| Patent | Date |
|---|
Package Structures and Methods for Forming the Same
App 20220278031 - Hsiao; Ching-Wen ; et al. | 2022-09-01 |
Semiconductor Package And Manufacturing Method Thereof
App 20220238505 - Chen; Shih-Wei ; et al. | 2022-07-28 |
Package Structure And Method Of Manufacturing The Same
App 20220238406 - Tai; Chih-Hsuan ; et al. | 2022-07-28 |
Package Structure
App 20220165689 - TAI; Chih-Hsuan ; et al. | 2022-05-26 |
Package structures and methods for forming the same
Grant 11,342,253 - Hsiao , et al. May 24, 2 | 2022-05-24 |
Manufacturing method of semiconductor package including thermal conductive block
Grant 11,309,302 - Chen , et al. April 19, 2 | 2022-04-19 |
Fan-out package structure and method of manufacturing the same
Grant 11,309,225 - Tai , et al. April 19, 2 | 2022-04-19 |
Semiconductor Package And Method Of Manufacturing The Same
App 20220102314 - Chen; Shih-Wei ; et al. | 2022-03-31 |
Fingerprint Sensor Device And Method
App 20220067334 - Huang; Yu-Chih ; et al. | 2022-03-03 |
Package structure
Grant 11,251,141 - Tai , et al. February 15, 2 | 2022-02-15 |
Semiconductor package and method of manufacturing the same
Grant 11,205,636 - Chen , et al. December 21, 2 | 2021-12-21 |
Fingerprint sensor device and method
Grant 11,194,990 - Huang , et al. December 7, 2 | 2021-12-07 |
Semiconductor package and manufacturing process thereof
Grant 11,171,016 - Chen , et al. November 9, 2 | 2021-11-09 |
Robot Gripper For Moving Wafer Carriers And Packing Materials And Method Of Operating The Same
App 20210331327 - LEE; CHIEN-FA ; et al. | 2021-10-28 |
Package structure having sensor die with touch sensing electrode, and method of fabricating the same
Grant 11,158,555 - Kuo , et al. October 26, 2 | 2021-10-26 |
Fingerprint Sensor In Info Structure And Formation Method
App 20210271842 - Chen; Chih-Hua ; et al. | 2021-09-02 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20210217672 - Chen; Chih-Hua ; et al. | 2021-07-15 |
Package Structures and Method of Forming the Same
App 20210183745 - Yu; Chen-Hua ; et al. | 2021-06-17 |
Passive devices in package-on-package structures and methods for forming the same
Grant 11,018,086 - Chen , et al. May 25, 2 | 2021-05-25 |
Fingerprint sensor in InFO structure and formation method
Grant 11,010,580 - Chen , et al. May 18, 2 | 2021-05-18 |
Passive Devices in Package-on-Package Structures and Methods for Forming the Same
App 20210125923 - Chen; Chih-Hua ; et al. | 2021-04-29 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,964,610 - Chen , et al. March 30, 2 | 2021-03-30 |
Fingerprint Sensor Device and Method
App 20210081636 - Yu; Chen-Hua ; et al. | 2021-03-18 |
Package structures and method of forming the same
Grant 10,937,718 - Yu , et al. March 2, 2 | 2021-03-02 |
Semicondcutor Package And Method Of Manufacturing The Same
App 20210013177 - Chen; Shih-Wei ; et al. | 2021-01-14 |
Fingerprint Sensor
App 20200410198 - Tai; Chih-Hsuan ; et al. | 2020-12-31 |
Package-on-package structure
Grant 10,879,221 - Lu , et al. December 29, 2 | 2020-12-29 |
Fingerprint sensor pixel array and methods of forming same
Grant 10,878,073 - Huang , et al. December 29, 2 | 2020-12-29 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,879,228 - Chen , et al. December 29, 2 | 2020-12-29 |
Fingerprint sensor device and method
Grant 10,853,616 - Yu , et al. December 1, 2 | 2020-12-01 |
Package-on-package Structure
