Chen; Chien-Hui
Patent Applications and Registrations
Patent applications and USPTO patent grants for Chen; Chien-Hui.The latest application filed is for "wireless charger".
Company Profile
2.41.34
- Chen; Chien-Hui - Taoyuan City TW
- Chen; Chien-Hui - Jhu-Dong Township TW
- Chen; Chien-Hui - Taoyuan TW
- CHEN; CHIEN-HUI - New Taipei City TW
- Chen; Chien-Hui - Zhongli TW
- CHEN; Chien-Hui - Zhongli City TW
- Chen; Chien-Hui - Taoyuan County TW
- Chen; Chien-Hui - Jhongli N/A TW
- Chen; Chien-Hui - Jhongli City TW
- Chen; Chien-Hui - Keelung TW
- Chen; Chien-Hui - Keelung City TW
- Chen; Chien-Hui - Hsichih TW
Patent Activity
| Patent | Date |
|---|---|
| Wireless Charger App 20220239152 - WU; TSUNG-CHAN ; et al. | 2022-07-28 |
| Wireless Charger App 20220158491 - WU; TSUNG-CHAN ; et al. | 2022-05-19 |
| Systems And Methods For Systematic Physical Failure Analysis (pfa) Fault Localization App 20200133959 - Chen; Peng-Ren ; et al. | 2020-04-30 |
| Wafer coating system and method of manufacturing chip package Grant 10,388,541 - Chen , et al. A | 2019-08-20 |
| Electronic Device App 20180052500 - WANG; JO-CHIAO ; et al. | 2018-02-22 |
| Method for forming chip package Grant 9,711,403 - Chen , et al. July 18, 2 | 2017-07-18 |
| Integrated circuit comprising buffer chain Grant 9,478,469 - Chuang , et al. October 25, 2 | 2016-10-25 |
| Wafer Coating System And Method Of Manufacturing Chip Package App 20160307779 - CHEN; Yu-Tung ; et al. | 2016-10-20 |
| Chip package and method for forming the same Grant 9,437,478 - Ho , et al. September 6, 2 | 2016-09-06 |
| Chip package Grant 9,425,134 - Ho , et al. August 23, 2 | 2016-08-23 |
| Chip package and method for forming the same Grant 9,355,970 - Huang , et al. May 31, 2 | 2016-05-31 |
| Chip package and method for forming the same Grant 9,355,975 - Ho , et al. May 31, 2 | 2016-05-31 |
| Chip package and method for forming the same Grant 9,349,710 - Chen , et al. May 24, 2 | 2016-05-24 |
| Wafer level array of chips and method thereof Grant 9,318,461 - Chang , et al. April 19, 2 | 2016-04-19 |
| Chip package and method for forming the same Grant 9,305,843 - Chen , et al. April 5, 2 | 2016-04-05 |
| Chip Package And Method For Forming The Same App 20160086896 - HUANG; Yu-Lung ; et al. | 2016-03-24 |
| Semiconductor structure having stage difference surface and manufacturing method thereof Grant 9,275,963 - Tsai , et al. March 1, 2 | 2016-03-01 |
| Chip package Grant 9,209,124 - Huang , et al. December 8, 2 | 2015-12-08 |
| Chip package and method for forming the same Grant 9,184,092 - Yen , et al. November 10, 2 | 2015-11-10 |
| Chip package comprising alignment mark and method for forming the same Grant 9,165,890 - Ho , et al. October 20, 2 | 2015-10-20 |
| Integrated Circuit Comprising Buffer Chain App 20150187666 - Chuang; Yi-Lin ; et al. | 2015-07-02 |
| Chip Package And Method For Forming The Same App 20150162245 - CHEN; Bing-Siang ; et al. | 2015-06-11 |
| Chip package and method for forming the same Grant 9,024,437 - Yen , et al. May 5, 2 | 2015-05-05 |
| Chip Package And Method For Forming The Same App 20150097299 - CHEN; Chien-Hui ; et al. | 2015-04-09 |
| Integrated circuit comprising buffer chain Grant 8,981,842 - Chuang , et al. March 17, 2 | 2015-03-17 |
| Stacked chip package and method for forming the same Grant 8,963,312 - Ho , et al. February 24, 2 | 2015-02-24 |
| Chip package and method for forming the same Grant 8,952,501 - Huang , et al. February 10, 2 | 2015-02-10 |
| Chip package and method for forming the same Grant 8,951,836 - Yen , et al. February 10, 2 | 2015-02-10 |
| Stacked Chip Package And Method For Forming The Same App 20140332983 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Chip Package App 20140332968 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Chip Package And Method For Forming The Same App 20140332969 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Chip Package And Method For Forming The Same App 20140332908 - HO; Yen-Shih ; et al. | 2014-11-13 |
