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Patent applications and USPTO patent grants for CHEN; Chiao-Pei.The latest application filed is for "polyimide precursor and lithography pattern formed by the same".
Patent | Date |
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Polyimide Precursor And Lithography Pattern Formed By The Same App 20190163061 - CHEN; Chi-Shian ;   et al. | 2019-05-30 |
Polyimide polymer, polyimide film, and flexible copper-coated laminate Grant 9,955,572 - Fang , et al. April 24, 2 | 2018-04-24 |
Adhesive Composition And Laminated Film App 20180086952 - Teng; I-Ling ;   et al. | 2018-03-29 |
Polyimide And Polyimide Film App 20170152348 - Fang; Yi-Kai ;   et al. | 2017-06-01 |
Polyimide Polymer, Polyimide Film, And Flexible Copper-coated Laminate App 20170034910 - Fang; Yi-Kai ;   et al. | 2017-02-02 |
Polyimide polymer, polyimide film, and flexible copper-coated laminate Grant 9,505,887 - Fang , et al. November 29, 2 | 2016-11-29 |
Polyimide Polymer, Polyimide Film, And Flexible Copper-coated Laminate App 20160115277 - Fang; Yi-Kai ;   et al. | 2016-04-28 |
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