App 20200365569 - Lu; Chun-Ti ; et al. | 2020-11-19 |
Semiconductor package and method of manufacturing the same
Grant 10,811,384 - Chen , et al. October 20, 2 | 2020-10-20 |
Fingerprint Sensor Pixel Array and Methods of Forming Same
App 20200327214 - Huang; Yu-Chih ; et al. | 2020-10-15 |
Semiconductor Package And Manufacturing Method Thereof
App 20200303364 - Chen; Shih-Wei ; et al. | 2020-09-24 |
Semiconductor Package And Manufacturing Process Thereof
App 20200303211 - Chen; Yu-Feng ; et al. | 2020-09-24 |
Package Structure
App 20200294944 - TAI; Chih-Hsuan ; et al. | 2020-09-17 |
Fingerprint sensor and manufacturing method thereof
Grant 10,762,319 - Tai , et al. Sep | 2020-09-01 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20200251463 - Kind Code | 2020-08-06 |
Semiconductor package including thermal relaxation block and manufacturing method thereof
Grant 10,720,416 - Chen , et al. | 2020-07-21 |
Semiconductor package and manufacturing process thereof
Grant 10,707,094 - Chen , et al. | 2020-07-07 |
Fingerprint sensor pixel array and methods of forming same
Grant 10,698,994 - Huang , et al. | 2020-06-30 |
Package structure and method of forming package structure
Grant 10,672,729 - Tai , et al. | 2020-06-02 |
Method for forming a package structure including a package layer surrounding first connectors beside an integrated circuit die and second connectors below the integrated circuit die
Grant 10,658,334 - Cheng , et al. | 2020-05-19 |
Semicondcutor Package And Method Of Manufacturing The Same
App 20200135692 - Chen; Shih-Wei ; et al. | 2020-04-30 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,629,580 - Chen , et al. | 2020-04-21 |
Fan-out Package Structure And Method Of Manufacturing The Same
App 20200118900 - Tai; Chih-Hsuan ; et al. | 2020-04-16 |
Fingerprint Sensor Device and Method
App 20200117874 - Yu; Chen-Hua ; et al. | 2020-04-16 |
Oral Rehabilitation Device And Medical Treatment System Therewith
App 20200113768 - Chen; Mu-Kuan ; et al. | 2020-04-16 |
Mouth-opening training device having water-filled bag
Grant 10,610,720 - Chen , et al. | 2020-04-07 |
Package Structures and Methods for Forming the Same
App 20200083152 - Hsiao; Ching-Wen ; et al. | 2020-03-12 |
Semiconductor Package And Manufacturing Method Thereof
App 20200058632 - Chen; Shih-Wei ; et al. | 2020-02-20 |
Fingerprint sensor device and method
Grant 10,509,938 - Yu , et al. Dec | 2019-12-17 |
Fan out package structure and method of manufacturing the same
Grant 10,510,631 - Tai , et al. Dec | 2019-12-17 |
Package structures and methods for forming the same
Grant 10,510,644 - Hsiao , et al. Dec | 2019-12-17 |
Semicondcutor package and method of manufacturing the same
Grant 10,510,713 - Chen , et al. Dec | 2019-12-17 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20190341379 - Chen; Chih-Hua ; et al. | 2019-11-07 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20190341319 - Chen; Chih-Hua ; et al. | 2019-11-07 |
Fingerprint Sensor in InFO Structure and Formation Method
App 20190340405 - Chen; Chih-Hua ; et al. | 2019-11-07 |
Package Structure And Method Of Fabricating The Same
App 20190304864A1 - | 2019-10-03 |
Fingerprint Sensor Device and Method
App 20190251321 - Yu; Chen-Hua ; et al. | 2019-08-15 |
Semiconductor Package And Manufacturing Process Thereof
App 20190252209 - Chen; Yu-Feng ; et al. | 2019-08-15 |
