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Manufacturing method of package on package structure
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Safety Helmet Inner Lining Adjustable For Suitable Wearing
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Semiconductor packaging structure and method
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Package Structure
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Iintegrated Fan-out Packages With Embedded Heat Dissipation Structure
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Integrated fan-out packages with embedded heat dissipation structure
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Method of singulate a package structure using a light transmitting film on a polymer layer
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Stud bump structure for semiconductor package assemblies
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Method Of Singulate A Package Structure Using A Light Transmitting Film On A Polymer Layer
App 20200365420 - Chen; Cheng-Ting ; et al. | 2020-11-19 |
Method of processing solder bump by vacuum annealing
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Package Structure
App 20200271873 - Chang; Chia-Lun ; et al. | 2020-08-27 |
Manufacturing Method Of Package On Package Structure
App 20200152616 - Kuo; Hsuan-Ting ; et al. | 2020-05-14 |
Integrated fan-out packages with embedded heat dissipation structure
Grant 10,566,261 - Pei , et al. Feb | 2020-02-18 |
Warpage Control in the Packaging of Integrated Circuits
App 20200045777 - Cheng; Ming-Da ; et al. | 2020-02-06 |
System and method to reduce pre-back-grinding process defects
Grant 10534353 - | 2020-01-14 |
Manufacturing method of package on package structure
Grant 10,535,644 - Kuo , et al. Ja | 2020-01-14 |
Manufacturing Method Of Package On Package Structure
App 20200006308 - Kuo; Hsuan-Ting ; et al. | 2020-01-02 |
Integrated Fan-out Packages With Embedded Heat Dissipation Structure
App 20200006191 - Pei; Hao-Jan ; et al. | 2020-01-02 |
Warpage control in the packaging of integrated circuits
Grant 10,512,124 - Cheng , et al. Dec | 2019-12-17 |
Integrated fan-out packages with embedded heat dissipation structure
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Semiconductor Package Structure and Semiconductor Package Structure Fabricating Method
App 20190181108 - Chen; Cheng Ting ; et al. | 2019-06-13 |
Integrated Fan-Out Packages and Methods of Forming the Same
App 20190148262 - Pei; Hao-Jan ; et al. | 2019-05-16 |
System and method for an improved fine pitch joint
Grant 10,062,659 - Chen , et al. August 28, 2 | 2018-08-28 |
Interconnect joint protective layer apparatus and method
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Semiconductor packaging and manufacturing method thereof
Grant 9,935,044 - Lin , et al. April 3, 2 | 2018-04-03 |
Semiconductor Packaging Structure and Method
App 20180047708 - Lin; Chun-Cheng ; et al. | 2018-02-15 |
Stud Bump Structure For Semiconductor Package Assemblies
App 20180005973 - CHEN; Meng-Tse ; et al. | 2018-01-04 |
Semiconductor packaging structure and method
Grant 9,799,631 - Lin , et al. October 24, 2 | 2017-10-24 |
Stud bump structure for semiconductor package assemblies
Grant 9,768,137 - Chen , et al. September 19, 2 | 2017-09-19 |
Semiconductor Packaging Structure and Method
App 20170179083 - Lin; Chun-Cheng ; et al. | 2017-06-22 |
Method and apparatus for localized and controlled removal of material from a substrate
Grant 9,627,234 - Huang , et al. April 18, 2 | 2017-04-18 |
Warpage Control in the Packaging of Integrated Circuits
App 20170098571 - Cheng; Ming-Da ; et al. | 2017-04-06 |
Semiconductor packaging structure and method
Grant 9,583,464 - Lin , et al. February 28, 2 | 2017-02-28 |
Warpage control in the packaging of integrated circuits
Grant 9,538,582 - Cheng , et al. January 3, 2 | 2017-01-03 |
Semiconductor Packaging Structure and Method
App 20160343692 - Lin; Chun-Cheng ; et al. | 2016-11-24 |
Interconnect structure and method of fabricating same
Grant 9,437,564 - Lu , et al. September 6, 2 | 2016-09-06 |
Plasma treatment for semiconductor devices
Grant 9,418,955 - Lu , et al. August 16, 2 | 2016-08-16 |
Semiconductor Packaging And Manufacturing Method Thereof