| Substrate structure with through vias Grant 8,878,367 - Lin , et al. November 4, 2 | 2014-11-04 |
| Wafer Level Array Of Chips And Method Thereof App 20140312482 - CHANG; Chun-Wei ; et al. | 2014-10-23 |
| Semiconductor stacked package and method of fabricating the same Grant 8,836,134 - Lin , et al. September 16, 2 | 2014-09-16 |
| Semiconductor Structure And Manufacturing Method Thereof App 20140252659 - TSAI; Yung-Tai ; et al. | 2014-09-11 |
| Chip Package And Method For Forming The Same App 20140199835 - YEN; Yu-Lin ; et al. | 2014-07-17 |
| Chip Package And Method For Forming The Same App 20140199830 - YEN; Yu-Lin ; et al. | 2014-07-17 |
| High-reflection submount for light-emitting diode package and fabrication method thereof Grant 8,778,707 - Wu , et al. July 15, 2 | 2014-07-15 |
| Chip package Grant 8,698,316 - Yen , et al. April 15, 2 | 2014-04-15 |
| Chip package Grant 8,692,382 - Yen , et al. April 8, 2 | 2014-04-08 |
| Chip Package And Method For Forming The Same App 20140054786 - HUANG; Yu-Lung ; et al. | 2014-02-27 |
| Chip package and method for forming the same Grant 8,643,070 - Chang , et al. February 4, 2 | 2014-02-04 |
| High-reflection Submount For Light-emitting Diode Package And Fabrication Method Thereof App 20140017828 - WU; Shang-Yi ; et al. | 2014-01-16 |
| Chip Package And Method For Forming The Same App 20140015111 - HO; Yen-Shih ; et al. | 2014-01-16 |
| Chip Package And Method For Forming The Same App 20130307125 - HUANG; Yu-Lung ; et al. | 2013-11-21 |
| High-reflection submount for light-emitting diode package and fabrication method thereof Grant 8,558,262 - Wu , et al. October 15, 2 | 2013-10-15 |
| Chip package and method for forming the same Grant 8,552,565 - Yen , et al. October 8, 2 | 2013-10-08 |
| Chip package and method for forming the same Grant 8,525,345 - Yen , et al. September 3, 2 | 2013-09-03 |
| Semiconductor Stacked Package And Method Of Fabricating The Same App 20130187263 - Lin; Po-Shen ; et al. | 2013-07-25 |
| Chip Package And Method For Forming The Same App 20120319297 - YEN; Yu-Lin ; et al. | 2012-12-20 |
| Chip Package And Method For Forming The Same App 20120267780 - CHEN; Bing-Siang ; et al. | 2012-10-25 |
| Method For Forming Chip Package App 20120184070 - CHEN; Chien-Hui ; et al. | 2012-07-19 |
| Chip Package And Method For Forming The Same App 20120146108 - CHANG; Shu-Ming ; et al. | 2012-06-14 |
| Process of Fabricating Semiconductor Device and Through Substrate via, and Through Substrate via Structure Therefrom App 20120133049 - Lin; Chia-Sheng ; et al. | 2012-05-31 |
| Methods for detecting defect connections between metal bumps Grant 8,113,412 - Tseng , et al. February 14, 2 | 2012-02-14 |
| Chip Package And Method For Forming The Same App 20110285032 - YEN; Yu-Lin ; et al. | 2011-11-24 |
| Chip Package And Method For Forming The Same App 20110278734 - YEN; Yu-Lin ; et al. | 2011-11-17 |
| Chip Package And Method For Forming The Same App 20110278735 - YEN; Yu-Lin ; et al. | 2011-11-17 |
| Chip Package And Method For Forming The Same App 20110221070 - Yen; Yu-Lin ; et al. | 2011-09-15 |
| High-reflection Submount For Light-emitting Diode Package And Fabrication Method Thereof App 20110198646 - Wu; Shang-Yi ; et al. | 2011-08-18 |
| Host device with power-saving function Grant 7,975,157 - Lee , et al. July 5, 2 | 2011-07-05 |
| Host device with power-saving function App 20100023789 - Lee; Lian-Chun ; et al. | 2010-01-28 |
| System and method for regulating a load by utilizing pulse width modulation Grant 7,283,733 - Chiu , et al. October 16, 2 | 2007-10-16 |
| System and method for regulating a load by utilizing pulse width modulation App 20060127066 - Chiu; Chih-Kai ; et al. | 2006-06-15 |
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