Fingerprint Sensor Device and Method
App 20190244004 - Huang; Yu-Chih ; et al. | 2019-08-08 |
Fingerprint Sensor And Manufacturing Method Thereof
App 20190236326 - Tai; Chih-Hsuan ; et al. | 2019-08-01 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,361,181 - Chen , et al. | 2019-07-23 |
Fingerprint sensor in InFO structure and formation method
Grant 10,354,114 - Chen , et al. July 16, 2 | 2019-07-16 |
Packaging mechanisms for dies with different sizes of connectors
Grant 10,354,931 - Chen , et al. July 16, 2 | 2019-07-16 |
Package Structure And Manufacturing Method Thereof
App 20190139886 - Chen; Wei-Yu ; et al. | 2019-05-09 |
Semiconductor package and manufacturing process thereof
Grant 10,276,402 - Chen , et al. | 2019-04-30 |
Fingerprint Sensor Pixel Array and Methods of Forming Same
App 20190121952 - Huang; Yu-Chih ; et al. | 2019-04-25 |
Fingerprint sensor device and method
Grant 10,268,868 - Yu , et al. | 2019-04-23 |
Fingerprint sensor device and method
Grant 10,268,872 - Huang , et al. | 2019-04-23 |
Passive Devices in Package-on-Package Structures and Methods for Forming the Same
App 20190115298 - Chen; Chih-Hua ; et al. | 2019-04-18 |
Package Structure And Method Of Manufacturing The Same
App 20190088564 - Tai; Chih-Hsuan ; et al. | 2019-03-21 |
Package structure and method of forming package structure
Grant 10,157,808 - Tai , et al. Dec | 2018-12-18 |
Fingerprint sensor pixel array and methods of forming same
Grant 10,157,274 - Huang , et al. Dec | 2018-12-18 |
Method for forming a passive device on a package-on-package structure
Grant 10,157,829 - Chen , et al. Dec | 2018-12-18 |
Package Structure And Method Of Forming Package Structure
App 20180286823 - TAI; Chih-Hsuan ; et al. | 2018-10-04 |
Package Structure And Method Of Forming Package Structure
App 20180286776 - TAI; Chih-Hsuan ; et al. | 2018-10-04 |
Package structure and method of fabricating the same
Grant 10,074,615 - Tseng , et al. September 11, 2 | 2018-09-11 |
Magnetic capacitor structures
Grant 10,026,551 - Hsieh , et al. July 17, 2 | 2018-07-17 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20180197846 - Chen; Chih-Hua ; et al. | 2018-07-12 |
Fingerprint Sensor Pixel Array and Methods of Forming Same
App 20180181738 - Huang; Yu-Chih ; et al. | 2018-06-28 |
Carrier concentration measuring method and apparatus thereof
Grant 10,006,864 - Hsieh , et al. June 26, 2 | 2018-06-26 |
Fingerprint Sensor Device and Method
App 20180173932 - Huang; Yu-Chih ; et al. | 2018-06-21 |
Package Structures and Method of Forming the Same
App 20180166364 - Yu; Chen-Hua ; et al. | 2018-06-14 |
Fingerprint Sensor Device and Method
App 20180150667 - Yu; Chen-Hua ; et al. | 2018-05-31 |
Optical sensing system and associated electronic device
Grant 9,943,239 - Kuo , et al. April 17, 2 | 2018-04-17 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,911,725 - Chen , et al. March 6, 2 | 2018-03-06 |
Multi-chip package system and methods of forming the same
Grant 9,911,724 - Chen , et al. March 6, 2 | 2018-03-06 |
Fingerprint sensor pixel array and methods of forming same
Grant 9,904,776 - Huang , et al. February 27, 2 | 2018-02-27 |
Method For Forming A Package Structure Including Forming A Molding Compound On First Larger Bumps Surrounding A Semiconductor Die And Second Smaller Bumps Formed Under The Semiconductor Die
App 20180053745 - CHENG; Yu-Jen ; et al. | 2018-02-22 |
Fingerprint sensor device and method
