Ting ; et al. | 2013-08-15 |
| Light Guide Device App 20130208506 - Ye; Zhi-Ting ; et al. | 2013-08-15 |
| Illumination Apparatus App 20130208460 - Lin; Ming-Chuan ; et al. | 2013-08-15 |
| Polarized Light Source Module App 20130182406 - Ye; Zhi-Ting ; et al. | 2013-07-18 |
| Complex sheet structure and cover lens assembly Grant 8,481,144 - Hsu , et al. July 9, 2 | 2013-07-09 |
| Illumination device Grant D685,517 - Lu , et al. July 2, 2 | 2013-07-02 |
| Protective Cover And Lamp Module Therewith App 20130163242 - Chen; Chin-Liang ; et al. | 2013-06-27 |
| Illumination Module App 20130163222 - Ye; Zhi-Ting ; et al. | 2013-06-27 |
| Light Guide Device And Illumination Module Using The Same Thereof App 20130163280 - Lin; Ming-Chuan ; et al. | 2013-06-27 |
| Illumination Device Capable Of Being Controlled By Blow App 20130099667 - Ye; Zhi-Ting ; et al. | 2013-04-25 |
| Rotatable Illumination Device App 20130100684 - Lin; Chien-Ku ; et al. | 2013-04-25 |
| Illumination Apparatus App 20130044505 - Ye; Zhi-Ting ; et al. | 2013-02-21 |
| Rotatable Lighting Apparatus App 20120287653 - Chen; Chin-Liang ; et al. | 2012-11-15 |
| Illumination lamp Grant D668,368 - Lu , et al. October 2, 2 | 2012-10-02 |
| Decoration Plate And Electronic Apparatus Having The Same App 20120127686 - Hsu; Fu-Min ; et al. | 2012-05-24 |
| Composite Cover Sheet And Cover Sheet Assembly App 20110293870 - LIN; Ming-Chuan ; et al. | 2011-12-01 |
| Back light module Grant 8,016,476 - Chen , et al. September 13, 2 | 2011-09-13 |
| Flexible printed circuit and liquid crystal module using the same Grant 8,009,260 - Chen , et al. August 30, 2 | 2011-08-30 |
| Complex Sheet Structure And Cover Lens Assembly App 20110089010 - HSU; Fu-Min ; et al. | 2011-04-21 |
| Structure of rivet fixing device Grant 7,681,429 - Huang , et al. March 23, 2 | 2010-03-23 |
| Structure Of Rivet Fixing Device App 20100054892 - HUANG; TING-CHUN ; et al. | 2010-03-04 |
| Flexible Printed Circuit And Liquid Crystal Module Using The Same App 20100014016 - Chen; Ming-Da ; et al. | 2010-01-21 |
| Back Light Module App 20090284987 - Chen; Ming-Da ; et al. | 2009-11-19 |
| Back Light Module And Display Apparatus Using The Same App 20090257246 - Hsu; Fu-Min ; et al. | 2009-10-15 |
| Examining Device App 20060212266 - Chen; Chin-Liang | 2006-09-21 |
| Read/write Card For Flash Memory App 20060174098 - Chen; Chin-Liang | 2006-08-03 |
| Single piece cover for light guide App 20050094051 - Lin, Ming-Chuan ; et al. | 2005-05-05 |
| Refrigerating and heating device Grant 6,729,155 - Chen May 4, 2 | 2004-05-04 |
| Paper retaining structure of a loose-leaf file folder Grant 6,666,608 - Chen December 23, 2 | 2003-12-23 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 