App 20160218055 - LIN; HSIU-JEN ; et al. | 2016-07-28 |
Reflow process and tool
Grant 9,373,603 - Ang , et al. June 21, 2 | 2016-06-21 |
Semiconductor packaging and manufacturing method thereof
Grant 9,355,927 - Lin , et al. May 31, 2 | 2016-05-31 |
System and Method for an Improved Fine Pitch Joint
App 20160148889 - Chen; Cheng-Ting ; et al. | 2016-05-26 |
System and method for fine pitch PoP structure
Grant 9,281,288 - Lin , et al. March 8, 2 | 2016-03-08 |
System and method for an improved fine pitch joint
Grant 9,263,839 - Chen , et al. February 16, 2 | 2016-02-16 |
Package on package structure and method of manufacturing the same
Grant 9,230,935 - Lin , et al. January 5, 2 | 2016-01-05 |
Reflow Process and Tool
App 20150249062 - Ang; Ai-Tee ; et al. | 2015-09-03 |
Semiconductor Packaging And Manufacturing Method Thereof
App 20150145130 - LIN; HSIU-JEN ; et al. | 2015-05-28 |
Package on Package Structure and Method of Manufacturing the Same
App 20150108638 - Lin; Chun-Cheng ; et al. | 2015-04-23 |
Method for wafer separation
Grant 8,987,058 - Tsai , et al. March 24, 2 | 2015-03-24 |
Interconnect Structure And Method Of Fabricating Same
App 20150014851 - Lu; Wen-Hsiung ; et al. | 2015-01-15 |
Package on package structure and method of manufacturing the same
Grant 8,901,726 - Lin , et al. December 2, 2 | 2014-12-02 |
Method and Apparatus for Localized and Controlled Removal of Material from a Substrate
App 20140273499 - Huang; Hui-Min ; et al. | 2014-09-18 |
Apparatus and Method for Wafer Separation
App 20140264885 - Tsai; Yu-Peng ; et al. | 2014-09-18 |
Interconnect Joint Protective Layer Apparatus and Method
App 20140231125 - Chen; Cheng-Ting ; et al. | 2014-08-21 |
System and Method for an Improved Fine Pitch Joint
App 20140187103 - Chen; Cheng-Ting ; et al. | 2014-07-03 |
Package On Package Structure And Method Of Manufacturing The Same
App 20140159233 - Lin; Chun-Cheng ; et al. | 2014-06-12 |
System and Method for Fine Pitch PoP Structure
App 20140151878 - Lin; Cheng-Chung ; et al. | 2014-06-05 |
Plasma Treatment for Semiconductor Devices
App 20140131861 - Lu; Chen-Fa ; et al. | 2014-05-15 |
System and method for fine pitch PoP structure
Grant 8,674,496 - Lin , et al. March 18, 2 | 2014-03-18 |
System And Method To Reduce Pre-back-grinding Process Defects
App 20140039661 - LU; Chen-Fa ; et al. | 2014-02-06 |
Warpage Control in the Packaging of Integrated Circuits
App 20140027431 - Cheng; Ming-Da ; et al. | 2014-01-30 |
Plasma treatment for semiconductor devices
Grant 8,629,053 - Lu , et al. January 14, 2 | 2014-01-14 |
Stud Bump Structure For Semiconductor Package Assemblies
App 20130285238 - CHEN; Meng-Tse ; et al. | 2013-10-31 |
System and method to reduce pre-back-grinding process defects
Grant 8,571,699 - Lu , et al. October 29, 2 | 2013-10-29 |
System and Method for Fine Pitch PoP Structure
App 20130214401 - Lin; Cheng-Chung ; et al. | 2013-08-22 |
Semiconductor Packaging Structure and Method
App 20130187268 - Lin; Chun-Cheng ; et al. | 2013-07-25 |
Method Of Processing Solder Bump By Vacuum Annealing
App 20130143364 - LIN; Hsiu-Jen ; et al. | 2013-06-06 |
Methods for Performing Reflow in Bonding Processes
App 20130122652 - Lin; Hsiu-Jen ; et al. | 2013-05-16 |
Methods for performing reflow in bonding processes
Grant 8,440,503 - Lin , et al. May 14, 2 | 2013-05-14 |
Semiconductor Package Having Solder Jointed Region With Controlled Ag Content
App 20130099371 - CHENG; Ming-Da ; et al. | 2013-04-25 |
System And Method To Reduce Pre-back-grinding Process Defects
App 20120065764 - LU; Chen-FA ; et al. | 2012-03-15 |
Plasma Treatment for Semiconductor Devices
App 20110309490 - Lu; Chen-Fa ; et al. | 2011-12-22 |
Car Poster that Changes Display Contents
App 20090134984 - Chen; Cheng-Ting | 2009-05-28 |
Method and system for making p-type transparent conductive films
App 20040123802 - Huang, Chorng-Jye ; et al. | 2004-07-01 |
Solar cell substrate with thin film polysilicon
Grant 6,692,985 - Huang , et al. February 17, 2 | 2004-02-17 |
Solar cell substrate with thin film polysilicon
App 20020185171 - Huang, Chorng-Jye ; et al. | 2002-12-12 |
Method for fabricating solar cells
Grant 6,277,667 - Huang , et al. August 21, 2 | 2001-08-21 |
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