Grant 9,898,645 - Huang , et al. February 20, 2 | 2018-02-20 |
Package structures and method of forming the same
Grant 9,881,850 - Yu , et al. January 30, 2 | 2018-01-30 |
Metal routing architecture for integrated circuits
Grant 9,881,885 - Kuo , et al. January 30, 2 | 2018-01-30 |
Fingerprint sensor device and method
Grant 9,875,388 - Yu , et al. January 23, 2 | 2018-01-23 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20170372976 - Chen; Chih-Hua ; et al. | 2017-12-28 |
Fingerprint Sensor in InFO Structure and Formation Method
App 20170357838 - Chen; Chih-Hua ; et al. | 2017-12-14 |
Package Structures and Methods for Forming the Same
App 20170278777 - Hsiao; Ching-Wen ; et al. | 2017-09-28 |
Semicondcutor Package And Manufacturing Process Thereof
App 20170271248 - Chen; Yu-Feng ; et al. | 2017-09-21 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,761,503 - Chen , et al. September 12, 2 | 2017-09-12 |
Optical Sensing System And Associated Electronic Device
App 20170251937 - KUO; HUNG-YI ; et al. | 2017-09-07 |
Fingerprint Sensor Device and Method
App 20170249493 - Yu; Chen-Hua ; et al. | 2017-08-31 |
Apparatus and method for a component package
Grant 9,748,216 - Chen , et al. August 29, 2 | 2017-08-29 |
Packaging Mechanisms for Dies With Different Sizes of Connectors
App 20170236813 - Chen; Chih-Hua ; et al. | 2017-08-17 |
Fingerprint Sensor Pixel Array And Methods Of Forming Same
App 20170228529 - Huang; Yu-Chih ; et al. | 2017-08-10 |
Multi-chip Package System And Methods Of Forming The Same
App 20170207208 - Chen; Chih-Hua ; et al. | 2017-07-20 |
Semiconductor package and manufacturing method thereof
Grant 9,691,708 - Huang , et al. June 27, 2 | 2017-06-27 |
Package structures and methods for forming the same
Grant 9,679,836 - Hsiao , et al. June 13, 2 | 2017-06-13 |
Fingerprint Sensor Device and Method
App 20170140202 - Huang; Yu-Chih ; et al. | 2017-05-18 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,646,894 - Chen , et al. May 9, 2 | 2017-05-09 |
Carrier Concentration Measuring Method And Apparatus Thereof
App 20170097303 - HSIEH; CHO-FAN ; et al. | 2017-04-06 |
Package Structures and Method of Forming the Same
App 20170084590 - Yu; Chen-Hua ; et al. | 2017-03-23 |
Multi-chip package system and methods of forming the same
Grant 9,589,941 - Chen , et al. March 7, 2 | 2017-03-07 |
Mouth-opening Training Device Having Water-filled Bag
App 20170056282 - CHEN; Mu-Kuan ; et al. | 2017-03-02 |
Pop structures and methods of forming the same
Grant 9,490,167 - Chen , et al. November 8, 2 | 2016-11-08 |
Methods and apparatus for forming package-on-packages
Grant 9,478,474 - Chen , et al. October 25, 2 | 2016-10-25 |
Passive Devices in Package-on-Package Structures and Methods for Forming the Same
App 20160233161 - Chen; Chih-Hua ; et al. | 2016-08-11 |
Passive devices in package-on-package structures and methods for forming the same
Grant 9,343,442 - Chen , et al. May 17, 2 | 2016-05-17 |
Conductive pillar structure for semiconductor substrate and method of manufacture
Grant 9,312,230 - Chen , et al. April 12, 2 | 2016-04-12 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 9,293,449 - Hu , et al. March 22, 2 | 2016-03-22 |
Metal Routing Architecture for Integrated Circuits
App 20160079192 - Kuo; Chen-Cheng ; et al. | 2016-03-17 |
Through-assembly via modules and methods for forming the same
