CHEN; Chih-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for CHEN; Chih-Lin.The latest application filed is for "integrated circuit, semiconductor device and method of manufacturing same".

Company Profile

7.8.15

CHEN; Chih-Lin - Hsinchu TW
CHEN; Chih-Lin - Kaohsiung City TW
Chen; Chih-Lin - Kaohsiung TW
CHEN; Chih-Lin - New Taipei City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated Circuit, Semiconductor Device And Method Of Manufacturing Same App 20210305213 - CHEN; Chih-Lin ; et al.	2021-09-30
Heat transfer structures and methods for IC packages Grant 11,075,136 - Hsu , et al. July 27, 2	2021-07-27
Integrated circuit including a first semiconductor wafer and a second semiconductor wafer, semiconductor device including a first semiconductor wafer and a second semiconductor wafer and method of manufacturing same Grant 11,043,473 - Chen , et al. June 22, 2	2021-06-22
Package Structure And Method Of Forming Thereof App 20200402847 - CHEN; Chih-Lin ; et al.	2020-12-24
Package structure with inductor and method of forming thereof Grant 10,763,164 - Chen , et al. Sep	2020-09-01
Heat Transfer Structures And Methods For Ic Packages App 20200176349 - HSU; Ying-Chih ; et al.	2020-06-04
Integrated Circuit, Semiconductor Device And Method Of Manufacturing Same App 20200126952 - CHEN; Chih-Lin ; et al.	2020-04-23
Heat transfer structures and methods for IC packages Grant 10,559,517 - Hsu , et al. Feb	2020-02-11
Second semiconductor wafer attached to a first semiconductor wafer with a through hole connected to an inductor Grant 10,535,635 - Chen , et al. Ja	2020-01-14
A Second Semiconductor Wafer Attached To A First Semiconductor Wafer With A Through Hole Connected To An Inductor App 20190385980 - CHEN; Chih-Lin ; et al.	2019-12-19
Heat Transfer Structures And Methods For Ic Packages App 20190157180 - HSU; Ying-Chih ; et al.	2019-05-23
Heat transfer structures and methods for IC packages Grant 10,163,751 - Hsu , et al. Dec	2018-12-25
Box-type Laser Processing Machine Capable Of Vacuum Dedusting App 20180161929 - CHEN; Chih-Lin	2018-06-14
Heat Transfer Structures And Methods For Ic Packages App 20180151466 - HSU; Ying-Chih ; et al.	2018-05-31
Package Structure And Method Of Forming Thereof App 20180138126 - CHEN; Chih-Lin ; et al.	2018-05-17
Transceiver with wake up detection Grant 8,983,402 - Wang , et al. March 17, 2	2015-03-17
Transceiver With Wake Up Detection App 20150050897 - Wang; Chua-Chin ; et al.	2015-02-19
Automatic Compound Feeding And Recalling Laser Processing Equipment App 20130334180 - KUNG; Che-Min ; et al.	2013-12-19
Laser Processing Machine With Air Curtain Structure App 20130319975 - KUNG; CHE-MIN ; et al.	2013-12-05
Memory device and method of fabricating the same Grant 7,923,770 - Chen , et al. April 12, 2	2011-04-12
Memory Device And Method Of Fabricating The Same App 20090146266 - Chen; Chih-Lin ; et al.	2009-06-11

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