Grant 9,257,332 - Chen , et al. February 9, 2 | 2016-02-09 |
PoP structures including through-assembly via modules
Grant 9,258,922 - Chen , et al. February 9, 2 | 2016-02-09 |
Metal routing architecture for integrated circuits
Grant 9,224,688 - Chuang , et al. December 29, 2 | 2015-12-29 |
Magnetic Capacitor Structures
App 20150371777 - HSIEH; Cho-Fan ; et al. | 2015-12-24 |
Loudspeaker with rotatable sound-reflecting member
Grant 9,173,019 - Chen October 27, 2 | 2015-10-27 |
Packaging Mechanisms for Dies with Different Sizes of Connectors
App 20150262898 - Chen; Chih-Hua ; et al. | 2015-09-17 |
Packaging mechanisms for dies with different sizes of connectors
Grant 9,070,644 - Chen , et al. June 30, 2 | 2015-06-30 |
POP Structures and Methods of Forming the Same
App 20150155203 - Chen; Hsu-Hsien ; et al. | 2015-06-04 |
Packaging and function tests for package-on-package and system-in-package structures
Grant 9,040,350 - Liu , et al. May 26, 2 | 2015-05-26 |
Loudspeaker With Rotatable Sound-reflecting Member
App 20150139454 - CHEN; CHIH-HUA | 2015-05-21 |
Loudspeaker
App 20150131817 - CHEN; CHIH-HUA | 2015-05-14 |
Loudspeaker
App 20150131818 - CHEN; CHIH-HUA | 2015-05-14 |
Loudspeaker
Grant 9,031,263 - Chen May 12, 2 | 2015-05-12 |
Through-Assembly Via Modules and Methods for Forming the Same
App 20150093881 - Chen; Chih-Hua ; et al. | 2015-04-02 |
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections
App 20150072476 - Hu; Yen-Chang ; et al. | 2015-03-12 |
Apparatus and Method for a Component Package
App 20150069595 - Chen; Chih-Hua ; et al. | 2015-03-12 |
POP structures and methods of forming the same
Grant 8,975,726 - Chen , et al. March 10, 2 | 2015-03-10 |
Fan module
Grant 8,967,963 - Chen March 3, 2 | 2015-03-03 |
Through-assembly via modules and methods for forming the same
Grant 8,928,114 - Chen , et al. January 6, 2 | 2015-01-06 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 8,922,005 - Hu , et al. December 30, 2 | 2014-12-30 |
Methods and apparatus for package on package devices with reversed stud bump through via interconnections
Grant 08922005 - | 2014-12-30 |
Multi-direction design for bump pad structures
Grant 8,916,971 - Chen , et al. December 23, 2 | 2014-12-23 |
Fan Module
App 20140363286 - CHEN; CHIH-HUA | 2014-12-11 |
Fixing Apparatus For Hard Disk Drive
App 20140353444 - CHEN; CHIH-HUA | 2014-12-04 |
Apparatus and method for a component package
Grant 8,889,484 - Chen , et al. November 18, 2 | 2014-11-18 |
Fan
App 20140328686 - CHEN; CHIH-HUA | 2014-11-06 |
Packaging Mechanisms For Dies With Different Sizes Of Connectors
App 20140264769 - Chen; Chih-Hua ; et al. | 2014-09-18 |
Packaging Mechanisms For Dies With Different Sizes Of Connectors
App 20140264337 - Chen; Chih-Hua ; et al. | 2014-09-18 |
Packaging and Function Tests for Package-on-Package and System-in-Package Structures
App 20140248722 - Liu; Hao-Juin ; et al. | 2014-09-04 |
Multi-Direction Design for Bump Pad Structures
App 20140220776 - Chen; Chih-Hua ; et al. | 2014-08-07 |
Metal Routing Architecture for Integrated Circuits
App 20140191390 - Chuang; Chita ; et al. | 2014-07-10 |
Methods And Apparatus For Forming Package-on-packages
App 20140185264 - Chen; Hsu-Hsien ; et al. | 2014-07-03 |
Packaging and function tests for package-on-package and system-in-package structures
Grant 8,765,497 - Liu , et al. July 1, 2 | 2014-07-01 |
Dummy metal design for packaging structures
Grant 8,753,971 - Liu , et al. June 17, 2 | 2014-06-17 |
Fastening device for hard disk drive
Grant 8,737,063 - Chen May 27, 2 | 2014-05-27 |
Multi-direction design for bump pad structures
Grant 8,729,700 - Chen , et al. May 20, 2 | 2014-05-20 |
Through-substrate via for semiconductor device
Grant 8,703,609 - Kuo , et al. April 22, 2 | 2014-04-22 |
POP Structures and Methods of Forming the Same
App 20140103488 - Chen; Hsu-Hsien ; et al. | 2014-04-17 |
Apparatus and Method for a Component Package
App 20140091471 - Chen; Chih-Hua ; et al. | 2014-04-03 |
Passive Devices in Package-on-Package Structures and Methods for Forming the Same
App 20140076617 - Chen; Chih-Hua ; et al. | 2014-03-20 |
Fastening Device For Hard Disk Drive
App 20140049903 - CHEN; CHIH-HUA | 2014-02-20 |
Zigzag pattern for TSV copper adhesion
Grant 8,653,648 - Chen , et al. February 18, 2 | 2014-02-18 |
Package-on-package structure without through assembly vias
Grant 8,624,376 - Chen , et al. January 7, 2 | 2014-01-07 |
Fan module and vibration-damping mounting therefor
Grant 8,613,588 - Chen December 24, 2 | 2013-12-24 |
Bump-on-trace structures in packaging
Grant 8,598,715 - Chen December 3, 2 | 2013-12-03 |
Methods and Apparatus for Package on Package Devices with Reversed Stud Bump Through Via Interconnections
App 20130270682 - Hu; Yen-Chang ; et al. | 2013-10-17 |
Multi-direction design for bump pad structures
Grant 8,546,941 - Chen , et al. October 1, 2 | 2013-10-01 |
Multi-Direction Design for Bump Pad Structures
App 20130249091 - Chen; Chih-Hua ; et al. | 2013-09-26 |
Through-Assembly Via Modules and Methods for Forming the Same
App 20130181325 - Chen; Chih-Hua ; et al. | 2013-07-18 |
PoP Structures Including Through-Assembly Via Modules
App 20130182402 - Chen; Chih-Hua ; et al. | 2013-07-18 |
Through-silicon vias and methods for forming the same
Grant 8,476,769 - Chen , et al. July 2, 2 | 2013-07-02 |
Bump-on-Trace Structures in Packaging
App 20130140689 - Chen; Chih-Hua | 2013-06-06 |
Package Structures and Methods for Forming the Same
App 20130119539 - Hsiao; Ching-Wen ; et al. | 2013-05-16 |
Test patterns for detecting misalignment of through-wafer vias
Grant 8,431,421 - Chen April 30, 2 | 2013-04-30 |
Packaging and Function Tests for Package-on-Package and System-in-Package Structures
App 20130056872 - Liu; Hao-Juin ; et al. | 2013-03-07 |
Fan Module
App 20130028709 - CHEN; CHIH-HUA | 2013-01-31 |
Fan module with vibration-resistent mounting
Grant 8,322,974 - Chen December 4, 2 | 2012-12-04 |
Rack server center
Grant 8,315,054 - Chen November 20, 2 | 2012-11-20 |
Loudspeaker device with sound enhancing structure
Grant 8,259,965 - Chen September 4, 2 | 2012-09-04 |
Dummy Metal Design for Packaging Structures
App 20120178252 - Liu; Tzuan-Horng ; et al. | 2012-07-12 |
Rack Server Center
App 20120162886 - CHEN; CHIH-HUA | 2012-06-28 |
Method of forming through silicon via with dummy structure
Grant 8,202,800 - Chen , et al. June 19, 2 | 2012-06-19 |
Dummy metal design for packaging structures
Grant 8,193,639 - Liu , et al. June 5, 2 | 2012-06-05 |
Side Plate Assembly For A Device Casing
App 20120133257 - CHEN; CHIH-HUA ; et al. | 2012-05-31 |
Strong interconnection post geometry
Grant 8,178,970 - Shen , et al. May 15, 2 | 2012-05-15 |
Fan Module And Vibration-damping Mounting Therefor
App 20120114461 - CHEN; CHIH-HUA | 2012-05-10 |
Through-silicon via with scalloped sidewalls
Grant 8,049,327 - Kuo , et al. November 1, 2 | 2011-11-01 |
Through-substrate Via For Semiconductor Device
App 20110263120 - Kuo; Chen-Cheng ; et al. | 2011-10-27 |
Dummy Metal Design for Packaging Structures
App 20110241202 - Liu; Tzuan-Horng ; et al. | 2011-10-06 |
Fan Guard
App 20110243723 - CHEN; CHIH-HUA | 2011-10-06 |
Under-Bump Metallization Structure for Semiconductor Devices
App 20110227216 - Tseng; Ming-Hung ; et al. | 2011-09-22 |
Loudspeaker Device With Sound Enhancing Structure
App 20110228968 - CHEN; CHIH-HUA | 2011-09-22 |
Method Of Forming Through Silicon Via With Dummy Structure
App 20110217841 - CHEN; Chih-Hua ; et al. | 2011-09-08 |
Conductive Pillar Structure For Semiconductor Substrate And Method Of Manufacture
App 20110193232 - CHEN; Chih-Hua ; et al. | 2011-08-11 |
Multi-Direction Design for Bump Pad Structures
App 20110186988 - Chen; Chih-Hua ; et al. | 2011-08-04 |
Through-substrate via for semiconductor device
Grant 7,973,413 - Kuo , et al. July 5, 2 | 2011-07-05 |
Through silicon via with dummy structure and method for forming the same
Grant 7,969,013 - Chen , et al. June 28, 2 | 2011-06-28 |
Fan Module With Vibration-resistent Mounting
App 20110135448 - CHEN; CHIH-HUA | 2011-06-09 |
Through Silicon Via With Dummy Structure And Method For Forming The Same
App 20110095436 - CHEN; Chih-Hua ; et al. | 2011-04-28 |
Strong Interconnection Post Geometry
App 20110068465 - Shen; Wen-Wei ; et al. | 2011-03-24 |
Tapered through-silicon via structure
Grant 7,816,227 - Chen , et al. October 19, 2 | 2010-10-19 |
Multi-die wafer level packaging
Grant 7,785,927 - Chen , et al. August 31, 2 | 2010-08-31 |
Through-Silicon Via With Scalloped Sidewalls
App 20100171223 - Kuo; Chen-Cheng ; et al. | 2010-07-08 |
Zigzag Pattern for TSV Copper Adhesion
App 20100084747 - Chen; Chih-Hua ; et al. | 2010-04-08 |
Tapered Through-Silicon Via Structure
App 20090269905 - Chen; Chen-Shien ; et al. | 2009-10-29 |
Test Patterns for Detecting Misalignment of Through-Wafer Vias
App 20090186430 - Chen; Chih-Hua | 2009-07-23 |
Tapered through-silicon via structure
Grant 7,564,115 - Chen , et al. July 21, 2 | 2009-07-21 |
Semiconductor structure with a discontinuous material density for reducing eddy currents
Grant 7,557,423 - Ching , et al. July 7, 2 | 2009-07-07 |
Multi-Die Wafer Level Packaging
App 20090155957 - Chen; Chen-Shien ; et al. | 2009-06-18 |
Test patterns for detecting misalignment of through-wafer vias
Grant 7,528,492 - Chen May 5, 2 | 2009-05-05 |
Through-Silicon Vias and Methods for Forming the Same
App 20090102021 - Chen; Chih-Hua ; et al. | 2009-04-23 |
Multi-die wafer level packaging
Grant 7,514,797 - Chen , et al. April 7, 2 | 2009-04-07 |
Semiconductor Structure with a Discontinuous Material Density for Reducing Eddy Currents
App 20090057823 - Ching; Kai Ming ; et al. | 2009-03-05 |
Through-substrate Via For Semiconductor Device
App 20090051039 - Kuo; Chen-Cheng ; et al. | 2009-02-26 |
Multi-Die Wafer Level Packaging
App 20080296763 - Chen; Chen-Shien ; et al. | 2008-12-04 |
Test patterns for detecting misalignment of through-wafer vias
App 20080290526 - Chen; Chih-Hua | 2008-11-27 |
Tapered through-silicon via structure
App 20080283959 - Chen; Chen-Shien ; et al. | 2008-11-20 |
Inductor structure
App 20080100408 - Chen; Chih-Hua | 2008-05-01 |
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